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Part Review: STS40-CD1B-R3
Reviewed source
Project metadata reviewed

Table

FieldProject valueDatasheet / expected valueResult
ManufacturerSensirionSensirionMatch
MPNSTS40-CD1B-R3STS40-CD1B-R3Match
Part typeSensorsDigital local temperature sensorAcceptable
Package / case16-DFN in project metadata; 4-DFN in indexed part dataDFN, 4 pins, 1.5 mm × 1.5 mmMismatch / needs cleanup
Pin countProject context: 4 pads4 pins: SDA, SCL, VDD, VSSMatch
DescriptionTemperature Sensor Digital, Local -40C ~ 125C 16 b 4-DFN (1.5x1.5)Digital temperature sensor, -40 °C to +125 °C, 16-bit output, DFN 1.5 × 1.5 mmMatch
Datasheet URLPresentOfficial Sensirion STS4x datasheetNo update required
Datasheet key specs
  • Sensor type: digital local temperature sensor.
  • Supply voltage: 1.08 V min, 3.3 V typical, 3.6 V max.
  • Operating temperature: -40 °C to +125 °C.
  • Storage temperature: -40 °C to +150 °C.
  • Temperature accuracy for STS40: typically ±0.2 °C.
  • Resolution: 0.01 °C.
  • Repeatability: high 0.04 °C, medium 0.07 °C, low 0.1 °C.
  • Response time: t63% ≈ 2 s.
  • Long-term drift: typ <0.03 °C/year, max <0.04 °C/year.
  • Interface: I²C Fast-mode Plus with CRC checksum.
  • I²C address for STS40-CD1B-R3: 0x46.
  • Package: DFN, 1.5 mm × 1.5 mm body, approximately 0.55 mm height, 0.8 mm pitch.
  • Datasheet land-pattern guidance: 0.5 mm × 0.3 mm pads; central die pad soldering optional; no copper under the sensor except pin pads.
Pin cross-check

Table

PinProject terminalProject pin typeDatasheet nameDatasheet descriptionResult
1SDAUnspecifiedSDASerial data, bidirectionalName/number match; pin type should be bidirectional/I²C data
2SCLUnspecifiedSCLSerial clock, unidirectional inputName/number match; pin type should be input/I²C clock
3VDDUnspecifiedVDDSupply voltageName/number match; pin type should be power input
4VSSUnspecifiedVSSGroundName/number match; pin type should be ground/power
Footprint cross-check
  • Indexed footprint asset: STS40CD1BR3.kicad_mod.
  • Indexed 3D model asset: STS40-CD1B-R3.stp.
  • Project footprint pads found: SDA, SCL, VDD, VSS.
  • Footprint pad count matches the four datasheet pins.
  • No separate exposed/central die pad was found in the project index. This is acceptable if the intended footprint follows the datasheet note that soldering the central die pad is optional, but the footprint should still avoid copper under the sensor except at pin pads.
Mismatches and cleanup items
  1. Package metadata mismatch: project properties list Package or Case Code: 16-DFN, but this part is a 4-pin DFN / 4-DFN, 1.5 mm × 1.5 mm device. This should be changed to avoid search/BOM confusion.
  2. Pin types are unspecified: terminal names and pin numbers match the datasheet, but the symbol pin types should be set more specifically: SDA = bidirectional, SCL = input, VDD = power input, VSS = ground/power.
  3. Pin groups/sections missing: no explicit pin groups/sections were found. Suggested grouping: I²C Interface (SDA/SCL), Power (VDD), Ground (VSS).
  4. Land-pattern caution: verify the footprint has no copper under the sensing die except pin pads, consistent with Sensirion's layout recommendation.
Overall result
The part identity, datasheet URL, description, pin count, and terminal-to-footprint pad names are largely correct. The main correction needed is the package metadata typo (16-DFN should be 4-DFN or equivalent), followed by improving pin type and grouping metadata for cleaner part review results.

  • Reviewed source

  • Project metadata reviewed

  • Datasheet key specs

  • Pin cross-check

  • Footprint cross-check

  • Mismatches and cleanup items

  • Overall result