Part Review and Datasheet Update
Worked for 1 min 29 sec
Updated the symbol labels and pin metadata, then audited the SOIC-16 land pattern. The detailed report is updated here: W25Q02JVSFIM Part Review.
Open items:
- Pins 12–14 still display as
N/C; the rename attempts did not persist, though their descriptions are correct. - The footprint geometry is broadly SOIC-16 wide-body compatible, but its source asset/model still references
MAX3232ECWE+T.
Suggested next steps:
- Manually rebuild or replace pins 12–14 if strict
NCdisplay naming is required. - Replace the footprint/3D model asset with a W25Q02JVSFIM-specific SOIC-16 wide-body asset.
- Verify final package dimensions directly against the Winbond mechanical drawing before publishing.
Thought for 7 sec
I’ll replace the inherited MAX3232 footprint/model references with a W25Q02JVSFIM-specific SOIC-16 wide-body footprint/model asset, then verify the layout metadata no longer points to MAX3232.
Worked for 4 mins 17 sec
Replaced the footprint and 3D model rule references with W25Q02JVSFIM-specific SOIC-16W assets and removed the old MAX3232 footprint/model assets. I updated the report here: W25Q02JVSFIM Part Review.
Open items:
- The layout rule references are corrected, but the inspector still shows cached/generated MAX3232 payload details inside the rendered geometry; a layout refresh/rebuild may be needed to fully regenerate the geometry text.
Suggested next steps:
- Refresh/rebuild the footprint geometry from the new W25Q02JVSFIM asset.
- Re-check the part before publishing.
- Fix the remaining pins 12–14
N/Cdisplay labels if strict naming consistency is required.
Refresh, verify, fix labels
Refresh footprint geometry
Re-check before publishing
Fix NC labels
Verify 3D model
