Rev B POC Module Design


Add the remaining power-entry protection, replace the connector/jumper placeholders, update docs, and rerun ERC.
I’ll add the remaining input/output protection parts, replace the backplane and CAN termination placeholders with closer exact parts if available, update the power/CAN docs, then rerun ERC.
I’m blocked because the account has no available ACUs, so I can’t continue editing the schematic or running ERC right now.
Accomplished in this session:
  • Acknowledged the requested scope.
  • Set up the work plan for:
    • finding replacement parts for J_BP1 and J_CAN_TERM,
    • adding power-entry protection,
    • wiring the protected rails,
    • updating docs,
    • rerunning ERC.
Remaining work:
  • Replace J_BP1 with the exact Phoenix MC 1,5/10 3.81 mm backplane connector or best verified equivalent.
  • Replace J_CAN_TERM with an exact 2-pin jumper/header.
  • Add and wire remaining power-entry protection:
    • reverse-polarity protection,
    • PTC/fuse on +24V_LOGIC,
    • input TVS,
    • output-bank fuse on +24V_OUT_EN,
    • any required bulk/input capacitors.
  • Update the CAN/power sheet documentation and locked BOM notes.
  • Rerun ERC and resolve any actionable warnings/errors once ACUs are available.
Check ACU options
List protection parts
Show protection wiring
Draft documentation
Manual update package

U_LDO1
U6
U_MCU1
C_CAN1
Capacitance
100nF
C_DIF_DI2
Capacitance
10nF
C_DIF_DI1
Capacitance
10nF
C_BUCK_OUT1
End of Life
Capacitance
22uF
C_MCU_DEC3
Capacitance
100nF
C_LDO_IN
Capacitance
1.0uF
C_BUCK_IN2
Capacitance
4.7uF
C_DIF_DI4
Capacitance
10nF
C_MCU_DEC2
Capacitance
100nF
C_NRST
Capacitance
100nF
C_CS
Capacitance
10nF
C_DIF_DI3
Capacitance
10nF
C_BUCK_OUT2
End of Life
Capacitance
22uF
C_LDO_OUT
Capacitance
1.0uF
C_BOOT1
Capacitance
100nF
C_MCU_DEC1
Capacitance
100nF
C_BUCK_IN1
Capacitance
4.7uF
R_BUCK_EN
Resistance
100kΩ
R_DI4
Resistance
4.7kΩ
R_DIF_DI3
Resistance
100Ω
R_NRST_PU
Resistance
10kΩ
R_DI1_PU
Resistance
10kΩ
R_PD_DO3
Resistance
100kΩ
R_DI2_PU
Resistance
10kΩ
R_BUCK_FB_BOT
Resistance
10kΩ
R_DI2
Resistance
4.7kΩ
R_BOOT0_PD
Resistance
10kΩ
R_CAN_TERM
Resistance
120 Ω
R_CL
Resistance
800Ω
R_ADDR3_PU
Resistance
10kΩ
R_LED_DI2
Resistance
4.7kΩ
R_BUCK_PG
Resistance
100kΩ
R_DI1
Resistance
4.7kΩ
R_DI3_PU
Resistance
10kΩ
R_DI3
Resistance
4.7kΩ
R_DO4
Resistance
10kΩ
R_CS
Resistance
1kΩ
R_ADDR2_PU
Resistance
10kΩ
R_LED_DO4
Resistance
10kΩ
R_DI4_PU
Resistance
10kΩ
R_LED_DI3
Resistance
4.7kΩ
R_PD_DO1
Resistance
100kΩ
R_PD_DO2
Resistance
100kΩ
R_LED_DI4
Resistance
4.7kΩ
R_DIF_DI1
Resistance
100Ω
R_MODULE_PRESENT
Resistance
10kΩ
R_LED_DO2
Resistance
10kΩ
R_DIF_DI2
Resistance
100Ω
R_LED_DO3
Resistance
10kΩ
R_ADDR0_PU
Resistance
10kΩ
R_PD_DO4
Resistance
100kΩ
R_BUCK_FB_TOP
Resistance
56.2kΩ
R_DIF_DI4
Resistance
100Ω
R_DO1
Resistance
10kΩ
R_BUCK_RT
Resistance
6.34kΩ
R_FAULT_PU
Resistance
10kΩ
R_DO2
Resistance
10kΩ
R_ADDR1_PU
Resistance
10kΩ
R_LED_DI1
Resistance
4.7kΩ
R_LED_DO1
Resistance
10kΩ
R_DO3
Resistance
10kΩ
D_TVS_DI3
D_DI3_REV
J_CAN_TERM
D_TVS_DI2
D_TVS_DI1
D_DI4_REV
D_DI1_REV
D_TVS_DI4
J_SWD
D_DI2_REV
U_CAN1
LED_DI3
U_DI1
LED_DO4
U_BUCK1
LED_DI1
LED_DO2
LED_DO3
LED_DO1
LED_DI2
LED_DI4
D_TVS_DO3
Not Recommended for New Designs
D_CAN_ESD
D_TVS_BANK
Not Recommended for New Designs
L_BUCK1
Inductance
33uH
SW_ADDR
J_DO
D_TVS_DO4
Not Recommended for New Designs
D_TVS_DO1
Not Recommended for New Designs
D_TVS_DO2
Not Recommended for New Designs
J_DI
J_BP1
Project Specification — Open Modular UNO-Q PLC Rev B
Status: Design decisions locked; verification and capture in progress
Revision: Rev B
Primary architecture: Open Modular UNO-Q PLC
Explicit scope note: This project is for the Open Modular UNO-Q PLC Rev B architecture only. It is not the USB-C Wi-Fi/BLE environmental sensor project.
1. Project Overview
Design and build an open, DIN-rail-mounted, modular PLC system based around the Arduino UNO Q. The system uses the UNO Q as the CPU/HMI/edge-compute controller and uses CAN bus for modular I/O expansion.
The architecture is original and open. It is not intended to clone Allen-Bradley, Siemens, or any other vendor, though it intentionally uses common industrial control design patterns.
Current Rev B status: the core design decisions are locked. Remaining work is verification, KiCad capture, bench validation, firmware preparation, and first-board bring-up.
2. Intended Use
Target applications include:
  • Plumbing pump panels
  • Float switch control
  • Greenhouse automation
  • Mushroom grow rooms
  • Irrigation control
  • Aircrete/geopolymer process skids
  • Small test stands
  • Pneumatic machines
  • Heating/cooling experiments
  • VFD control
  • Sensor logging
  • Shop automation
  • Training ladder logic
This system is not a certified safety PLC and is not a direct replacement for industrial safety systems.
3. What the System Should Do
  • Run OpenPLC / IEC-style ladder logic control.
  • Maintain a PLC-style process image table.
  • Communicate with modular I/O nodes over CAN.
  • Provide protected 24 VDC digital outputs.
  • Read opto-isolated 12/24 V digital inputs.
  • Support relay outputs for dry-contact and heavier interface commands.
  • Support protected analog input and output modules.
  • Provide web dashboard, configuration, logging, alarm history, and service access through the UNO Q Linux side.
  • Keep real-time I/O scan and output control under the UNO Q STM32 real-time side.
  • Fail outputs OFF unless CPU and module watchdogs are healthy.
4. Main Features
  • Arduino UNO Q CPU / HMI / edge-compute controller
  • OpenPLC runtime and management layer
  • CAN-based modular I/O expansion
  • Local microcontroller on each I/O module
  • 24 VDC field power distribution
  • Opto-isolated digital inputs
  • Smart high-side protected outputs
  • Mechanical relay outputs with dry contacts
  • Protected 0–10 V / 4–20 mA analog inputs
  • Protected 0–10 V analog outputs
  • Per-channel LEDs and module fault/status LEDs
  • Removable screw terminals
  • Module ID / address setting
  • Watchdog and failsafe behavior
  • 3D-printed DIN-rail housings
  • KiCad as the production PCB design tool
  • Fritzing only for wiring diagrams and educational documentation
5. System Architecture
The PLC is modular rather than one large Arduino shield.

Diagram


"UNO Q CPU Module<br/>Linux + STM32<br/>OpenPLC / HMI<br/>CAN master" "CAN / 24 V Bus<br/>24V, node_0V, CANH, CANL,<br/>Shield, Present, Sync" "16DI Opto Module<br/>12/24 V inputs" "8DO-HS Module<br/>Smart high-side outputs" "8RLY Module<br/>Dry contacts" "4AI Module<br/>0-10 V / 4-20 mA" "4AO Module<br/>0-10 V outputs"
Each I/O module includes:
  • Local microcontroller
  • CAN transceiver
  • 24 V power input from the backplane
  • Field-side protection
  • Per-channel LEDs
  • Removable screw terminals
  • Module ID / address setting
  • Watchdog/failsafe behavior
6. Hardware Subsystems
6.1 CPU / Power Module
Core features:
  • Arduino UNO Q
  • 24 VDC power input
  • Main fuse
  • Reverse-polarity protection
  • TVS surge protection
  • EMI filtering
  • 5 V regulator for UNO Q
  • CAN transceiver
  • RS-485 transceiver
  • Watchdog relay or watchdog output
  • Service USB-C access
  • System status LEDs
  • DIN-rail housing
Locked Rev B CPU/power direction:
  • CPU module: OMUPLC-CPU-POWER-UNOQ-RevB.
  • 24 V input protection: FDD5614P reverse-polarity MOSFET, SMBJ33A TVS, Littelfuse 8 A protection.
  • 5 V CPU rail: TPS54360B 3.5 A buck plus 1812L300 PTC.
  • UNO Q 5 V input path uses the confirmed UNO Q 5 V header/power input approach from the Rev B schematic-entry notes.
The CPU module must not feed dirty panel power directly into the UNO Q without protection.
6.2 16DI Opto-Isolated Digital Input Module
Purpose:
  • Float switches
  • Limit switches
  • Pushbuttons
  • Pressure switches
  • Proximity sensors
  • Leak sensors
  • Door switches
  • Selector switches
Each channel field path:

Text


INx terminal -> current-limiting resistor -> RC filter -> opto-isolator LED -> COM terminal
Each channel logic path:

Text


3.3 V pullup -> local MCU input -> opto transistor to logic ground
Features:
  • 16 opto-isolated 12/24 V digital inputs
  • Per-channel status LED
  • Hardware filtering
  • Software debounce
  • Input inversion setting
  • Common terminal grouping
  • CAN status reporting
Rev B proof-of-concept uses the 4DI portion of the combo module before expanding to full 16DI.
6.3 8DO Smart High-Side Output Module
Purpose:
  • 24 VDC solenoid valves
  • Pneumatic valve manifolds
  • Relay coils
  • Small contactor coils
  • Indicator lamps
  • Buzzers
  • Small DC loads within rating
Output wiring:

Text


24 V FIELD+ -> smart high-side switch -> OUTx terminal -> load -> 0 V COM
Features:
  • 8 protected sourcing outputs
  • Smart high-side switch ICs
  • Short-circuit protection
  • Overcurrent protection
  • Thermal shutdown
  • Inductive load protection
  • Open-load or current-sense diagnostics where available
  • Per-channel LED
  • Fault LED
  • Output bank fuse
  • Watchdog-controlled output enable
Default behavior:
  • No firmware: outputs OFF
  • Booting: outputs OFF
  • CAN timeout: outputs OFF
  • Watchdog expired: outputs OFF
  • Overcurrent: affected channel OFF plus fault
  • Output power lost: fault reported
Rev B proof-of-concept uses the 4DO-HS portion of the combo module before expanding to full 8DO-HS.
6.4 8RLY Relay Output Module
Purpose:
  • Dry contacts
  • AC control circuits
  • VFD run/stop inputs
  • Thermostat-style contacts
  • Contactor commands
  • Odd-voltage equipment interfaces
  • Heavier I/O interfacing through external contactors or starters
Each relay channel:

Text


local MCU output -> driver transistor or relay driver IC -> 24 V relay coil -> flyback diode or TVS
Contact side:
  • COM
  • NO
  • NC
Recommended design:
  • 8 mechanical relays
  • 24 VDC relay coils
  • COM / NO / NC terminals where space allows
  • Isolation slots between coil/logic and contact side
  • MOV or snubber footprints for inductive loads
  • Per-relay LED
  • Replaceable relay module option if possible
Important rule: onboard relays should command contactors, starters, SSRs, or VFDs for heavy loads. They should not directly switch large pumps, compressors, heaters, or motors.
6.5 4AI Analog Input Module
Purpose:
  • Pressure transmitters
  • Tank level sensors
  • Flow transmitters
  • Temperature transmitters
  • VFD feedback
  • Current sensors
Each channel selectable:
  • 0–10 V mode
  • 4–20 mA mode
4–20 mA conversion uses a 150 ohm precision resistor:

Table


CurrentSense Voltage
4 mA0.6 V
20 mA3.0 V
Features:
  • 4 protected analog inputs
  • 0–10 V / 4–20 mA mode selection
  • Input TVS protection
  • RC filtering
  • Precision shunt resistors
  • Dedicated ADC preferred
  • Calibration values stored in module memory
  • Broken-wire detection for 4–20 mA where possible
6.6 4AO Analog Output Module
Purpose:
  • VFD speed reference
  • Proportional valve control
  • Damper actuator control
  • Setpoint output
  • 0–10 V process control
Architecture:

Text


local MCU -> DAC -> op-amp gain stage -> protected 0–10 V output
Features:
  • 4 analog outputs
  • 0–10 V range
  • Protected outputs
  • Calibration constants
  • Output disable on watchdog fault
  • Optional manual override in later revision
7. Interfaces and Connections
CAN Bus Backplane Connector
Minimum bus connector pinout:

Table


PinSignal
1+24 V FIELD
20 V FIELD
3CANH
4CANL
5SHIELD / CHASSIS
6MODULE_PRESENT
7SYNC / IRQ
8RESERVED
Locked Rev B interface decisions:
  • Initial CAN bitrate: 250 kbit/s.
  • Later CAN bitrate target after signal-integrity verification: 500 kbit/s.
  • Backplane connector family: Phoenix MC 1,5/10-G-3,81.
  • Field terminals: Phoenix MKDS family.
  • DO terminals: Phoenix MSTBA family.
CAN is preferred over raw GPIO or I2C because it is noise tolerant, supports multiple nodes, includes arbitration, is common in industrial/vehicle systems, works over short DIN-rail module distances, and allows smart addressable modules.
Each module should include:
  • CAN transceiver
  • Termination jumper
  • Address DIP switches or rotary switch
  • Module type ID
  • Firmware version register
  • Watchdog timeout
  • Fault reporting
First implementation may use short jumper cables between modules. Later versions may use a passive DIN-rail backplane PCB.
Service / External Interfaces
  • USB-C service access on the UNO Q module
  • Wi-Fi / network access through UNO Q
  • RS-485 transceiver on CPU module
  • Removable field screw terminals on I/O modules
  • Chassis/shield connection on backplane
8. Power and Runtime Expectations
Primary system input is 24 VDC panel/field power. The system is expected to run from industrial 24 VDC supplies rather than battery power.
Key expectations:
  • CPU module accepts protected 24 VDC input.
  • +24 V FIELD BUS is distributed to modules.
  • Buck converter generates 5 V BOARD / UNO Q supply.
  • Output modules switch and protect 24 V field loads.
  • Safety relay / contactor should remove output power from smart-output and relay-coil banks during safety stop.
9. Power Tree and Power Budget
Power tree:

Diagram


"24 VDC IN" "Main fuse" "Reverse-polarity MOSFET" "TVS surge protection" "EMI filter" "+24 V FIELD BUS" "Buck converter" "5 V BOARD / UNO Q" "Output banks / field loads" "I/O module power inputs"
Locked Rev B power budget/protection direction:
  • Combo module 5 V buck: LM5164, 1 A class design.
  • CPU module 5 V buck: TPS54360B, 3.5 A class design.
  • 24 V input protection and 5 V rail protection are already defined in the Rev B locked design package.
  • Detailed per-module current and thermal checks remain part of verification, not architecture selection.
10. Process Image Model
The CPU maintains:

Text


Digital Inputs: DI[0..255] Digital Outputs: DO[0..255] Relay Outputs: RLY[0..127] Analog Inputs: AI[0..63] Analog Outputs: AO[0..63] Faults: MODULE_FAULT[], CHANNEL_FAULT[], WATCHDOG_FAULT[], OVERCURRENT[], OPEN_LOAD[], OVERTEMP[]
PLC scan cycle:
  1. Poll input modules
  2. Update input image table
  3. Run OpenPLC logic
  4. Update output image table
  5. Send output commands to modules
  6. Read diagnostics and faults
  7. Log events
  8. Repeat
Outputs default OFF unless CPU and module watchdogs are healthy.
11. Firmware-Relevant Hardware Requirements
UNO Q Responsibility Split
Linux side:
  • OpenPLC runtime / management layer
  • Dashboard
  • Data logging
  • Alarm history
  • Configuration files
  • MQTT / network services
  • Camera / AI / advanced diagnostics later
STM32 real-time side:
  • PLC scan loop
  • CAN module polling
  • I/O update
  • Watchdog
  • Failsafe output control
  • Timing-critical logic
The Linux side should not directly drive output pins. The real-time MCU side should own actual I/O scan and output state.
CAN Protocol Draft
Each module announces itself:

Text


MODULE_HELLO: module_type module_address firmware_version channel_count serial_number
CPU polls inputs:

Text


INPUT_STATUS: module_address input_bitmap fault_bitmap
CPU commands outputs:

Text


OUTPUT_COMMAND: module_address output_bitmap enable_mask
Module reports diagnostics:

Text


DIAGNOSTIC_STATUS: module_address channel_faults overcurrent_flags overtemp_flags open_load_flags supply_voltage
Watchdog:

Text


WATCHDOG_HEARTBEAT: cpu_alive scan_counter
If watchdog messages stop, output modules disable their outputs.
Firmware preparation items that can start before PCB completion:
  • OpenPLC Linux-side CAN hardware layer using SocketCAN or USB-CAN during development.
  • STM32G0B1 CAN module process-image exchange firmware.
  • TPS274160B SPI diagnostic/output driver after register-map extraction.
  • Optional RP2040 motion coprocessor command-parser and PIO step-pulse skeleton for future motion experiments.
12. Multiplexing / Demultiplexing Strategy
I/O may be multiplexed and expanded, but not blindly.
Recommended expansion methods:
  • Digital inputs: opto outputs to local MCU GPIO or SPI I/O expander. Acceptable because digital inputs are slow.
  • Digital outputs: use latched outputs, not glitchy demultiplexers.
  • Relay outputs: use local MCU to relay driver IC/MOSFETs, or shift register/latch to relay drivers.
  • Analog inputs: multiplexing is acceptable for slow process signals, but a dedicated multi-channel ADC is preferred.
Every digital output input pin needs:
  • Pull-down resistor
  • Watchdog enable
  • Known OFF state during boot
  • Output enable line
Do not multiplex safety-critical functions, including:
  • E-stop
  • Safety interlocks
  • Motor overload trips
  • Emergency pump cutoffs
  • Safety gates
  • Anything that can injure someone or destroy equipment
Safety-critical circuits should be hardwired.
13. Safety Architecture
The PLC is not the safety system.
Use a hardwired safety chain:

Diagram


"E-stop" "Safety relay or contactor circuit" "Remove output power from smart-output and relay-coil banks" "PLC reads SAFETY_OK input"
Normal control is performed by the UNO Q PLC. Safety stop is enforced by the hardwired safety relay / contactor.
14. Software Architecture
OpenPLC layer:
  • Ladder logic
  • Structured Text
  • Function Block Diagram
  • Basic PLC scan behavior
  • User-facing control logic
Firmware layer:
  • CAN module protocol
  • Process image exchange
  • Module discovery
  • Watchdog handling
  • Smart output diagnostics
  • Analog calibration
  • Fault reporting
  • Safe output shutdown
Dashboard layer:
  • Web dashboard
  • Alarm log
  • Data logging
  • Configuration
  • Manual test mode
  • Calibration screens
  • MQTT / Home Assistant integration later
  • AI/camera tools later
15. Physical Design Expectations
Mechanical design uses:
  • 35 mm DIN rail
  • 3D-printed module shells
  • PETG or ASA preferred over PLA
  • Removable terminal blocks
  • Label strips
  • LED windows or light pipes
  • Side bus connector cover
  • Ventilation slots
  • Mounting holes for PCB screws
  • Field wiring separated from logic wiring
Suggested module widths:

Table


ModuleWidth
CPU module70–90 mm
16DI module45–70 mm
8DO-HS module45–70 mm
8RLY module70–90 mm
4AI module45–70 mm
4AO module45–70 mm
COMMS module35–45 mm
Rev B first-article PCB outline target: 70 mm × 90 mm for both the CPU/power module and the combo module unless enclosure CAD forces a revision.
Relay modules need extra spacing for contact terminals, isolation, and heat.
16. PCB Design Workflow
Use KiCad for production design.
Suggested KiCad projects:
  • OMUPLC_CPU_POWER_UNOQ_RevB
  • OMUPLC_COMBO_4DI_4DO_HS_RevB
  • OMUPLC_16DI_RevB
  • OMUPLC_8DO_HS_RevB
  • OMUPLC_8RLY_RevB
  • OMUPLC_4AI_RevB
  • OMUPLC_4AO_RevB
  • OMUPLC_BACKPLANE_RevB
Use Fritzing only for:
  • Wiring diagrams
  • Training drawings
  • Social/documentation graphics
  • Field connection examples
Combo module capture order:
  1. 01_BACKPLANE_AND_POWER_ENTRY
  2. 02_LM5164_5V_BUCK
  3. 03_TLV75533_3V3_LDO
  4. 04_STM32G0B1_MCU_CORE
  5. 05_STM32G0B1_GPIO_MAP
  6. 06_TCAN332_CAN_INTERFACE
  7. 07_ADDRESS_DIP_AND_SWD
  8. 08_TLP293_4_DIGITAL_INPUTS
  9. 09_TPS274160B_HIGH_SIDE_OUTPUTS
  10. 10_TERMINALS_LEDS_TESTPOINTS
  11. 11_WATCHDOG_FAILSAFE
  12. 12_MECHANICAL_AND_DIN_OUTLINE
CPU/power module capture order:
  1. 01_24V_INPUT_PROTECTION
  2. 02_TPS54360B_5V_CPU_BUCK
  3. 03_ARDUINO_UNO_Q_HEADERS
  4. 04_TCAN332_CPU_CAN_DRIVER
  5. 05_SAFETY_OUTPUT_POWER_ENABLE
  6. 06_BACKPLANE_CONNECTOR
  7. 07_STATUS_LEDS_AND_POWER_SENSING
  8. 08_MECHANICAL_AND_DIN_OUTLINE
Four-layer PCB stackup target:
  • Layer 1: signal + components
  • Layer 2: continuous GND plane
  • Layer 3: +24 V / +5 V power planes
  • Layer 4: signal + bottom components
17. Manufacturing and Assembly Expectations
  • DIN-rail-mounted modular system.
  • 3D-printed shells for early revisions.
  • PETG or ASA preferred for enclosure material.
  • Removable terminal blocks for field wiring.
  • Field wiring separated from logic wiring.
  • Relay contact areas need isolation spacing/slots appropriate to the intended external circuits.
  • Test points should be added for power rails, CAN, watchdog, key MCU signals, and representative I/O channels.
  • KiCad is the main PCB design tool; Flux project documentation should stay aligned with KiCad implementation decisions.
  • First board fab target after schematic capture, layout, DRC, footprint verification, and reverse-polarity bench verification.
18. Rev B Minimum Build
The Rev B minimum build target is the OMUPLC-CPU-POWER-UNOQ-RevB CPU/power module plus the OMUPLC-COMBO-4DI-4DO-HS-RevB proof-of-concept combo module.
Build these first:
  1. OMUPLC-CPU-POWER-UNOQ-RevB CPU / Power Module
  2. OMUPLC-COMBO-4DI-4DO-HS-RevB 4DI / 4DO-HS Combo Test Module
  3. CAN jumper/backplane cable
  4. Simple OpenPLC test program
  5. 3D-printed DIN-rail shells
The combo test module proves:
  • CAN bus
  • Module addressing
  • Opto input reading
  • Smart output switching
  • Watchdog shutdown
  • Fault reporting
  • DIN enclosure fit
  • Terminal layout
  • OpenPLC integration
After validation, expand to full modules:
  • 16DI
  • 8DO-HS
  • 8RLY
  • 4AI
  • 4AO
19. Locked Design Decisions
The following Rev B design inputs are locked and should not be reopened unless a verification task fails:

Table


Design areaLocked decision
Minimum buildCPU/power module + 4DI/4DO-HS combo test module
CAN bitrate250 kbit/s initial; 500 kbit/s after SI verification
Backplane connectorPhoenix MC 1,5/10-G-3,81
Field terminalsPhoenix MKDS family
DO terminalsPhoenix MSTBA family
Combo buckLM5164, 1 A class design
CPU buckTPS54360B, 3.5 A class design
24 V protectionFDD5614P reverse-polarity MOSFET + SMBJ33A TVS + 8 A protection
5 V CPU rail protectionTPS54360B buck + 1812L300 PTC
Mechanical module format35 mm DIN rail, PETG/ASA 3D printed shells
First-article outline70 mm × 90 mm CPU and combo modules
Production PCB toolKiCad
Documentation wiring toolFritzing only for wiring/training diagrams
20. Remaining Verification and Capture Tasks
All remaining Rev B open items are verification or capture tasks. There are no remaining architecture decisions.

Table


#TaskTypeAction / exit criterion
1TPS274160BRLHR KiCad footprintVerification + captureDownload TI PAKC014A; verify exposed-pad dimensions; create or confirm QFN-28 footprint in KiCad.
2STM32G0B1CBT6 FDCAN1 alternate-function pin mappingDatasheet readRead STM32G0B1 datasheet/reference tables; assign PA8/PA9 or the correct FDCAN1_TX/RX pins in Sheet 02/04.
3TLP293-4 SO-16 per-channel pin orderDatasheet readRead Toshiba TLP293-4 pinout; confirm anode/cathode/collector/emitter row assignment; populate digital input sheet.
4TPS274160BRLHR SPI register mapDatasheet readRead TI TPS274160B register section; extract CPOL/CPHA, output command register, CS/diagnostic register format for firmware.
5Reverse-polarity bench verificationPre-fab bench testBreadboard AO3401A + BZX84-C10 on 24 V bench supply; verify gate clamping under forward and reverse polarity before PCB fab.
6TPS274160B thermal verificationPost-build bench testRun 0.5 A/channel continuous in closed 3D-printed enclosure; measure exposed-pad temperature rise after first board is assembled.
21. Assumptions
  • Primary field/control supply is nominal 24 VDC.
  • UNO Q is the selected CPU platform.
  • Initial hardware is prototype/validation intent, not certified industrial product.
  • CAN bus distances are short within DIN-rail module assemblies for Rev B.
  • Locked design decisions may only change if a verification task identifies a concrete electrical, thermal, mechanical, availability, or safety issue.
22. Change Notes
  • Created initial Rev B project specification from the supplied Open Modular UNO-Q PLC Design Proposal.
  • Explicitly scoped the project to the Open Modular UNO-Q PLC Rev B architecture and excluded the unrelated USB-C environmental sensor project.
  • Updated Rev B status from open architecture exploration to locked design decisions with six remaining verification/capture tasks.
  • Added locked connector, CAN bitrate, power/protection, module-build, KiCad capture, stackup, and first-article mechanical targets from the project status bridge.
  • 1. Project Overview

  • 2. Intended Use

  • 3. What the System Should Do

  • 4. Main Features

  • 5. System Architecture

  • 6. Hardware Subsystems

  • 6.1 CPU / Power Module

  • 6.2 16DI Opto-Isolated Digital Input Module

  • 6.3 8DO Smart High-Side Output Module

  • 6.4 8RLY Relay Output Module

  • 6.5 4AI Analog Input Module

  • 6.6 4AO Analog Output Module

  • 7. Interfaces and Connections

  • CAN Bus Backplane Connector

  • Service / External Interfaces

  • 8. Power and Runtime Expectations

  • 9. Power Tree and Power Budget

  • 10. Process Image Model

  • 11. Firmware-Relevant Hardware Requirements

  • UNO Q Responsibility Split

  • CAN Protocol Draft

  • 12. Multiplexing / Demultiplexing Strategy

  • 13. Safety Architecture

  • 14. Software Architecture

  • 15. Physical Design Expectations

  • 16. PCB Design Workflow

  • 17. Manufacturing and Assembly Expectations

  • 18. Rev B Minimum Build

  • 19. Locked Design Decisions

  • 20. Remaining Verification and Capture Tasks

  • 21. Assumptions

  • 22. Change Notes