I was unable to continue the implementation because execution credits are currently exhausted. Before stopping, I retrieved the current schematic state, confirmed the power-input subsystem initially had no nets, found/selected library parts for the required power components, replaced the placeholder reverse-protection MOSFET with Q_PWR / DMP3056L-7, and added the required non-generic power parts: D_ZG 10V Zener, D_SW SS34 catch diode, L1 10uH buck inductor, FB_5VA and FB_3V3A ferrite beads, and D_PWR LTST-C190KGKT power LED. Several required passives already appear to exist or were partially added, including the feedback/compensation/gate/LDO resistors and buck/input capacitors, but the subsystem is not yet wired and no schematic review could be run. Remaining work: verify all passive values, add any missing LDO/analog-filter capacitors, wire the +24V input chain, TPS54331, AP2112K-3.3, analog rail filters, and power-good LED, then run a scoped POWER INPUT schematic review for floating pins and missing power nets only.
I’m unable to continue executing the remaining schematic changes because the session can no longer perform project-modification actions. So far, I replaced the placeholder MOSFET with Q1 DMP3056L-7, renamed the Phoenix input connector to J_PWR, and added the required POWER INPUT support parts for the +24V chain, TPS54331 buck, AP2112K LDO, analog rail ferrite filters, and +3V3 power-good LED. Wiring, no-connect marking for unused pins, and the final targeted schematic review still remain to be completed.
Board A is the per-channel low-voltage controller PCB for a PV module test power supply supporting TC/HF/LeTID workflows per IEC 61215 and IEC TS 63342. This PCB commands a separate isolated power stage and senses the DUT; the high-power isolated stage is not implemented on this board.
Initial Implementation Focus
Hierarchical block diagram and signal/power flow.
Power-input, protection, regulation, and STM32H743 MCU core schematic.
Sourcing notes for parts available from Mouser/Digi-Key India where library availability metadata is present.
Hierarchical Architecture
Diagram
Grounding and Layout Requirements
Board target: 100 mm x 80 mm, 4-layer, 1.6 mm FR4, ENIG.
Use distinct AGND and DGND regions with one star connection under the ADC area in the later analog/ADC implementation.
Keep switching regulator power loops compact and away from ADC/DAC/reference circuitry.
Place HSE crystal within 5 mm of STM32 oscillator pins with grounded guard/pour where practical.
Decouple each STM32 power pin locally; VCAP pins require local 2.2uF capacitors and must not be tied to an external rail.
Isolated +/-15V converter: RECOM RH-0515D or footprint-compatible equivalent to be confirmed during the rail-isolation sub-block pass.
Follow-Up Blocks
DAC/setpoint, isolated analog output, ADS1263 4-wire sense ADC, PT100, humidity probe, isolated gate-driver interface, Ethernet, CAN, interlocks, EEPROM, and RTC will be added in later schematic iterations.