I’ll proceed with post-substitution layout cleanup, then route the PCB and run DRC/airwire checks. I’ll keep this to the routing phase and report any manufacturing blockers separately.
Routed the PCB: auto-routing completed and added 558 trace/via nodes while preserving the portrait board, centered vertical display stack, and isolated magnetometer placement.
Open blocker:
The board is not yet JLC-ready because U3’s STM32 footprint has duplicate exposed-pad thermal sub-pads overlapping the grounded center pad. Final checks show 9 overlapping-copper errors and 1 remaining GND airwire, all tied to that U3 footprint issue.
Suggested next steps:
Replace/correct U3’s footprint with a clean STM32L031 UFQFPN/QFN-32 exposed-pad footprint.
Re-run DRC and route cleanup after the footprint fix.
Re-check JLC/LCSC BOM status before manufacturing export.