Part Verification and Datasheet Review


Here’s a complete, step‑by‑step review and verification for this part project.
Step 1 — Available part information (from the project)
  • MPN: TJA1051T/3,118
  • Manufacturer: NXP
  • Description: CAN Interface IC Hi Spd CAN Transcvr 4.5V-5.5V 250ns
  • Part type: Integrated Circuits
  • Datasheet: Datasheet
  • Schematic symbol pins present (8 total):
  • Footprint in project: defaultFootprint with 8 pads named to match pins (no package geometry details exposed)
Step 2 — Datasheet presence check
  • A datasheet URL is already set. No changes required.
Step 3 — Datasheet scan and metadata extraction
Key features
  • ISO 11898-2:2016 and SAE J2284-1 to J2284-5 compliant
  • Timing guaranteed for data rates up to 5 Mbit/s (CAN FD fast phase)
  • Suitable for 12 V and 24 V systems
  • Low EME and high EMI robustness; high ESD handling on bus pins
  • VIO pin on “/3” variants (this project’s MPN) enables direct 3 V to 5 V MCU interfacing
  • Zero-load bus behavior when unpowered; undervoltage detection on VCC and VIO
  • TXD dominant time‑out; thermal protection
  • Packages: SO8 (SOT96‑1) or HVSON8 (SOT782‑1)
Absolute maximum ratings (limiting values)
  • Voltage on CANH, CANL: −58 V to +58 V
  • Voltage on any other pin: −0.3 V to +7 V
  • Voltage between CANH and CANL: −27 V to +27 V
  • Transient (automotive pulses) on CANH/CANL: pulse 1 −100 V; pulse 2a +75 V; pulse 3a −150 V; pulse 3b +100 V
  • ESD:
    • IEC 61000‑4‑2 at CANH/CANL: −8 kV to +8 kV
    • HBM at CANH/CANL: −8 kV to +8 kV; other pins: −4 kV to +4 kV
    • MM any pin: −300 V to +300 V
    • CDM: corner pins −750 V to +750 V; any pin −500 V to +500 V
  • Virtual junction temperature: −40 °C to +150 °C
  • Storage temperature: −55 °C to +150 °C
Recommended operating conditions
  • VCC: 4.5 V to 5.5 V
  • VIO (for “/3” variants): 2.8 V to 5.5 V
  • Ambient/junction range per electrical tables; all voltages referenced to GND; positive currents flow into IC
Selected electrical characteristics
  • Supply current ICC (Normal mode; bus recessive): min 2.5 mA, typ 5 mA, max 10 mA
  • VIO supply (TJA1051T/3, TJA1051TK/3):
    • VIO: 2.8 V to 5.5 V
    • IIO (Normal/Silent): recessive typ 80 µA (max 250 µA); dominant typ 350 µA (max 500 µA)
    • VIO undervoltage detect: min 1.3 V, typ 2.0 V, max 2.7 V
  • TXD input thresholds:
    • VIH: 0.7·VIO to VIO+0.3 V
    • VIL: −0.3 V to 0.3·VIO
  • RXD output drive:
    • HIGH at VRXD = VIO − 0.4 V: −8/−3/−1 mA (min/typ/max)
    • LOW at VRXD = 0.4 V (bus dominant): 2/5/12 mA (min/typ/max)
  • Bus levels (Normal mode, VTXD = 0, t bus dominant: 65 ns
    • TXD->bus recessive: 90 ns
    • bus dominant->RXD: 60 ns
    • bus recessive->RXD: 65 ns
    • TXDL->RXDL (VIO variants): min 40 ns, max 250 ns
    • TXDH->RXDH (VIO variants): min 40 ns, max 250 ns
  • Max data rate: 5 Mbit/s (CAN FD fast phase)
  • Protection:
    • TXD dominant time‑out tto(dom)TXD: 0.3 ms to 5 ms (typ 1 ms)
    • Thermal shutdown Tj(sd): typ 190 °C
    • Dominant short‑circuit output current (VTXD=0, t
Run DRC/ERC review
Verify SO8 footprint geometry
Check BOM MPN/package
Find SO8 footprint part

Name
Pin #
Type
Section
Pin Group
Orientation
Order
Sub-symbol
TXD
1
Unspecified
GND
2
Unspecified
VCC
3
Unspecified
RXD
4
Unspecified
VIO
5
Unspecified
CANL
6
Unspecified
CANH
7
Unspecified
S
8
Unspecified

TJA1051T/3,118