Implemented the complete schematic and BOM draft for the stereo DSP amplifier, without PCB placement or routing. Electrical ERC is clean; the remaining BOM/manufacturing issue is that generic passives, inductors, test points, and attenuation headers still need final orderable MPN/package selections before manufacturing.
Created/updated project files:
Open items:
- Select final MPNs/packages for generic resistors, capacitors, inductors, test points, and jumper headers.
- Verify the PCM1863DBT footprint pitch against TI’s DBT TSSOP-30 land pattern before layout.
- Add final TI register configurations for PCM1863 and TAS5825M firmware.
Suggested next steps:
- Finalize passive/inductor/test-point MPNs to make the BOM manufacturing-ready.
- Review the schematic visually for signal-flow readability.
- Set the 150 mm × 150 mm four-layer board, stackup, and placement constraints.
- Start PCB placement only after you approve the schematic.