Current rating (per contact, EIA-364-70A): Others: 1 A max
Contact resistance (EIA-364-06C): 20 mΩ max initial; 30 mΩ max after conditioning
Insulation resistance (EIA-364-21D): Others: 1,000 MΩ min
Voltage proof / dielectric withstanding (EIA-364-20D): “Others: 1,000 V AC/DC for 1 minute”
Operating temperature range (EIA-364-17B): Others: −40°C to +105°C
Mechanical/materials (C029XX and Product page)
Contacts/base material: Copper alloy
Contact finish: Gold on contact area (finish code 42)
Termination finish: 100% Tin over Nickel (finish code 42)
Housing: High-temperature thermoplastic, UL94V-0, black
Rows: 2
Pitch: 1.27 mm (within row)
Row spacing: 1.27 mm between rows
Packaging: Bulk/loose
Recommended PCB land pattern (C029XX; Male Vertical Surface Mount Double Row — M50-360)
Available sizes (without posts) include 12-way per row (matches M50-3600642)
Without posts — dimensions provided:
A = 1.27 × (number of contacts per row)
B = 1.27 × (number of contacts per row − 1)
Pad size: 0.40 mm square
Key dimensional callouts present: 0.80, 1.00, 1.27, 1.68, 2.62, 3.00, 3.40, 5.50, 6.50 mm (refer to drawing for their placements)
With posts (not applicable here based on the part number) — additional drill dimensions provided (Ø0.70, Ø0.95, etc.)
Special notes
Pin numbering convention not explicitly text-described on the product page; refer to the technical drawing for the pin 1 corner and numbering direction.
Solderability and heat resistance (EIA-364-52A / -56D): Others: 245°C for 5 s (solderability); 260°C for 10 s (heat resistance)
Step 4 — Cross-check symbol and footprint against the datasheet
Pin numbering: Each terminal’s “Pin Number” property is set to 1..12, matching a 12-contact (6+6) connector.
Pin types: All terminals have “Pin Type: Unspecified”. For a connector, these should be set to Passive to avoid ERC noise.
Footprint
Pad count present: 12 pads are present (Pads 1..12), consistent with a 6+6 DIL SMT header.
Footprint style: Only SMT pads are present; no post holes visible, which matches “without posts” for this specific MPN.
Pad size and pitch: The API did not return pad geometry (sizes/coordinates), so I cannot directly verify:
Pad size equals 0.40 mm square (as recommended).
In-row pitch equals 1.27 mm and row spacing equals 1.27 mm.
Inter-row and end-to-end spacing per “A” and “B” formulas for 6 contacts per row: A = 1.27 × 6 = 7.62 mm; B = 1.27 × (6 − 1) = 6.35 mm.
Pin 1 indicator: Not visible via the API. Ensure the footprint has a clear Pin 1 mark that matches the technical drawing.
Flags and actionable checks
Pin types: Set all schematic pins to Passive. Current state is Unspecified on 1–12.
Pin numbering/orientation: Confirm that the symbol’s left/right columns and the footprint’s numbering orientation match the technical drawing’s Pin 1 corner and numbering order.
Pad geometry: Verify pad size (0.40 mm square), pitch (1.27 mm), and row spacing (1.27 mm) against the recommended pattern in the C029XX spec. The current API view doesn’t expose pad coordinates/sizes; please double-check in the footprint editor.
MPN correctness vs features: M50-3600642 implies double-row SMT, 6 ways per row (total 12), gold on contact / tin on tails, without posts. Ensure no post holes in the footprint (current layout shows none — OK).
Mating pin height: 3.00 mm per product page — not enforced by PCB footprint, but good to confirm the mechanical height in your 3D/assembly constraints.
If you want, I can:
Update all schematic pin types to Passive for 1–12.
Add a brief part-level note with the key C029XX electrical ratings to the project properties for quick reference.
Help verify/adjust footprint pad sizes and row spacing to match the C029XX recommended pattern.