Generate and Align CAD Model for Footprint
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Thought for 9 sec
Awaiting 1 task
"TLE8102 Package CAD Verification" completed.
Thought for 35 sec
Generated the
from the datasheet drawing and linked it through the Asset rule of a new model node directly under root, outside the footprint folder. Verified package dimensions, lead and exposed-pad alignment, pin-1 orientation, and seating; footprint pads remain unchanged. Small molding and lead-bend details are simplified.
3D Model
Package Model
Result
Completed: authored, validated and placed the PG-DSO-12-11 package model for TLE8102SGAUMA1. No footprint-pad or electrical-data mutation was made by this modeling task. No project files or Specification existed when work began.
3D Model
Drawing and dimensions
Source: project Datasheet URL, Infineon TLE8102SG V1.5 (2012-08-17), page 32, Figure 27, PG-DSO-12-11. Drawing dimensions are mm.
The original PDF drawing was downloaded and visually inspected, because machine extraction confused the mold length with the projecting end features and could not associate all dimension endpoints. The following source image preserves that direct inspection evidence:
Drawing detail
Model coordinates: X crosses the lead rows, Y runs along each row, Z is up. Main rectangular mold is 7.5 X × 6.4 Y × 2.35 thick; the 7.6 callout spans the projecting molded end features, not the main 6.4 mold rectangle. These feature-to-axis assignments and the lead-width callout below were verified visually from the drawing image, not independently resolved by the datasheet parser.
Table
| Feature | Model value (mm unless noted) | Drawing basis / modeling choice |
|---|---|---|
| Main mold across leads | 7.5 | 7.5 ±0.1 drawing callout |
| Main mold along row | 6.4 | Direct visual reading of mold dimension; parser renders tolerance inconsistently, so nominal is used |
| Body thickness | 2.35 | 2.35 ±0.1 |
| Body standoff | 0.05 | Chosen midpoint within drawing 0 to +0.1 range |
| Overall modeled height | 2.40 | Derived 2.35 +0.05, below drawing 2.6 maximum |
| Lead pitch / count | 1.0 / 6 each side | Drawing 5 intervals = 5 |
| Lead width | 0.4 | Direct visual reading 0.4 +0.13 |
| Lead thickness | 0.25 | Drawing +0.075/−0.035 |
| Toe-to-toe span | 10.3 | Drawing ±0.3 |
| Foot length / angle | 0.7 / 5° | Drawing ±0.15 and ±3° |
| Central exposed metal | 4.2 X ×5.1 Y | Metal dimensions each ±0.1; axes from direct visual inspection |
| Narrow metal tabs | 1.6 X, extending to total 7.8 Y | Each ±0.1; 7.8 labeled heatslug; shape from direct inspection |
| Molded tab collar | 1.8 X, total 7.6 Y | 1.8 reference dimension; 7.6 +0.13/−0.1 overall end-feature callout; direct drawing inspection |
| Heat slug height / lead exit lower face | 0.8 | Side-view reference interpreted visually |
Authored construction and simplifications
The build123d source is centered in XY and uses z=0 as the seating plane. The Compound contains 14 solids: a black body (
#1c1c1c), a separate stepped heatslug and twelve separate bent gull-wing leads (#a4a291). Metal feet slope 5° to toes at z=0; the exposed metal underside is at z=0. The body underside is at z=0.05 outside the heatslug pocket. There are no intersecting plastic/slug volumes.The source uses nominal dimensions rather than worst-case tolerance envelopes. Mold draft, fine lead bend radii, flash, stamped edge reliefs, tooling/ejector details and tiny tab notches are simplified or omitted. Bend transition X positions are interpolated, not manufacturer tooling dimensions. The pin-1 dimple is a cosmetic 0.4-diameter, 0.12-deep cut centered at (−3.15,+2.60) on top. This is a package visualization/alignment model, not a manufacturing master.
Node and alignment
- Model name:
Package Model v1 - Node UID:
cfddc27d-3454-41bf-8ee4-5e0ab098b00e - Parent: ROOT, deliberately outside footprint per explicit user requirement.
- Asset rule:
tle8102sg-package.build123d - Position:
0mm 0mm 0mm; rotation:0 0 0;zIsUp=true;physicalMaterials=true. - Tool created unit scale
customShapeScale=1; computed scale (1,1,1); computed showEdges=false; no color override. - Existing footprint UID:
7f6eef7d-e7af-c44b-3ea1-eca1fe5f73c7, top side, origin (0,0,0), zero rotation. - Computed scene pad 1 (IN2 UID
3c0c39ef-6a04-7035-4dd1-bdffef105627): (−4.8,+2.5) mm. KiCad payload Y was not used as scene Y. - Model lead-1 foot center XY: (−4.8,+2.5); its X footprint is −5.15 to −4.45, Y +2.3 to +2.7. This lies within pad 1 X −5.8 to −3.8 and Y +2.175 to +2.825.
- All lead feet are centered at X ±4.8, Y ±0.5,±1.5,±2.5 with 1.0 pitch, matching all twelve pad centers exactly.
- Pin-1 dimple is in the (−X,+Y) quadrant, agreeing with scene pad1 and its adjacent silkscreen marker.
- Exposed metal is centered on pad13; its full 4.2 ×7.8 envelope fits inside the existing 4.5 ×8.1 pad, with 0.15-mm edge margin in each axis.
- ROOT parenting means the model will not automatically follow a subsequently moved footprint; retain the shared origin or update model transforms together if that occurs.
Verification and limitations
Completed: local OpenCascade validity check and upload conversion pipeline. Both reported 14 solids, overall 10.3 ×7.8 ×2.4 mm, volume 117.7892 mm³, with minimum Z numerically zero (−6.94e−18 mm). The pipeline reported 166 faces.
Completed: read-only scene-tree readback confirmed ROOT hierarchy, asset resolution, zero transforms, Z-up and unit scale. Project 3D iso/top/front views show the model upright, seated, all lead rows aligned to pads and the dimple adjacent to pad1. An isolated bottom view confirms the stepped exposed heatslug and narrow end tabs.
Info: pipeline small-solid/thin-feature findings refer to intentional 0.4-wide IC leads, not fabrication defects. The down-facing-surface finding is a generic 3D-print support heuristic and is not applicable to this molded IC model.
Unattempted: electrical or footprint redesign (out of scope). Board DRC comparison returned NOT CHECKED/no validator result in this part project; no DRC-clean claim is made. No blocker remains for the assigned generation and placement scope; this does not certify other project work.
Result
Drawing and dimensions
Authored construction and simplifications
Node and alignment
Verification and limitations