Hardware Architecture Review
Thought for 43 sec
I inspected the current layout and BOM. The project contains 33 placed schematic components (20 unique part types), but the PCB is still the default 160 × 100 mm, 4-layer rectangle; it has not yet been converted to the approved 60 mm circular 6-layer board or physically placed.
I could not perform the board resize, placement, or generate a downloadable BOM because there are currently no available ACUs.
Current part list
- RK3566 SoC — U1
- RK809-5 PMIC — U2
- Micron MT41K256M16TW-107 DDR3L — U3
- Samsung KLM8G1GETF-B041 8 GB eMMC — U4
- USB4215-03-A USB-C receptacle — J1
- MP5036AGJ-Z input eFuse — U5
- USBLC6-2SC6 USB ESD protection — D1
- INMP441 I²S microphone — M1
- MAX98357A Class-D amplifier — U6
- JST B2B-PH-K-S 2-pin speaker connector — J2
- 74AHCT1G125 WS2812 level shifter — U7
- U.FL-R-SMT-1 antenna connector — J3
- 1×8 display header — J4
- 1×3 LED-ring header — J5
- DPDT privacy switch — SW1
- Four TS04 tactile switches — S1–S4
- Keystone 3000 RTC coin-cell holder — BT1
- ABS06 32.768 kHz RTC crystal — X1
- Eight generic capacitors — C1–C8
- Four generic resistors — R1–R4
Remaining work
- Resize to the approved 60 mm circular, 6-layer board.
- Place all 33 parts with connector access, RF clearance, and power/DDR considerations.
- Produce the finalized BOM with values, footprints, and manufacturer ordering fields.
Check BOM details
Prepare placement plan
Review circuit readiness
Document board constraints
