Chamber I/O Master Design
0:07
Work done
- Re-validated Board A3 before routing and confirmed the board remains 120 mm × 80 mm, 2-layer, with the display/interface area on top and controls on the bottom.
- Per the routing cleanup flow, I checked for blocking issues before attempting airwire remediation and then re-validated afterward; this follows the required pre-route cleanup and fix-verify pattern for airwire remediation .
- I optimized the placement around the congested U1 / LCD / SWD / Board-B connector areas to improve routeability without changing the board size or stackup.
- Full details are recorded in Board A3 Routing Attempt Status.
- ❌ All 62 airwires routed: not achieved; final validation still reports 62 airwires.
- ✅ No new targeted non-airwire errors: no overlapping-copper, dangling-trace, under-connected-via, overlapping-trace, floating-copper, floating-pin, or duplicate-reference findings appeared in the final targeted review.
- ✅ Board setup preserved: 120 mm × 80 mm, 2-layer stackup remains intact.
- ✅ Placement intent preserved: display/interface remains in the top half and controls remain in the bottom half.
The board is still too congested to complete clean routing under the current 2-layer / 120 mm × 80 mm constraints. The remaining congestion is concentrated around U1–J_LCD1–J_SWD1–J_B2B1; next practical fixes are moving the SWD/Board-B connector corridor farther from U1, allowing bottom-side small passives, or relaxing to 4 layers.
Move congested connectors
Allow bottom passives
Evaluate 4-layer option
List remaining nets
Optimize critical placement
a day
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