Rev A — spec handoff + Objective 1 sourcing

flux

Final BOM completion is done with zero missing-MPN rows. J3 and BZ1 remain on PCB and are excluded from PCBA placement.
No Basic-class exact match was available for 1.78 kΩ, 3.01 kΩ, 90.9 kΩ, 3.48 kΩ, 178 kΩ, and 10 µF; Extended parts were assigned. Note: C14’s sourcing metadata is 0603, while its existing physical footprint remains 0805 because layout changes were prohibited.

  • sentry-node-v1-bom-jlcpcb

    CommentDesignatorFootprintJLCPCB Part #LCSC Part #
    TMB12A03BZ1Through Hole D12mm P7.6mmC96222
    CL10A475KP8NNNCC1, C2, C3C1705
    GRM188R61A226ME15LC6, C7, C8C0603C167429
    CL10B104KB8NNNCC10, C11, C15, C16, C18, C20, C22, C25C_0603_1608MetricC1591
    CL10A106KP8NNNCC12, C4, C5, C9C19702
    CL10A105KB8NNNCC13, C17, C19, C21, C23C_0603_1608MetricC15849
    MMASL168BB5106MTNA01C14C_0603_1608MetricC6594205
    6SVPC330MC24CAP-SMD_BD6.3-L6.6-W6.6-FDC139569
    OCV101M0JTR-0606C26CAP-SMD_BD6.3-L6.6-W6.6-LS7.2-R-RDC134854
    USBLC6-2SC6D1C7519
    1N4148W-13-FD2, D3SOD-123_L2.7-W1.6-LS3.7-RDC112342
    BLM18AG601SN1DFB1C19330
    TYPE-C-31-M-12J1USB-C_SMD-TYPE-C-31-M-12C165948
    B2B-PH-SM4-TB(LF)(SN)J2CONN-SMD_B2B-PH-SM4-TB-LF-SNC160352
    XFL4020-152MECL1C3033018
    WS2812B-V6LED1SMD5050-4PC52917433
    ICS-43434M1, M2, M3, M4LGA-6 3.5x2.65mm bottom-portC5656610
    MMBT2222ALT1GQ1, Q2SOT-23C82460
    0603WAF5101T5ER1, R2R_0603_1608MetricC23186
    ERJ3EKF1781VR3R_0603_1608MetricC403029
    RC0603FR-073K01LR4R_0603_1608MetricC137732
    RC0603FR-0790K9LR5R_0603_1608MetricC185305
    CL0603FN3K48PR7R_0603_1608MetricC52209912
    ERJ-U03F1783VR10R_0603_1608MetricC1859202
    0603WAF1004T5ER11, R9R_0603_1608MetricC22935
    0603WAF1003T5ER12, R13, R8R_0603_1608MetricC25803
    0603WAF1002T5ER14, R6R_0603_1608MetricC25804
    0603WAF1001T5ER15, R16R_0603_1608MetricC21190
    0603WAF3300T5ER17R_0603_1608MetricC23138
    MK-12C02-G015S1SW-SMD_G-SWITCH_MK-12C02-G015C2911519
    K2-1114SA-A4SW-06SW2, SW3KEY-SMD_4P-L4.8-W4.6-P1.70-LS6.2C136662
    TS-1187A-B-A-BSW4SW-SMD_4P-L5.1-W5.1-P3.70-LS6.5-TL-2C318884
    BQ24074RGTRU1
    TPS63020DSJRU2C15483
    ESP32-S3-WROOM-1-N16R8U3WIRELM-SMD_ESP32-S3-WROOM-1C2913202
    Ra-01HU4WIRELM-SMD_RA-01HC503593

  • sentry-node-v1-pickplace-jlcpcb-corrected

    DesignatorLayerRotationMid XMid Y
    C1Bottom028mm-4.5mm
    C2Bottom028mm-7.5mm
    C3Bottom036mm-6mm
    C4Bottom0-4mm4.7mm
    C5Bottom0-4mm-4.7mm
    C6Bottom03.8mm4.7mm
    C7Bottom03.8mm-4.7mm
    C8Bottom00.8mm-4.7mm
    C9Bottom0-18.5mm12mm
    C10Bottom0-4.8mm3.3mm
    C11Bottom034mm-1mm
    C12Bottom0-0.8mm4.7mm
    C13Bottom0-30.1mm10.4mm
    C14Bottom0-35.3mm10.4mm
    C15Bottom0-32.6mm10.4mm
    C16Bottom0-30.5mm-26.2mm
    C17Bottom0-30.5mm-29.8mm
    C18Bottom9030.5mm29.8mm
    C19Bottom030.5mm26.2mm
    C20Bottom90-30.5mm30mm
    C21Bottom0-25.5mm30mm
    C22Bottom9025.5mm-24.59mm
    C23Bottom9030.5mm-24.59mm
    C24Top0-13mm-27mm
    C25Top0-20mm0mm
    C26Top09mm22.5mm
    D1Bottom01mm-28mm
    D2Top0-22mm18mm
    D3Top0-31mm-6mm
    FB1Bottom0-14mm12mm
    J1Bottom00mm-36.9mm
    J2Bottom27037.44mm-25mm
    L1Bottom03.8mm0mm
    LED1Top00mm24mm
    M1Bottom0-28.327mm-28mm
    M2Bottom027.673mm28mm
    M3Bottom0-28.327mm28mm
    M4Bottom027.673mm-28mm
    Q1Top0-10mm18mm
    Q2Top0-31mm-12mm
    R1Bottom0-7mm-32mm
    R2Bottom0-7mm-35mm
    R3Bottom026mm-10mm
    R4Bottom029mm-10mm
    R5Bottom032mm-10mm
    R6Bottom035mm-10mm
    R7Bottom026mm-13mm
    R8Bottom029mm-13mm
    R9Bottom00mm-3.4mm
    R10Bottom04.8mm3mm
    R11Bottom09mm-8mm
    R12Bottom037mm-1mm
    R13Bottom034mm-3.5mm
    R14Bottom0-32.5mm11.6mm
    R15Top0-14mm15mm
    R16Top0-27mm-12mm
    R17Top029mm8mm
    S1Top18022.0254mm40.0435mm
    SW2Top0-11mm37mm
    SW3Top0-20mm37mm
    SW4Top00mm-26mm
    U1Bottom032mm-6mm
    U2Bottom0-2mm0mm
    U3Bottom270-32.87mm0mm
    U4Top18030.5mm-8mm
Details: Final BOM Completion Report. ORDER HELD — no order placed.
A

agamrossen

tell me exactly out of the display header pins which one is meant for which pin on the 1.54 inch waveshare e ink display

flux

The J3 display header is wired in the standard Waveshare 1.54-inch e-paper cable order:

Table

J3 pinBoard netWaveshare display pin
13V3_SYSVCC
2GNDGND
3SPI2_MOSIDIN
4SPI2_SCKCLK
5EPD_CSCS
6EPD_DCDC
7EPD_RSTRST
8EPD_BUSYBUSY
So the connection is 1→VCC, 2→GND, 3→DIN, 4→CLK, 5→CS, 6→DC, 7→RST, 8→BUSY.
This assumes pin 1 is identified from the PCB footprint’s pin-1 marker. Do not determine pin 1 solely by viewing the header from the cable side, because the apparent order reverses when viewed from the opposite face.
Verify display connector
Create firmware pin map
Review display power
Create bring-up checklist
Sign up to send

Files

Schematic

Layout

3D View

Objective 6 Placement Report
Date: 2026-08-14
Scope status

Table

ItemStatusEvidence / note
Phase A1 — off-board ERM motor connectionCompletedExisting hand-solder pads MP1/MP2 were made PCB-present and wired: MP1 (motor+) → 3V3_SYS; MP2 (motor−) → MOTOR_SW. Both remain excluded from pick-and-place but are no longer excluded from PCB or BOM. No physical motor footprint exists.
Phase A2 — PCB exclusion auditCompletedExhaustive audit covered all 87 baseline schematic components. Exclude from PCB was cleared on all 54 affected actual board components, including C24/C25/C26, modules, switches, headers, mics, test points and hand-solder pads. Layout then contained all 87 baseline footprints. C24/C26 were marked hand-solder (Exclude from Pick & Place=true).
Phase A3 — exact test pointsCompletedTP1–TP16 exist, are wired to the required nets, PCB-present, pick-and-place excluded, and placed on Bottom. No additional TP-role test points were added. ANT1 and MP1/MP2 are separate antenna/motor solder pads, not test points.
Board outline and stackupCompleted84.00 × 84.00 mm rounded square, 10.00 mm corner radius, origin at geometric centre. JLC7628 4-layer stackup: Top Signal / Inner 1 Ground Plane / Inner 2 Power Plane / Bottom Signal.
Four M2.5 mounting holesCompleted with documented substitutionExact centres achieved using real 2.5 mm NPTH features. The available plated MountingHole 2.5mm Pad library part was rejected because inspection showed a 5 mm SMD pad and no drill geometry; a part-quality report was filed.
Objective 6 functional placementCompleted91 total footprints (87 baseline + 4 mounting holes) placed with required side partition, edge access, RF separation and central switcher block. No inter-component body-overlap, outside-board, missing-footprint, invalid-layer, edge-placement or pad-access findings remain in the placement checks.
RoutingUnattempted as requiredNo routing tools were invoked. Readback found zero routeSegment nodes; all electrical connections remain airwires.
Final copper DRCFailed due to inherited source-footprint defects74 overlapping-copper errors remain internal to existing footprints, principally all four ICS-43434 footprints, plus WS2812B-V6, BQ24074, buzzer and the two MMBT2222A footprints. These are pad geometries overlapping within each component, not placement collisions between components. Frozen part authority prevented replacement. The ICS-43434 and defective mounting-hole parts were reported as library quality issues.
Phase A verification
Motor hand-solder pads
  • MP1 role: motor flying-lead positive pad
  • MP1 net: 3V3_SYS
  • MP2 role: motor flying-lead negative pad
  • MP2 net: MOTOR_SW
  • MP1/MP2: included on PCB and BOM; excluded from pick-and-place
  • Physical ERM motor component: absent, as required
Required test-point map

Table

Test pointNet
TP1VBAT
TP23V3_SYS
TP3MIC_3V3
TP4GND
TP5GND
TP6I2S_BCLK / GPIO4
TP7I2S_WS / GPIO5
TP8I2S_SD_A / GPIO6
TP9I2S_SD_B / GPIO7
TP10GPIO43
TP11GPIO44
TP12GPIO38
TP13GPIO39
TP14GPIO40
TP15GPIO41
TP16GPIO42
All TP1–TP16 are on Bottom.
Binding coordinate readback
Microphones

Table

MicrophoneActual X (mm)Actual Y (mm)LayerResult
M1-30.000.00BottomPass
M2+30.000.00BottomPass
M30.00+30.00BottomPass
M40.00-30.00BottomPass
The centres meet the ±0.10 mm requirement exactly. Their local pairs are Bottom and close to the associated mic:
  • M1: C16 100 nF, C17 1 µF
  • M2: C18 100 nF, C19 1 µF
  • M3: C20 100 nF, C21 1 µF
  • M4: C22 100 nF, C23 1 µF
Critical inherited issue: the ICS-43434 source footprint currently collapses all six pads into a 1.6 × 1.6 mm area rather than the stated 3.5 × 2.65 mm LGA and exposes no verifiable bottom-port-hole geometry. Therefore centre/layer placement passes, but port-hole orientation/manufacturability cannot be certified until the source part is repaired.
Mounting holes

Table

HoleActual X (mm)Actual Y (mm)TypeResult
H1-38.00+38.002.5 mm NPTHPass
H2+38.00+38.002.5 mm NPTHPass
H3+38.00-38.002.5 mm NPTHPass
H4-38.00-38.002.5 mm NPTHPass
The holes are non-plated because the only matching grounded/plated library part had no actual drill geometry. This avoids inventing an unreliable plated feature while preserving the exact binding centres.
Switcher-to-microphone separation
Component-centre check used the minimum required switcher block: U2, L1, C4–C8, C10, C12, R9 and R10. All were kept in the centre-safe region.

Table

MicrophoneNearest switcher componentMinimum centre distance (mm)Requirement
M1C1025.415Pass ≥25.00
M2R1025.378Pass ≥25.00
M3C1225.313Pass ≥25.00
M4C825.313Pass ≥25.00
Placement checks
  • Pass: forward convention +Y corresponds to M3.
  • Pass: USB-C J1 is Bottom at rear -Y edge with receptacle access.
  • Pass: ESP32-S3-WROOM U3 is Bottom at the rear edge, separated from J1, with antenna oriented outward/overhanging.
  • Pass: Ra-01H U4 is Top at +Y, opposite and far from the WROOM rear antenna; ANT1 is accessible at the same edge.
  • Pass: S1 is Top at +X edge and operable.
  • Pass: all 16 required test points are Bottom.
  • Pass: power chain, MCU and microphone blocks are Bottom; alert/UI/LoRa/header/motor pads are Top as specified.
  • Pass: no tall Top-side component centre is within 5.00 mm of a microphone centre; the closest tall/lead-bearing placements remain outside the acoustic exclusion circles.
  • Pass: no inter-component body overlaps remain.
  • Pass: no non-intentional outside-board component findings remain; antenna/connector overhang is intentional.
  • Pass: no missing-footprint or invalid-layer placement findings remain.
  • Pass: layout readback contains zero route segments; no traces were created.
  • Remaining issue: 74 internal overlapping-copper errors from inherited source footprints. This blocks manufacturing release even though the placement geometry itself is complete.
Final boundary
Work stopped at placement. No trace routing, copper trace creation or progression beyond Objective 6 was performed.

  • Scope status

  • Phase A verification

  • Motor hand-solder pads

  • Required test-point map

  • Binding coordinate readback

  • Microphones

  • Mounting holes

  • Switcher-to-microphone separation

  • Placement checks

  • Final boundary