Part Data Review and Cleanup
Table
| Field | Value |
|---|---|
| Manufacturer | BOSCH |
| Manufacturer Part Number | BHI385 |
| Part Type | Sensors |
| Project Description | Accelerometer, Gyroscope Sensor I2C, SPI Output -40C ~ 85C |
| Datasheet | |
| Package from datasheet | 2.5 mm x 3.0 mm LGA |
| Pin count from datasheet | 20 |
Table
| Check | Result |
|---|---|
| Datasheet URL already present | Yes |
| Search/update required | No |
| Source used for review |
Table
| Category | Summary |
|---|---|
| Sensor core | 6-DoF IMU with 16-bit 3-axis accelerometer and 16-bit 3-axis gyroscope |
| Accelerometer range | Up to ±32 g |
| Gyroscope range | Up to 2000 deg/s |
| Processing | Programmable 32-bit Fuser2 MCU, plus additional ultra-low-power MCU |
| Memory | 256 kB SRAM, 144 kB ROM with preloaded software |
| Interfaces | Host interface configurable as SPI or I2C |
| Extra interfaces | Secondary master interfaces: one I2C and one selectable SPI/I2C |
| Performance | Long Run mode 950 uA @ 20 MHz, Turbo mode 2.8 mA @ 50 MHz |
| Software | Open SDK, event-driven framework, BSX fusion support, on-chip AI support |
| Mechanical | 2.5 mm x 3.0 mm LGA-20 |
Table
| Parameter | Min | Max | Unit |
|---|---|---|---|
| Supply pin voltage at VDD | -0.3 | 4.0 | V |
| I/O supply pin voltage at VDDIO | -0.3 | 2.75 | V |
| Any logic pin voltage | -0.3 | VDDIO + 0.3 | V |
| Passive storage temperature | -50 | 150 | C |
| NVM data retention | 10 | years | |
| NVM write cycles | 14 | cycles | |
| Mechanical shock, 200 us half sine | 10000 | g | |
| Mechanical shock, 0.3 ms half sine | 2900 | g | |
| Free-fall onto hard surfaces | 2 | m | |
| ESD HBM | 2 | kV | |
| ESD CDM | 500 | V | |
| ESD MM | 200 | V |
Table
| Parameter | Value |
|---|---|
| Brown-out rising threshold | 1.3 V to 1.6 V |
| Input low level | 0.3 x VDDIO |
| Input high level | 0.7 x VDDIO |
| Internal pull-up on M3SCL | 35 kOhm min, 61 kOhm typ, 107 kOhm max |
| Internal pull-up on other pads | 71 kOhm min, 121 kOhm typ, 214 kOhm max |
| Internal pull-down on HSDO | 62 kOhm min, 109 kOhm typ, 208 kOhm max |
| Pad capacitance on HSCX, HCSB, HSDX, HSDO, HIRQ, RESETN, JTAG_DIO, M3SDA | 1.8 pF typ |
| Pad capacitance on M3SCL | 3.6 pF typ |
| Pad capacitance on ASCX, ASDX, OCSB, OSDO, RESV1, RESV2 | 6.8 pF typ |
| System oscillator, Long Run | 18.4 MHz min, 20 MHz typ, 21.6 MHz max |
| System oscillator, Turbo | 46 MHz min, 50 MHz typ, 54 MHz max |
| Deep sleep current, gyro+accel suspend | 7.8 uA typ |
| Regular sleep current, gyro+accel suspend | 8.1 uA typ |
| Accel low-power current, 25 Hz | 14 uA typ |
| Accel normal current | 214 uA typ |
| Accel+gyro low-power current, 25 Hz | 424 uA typ |
| Accel+gyro normal current, max ODR | 689 uA typ |
| Accel+gyro performance current, max ODR | 974 uA typ |
| Fuser2 matrix multiplication, Long Run | 840 uA typ |
| Fuser2 CoreMark, Long Run | 950 uA typ |
| Fuser2 CoreMark, Turbo | 2800 uA typ |
Table
| Pin | Terminal | Datasheet function |
|---|---|---|
| 1 | HSDO | Host SPI MISO or I2C address select |
| 2 | ASDX | Aux/OIS MOS or I2C SDA; Master 2 SPI MOSI / I2C SDA |
| 3 | ASCX | Aux/OIS Clock or I2C SCL; Master 2 SPI SCK / I2C SCL |
| 4 | HIRQ | Host interrupt signal |
| 5 | VDDIO | Digital I/O and Fuser2 supply |
| 6 | GNDIO | Digital I/O and Fuser2 ground |
| 7 | GND | Analog sensor ground |
| 8 | VDD | Analog sensor supply |
| 9 | VREG | Voltage regulator output; requires external decoupling capacitor |
| 10 | OCSB | Aux/OIS chip select; Master 2 SPI chip select 1 |
| 11 | OSDO | Aux/OIS MISO; Master 2 SPI MISO |
| 12 | HCSB | Host SPI chip select; keep high for I2C mode |
| 13 | HSCX | Host SPI SCK or I2C SCL |
| 14 | HSDX | Host SPI MOSI or I2C SDA |
| 15 | M3SCL | Master 3 I2C SCL / debug clock |
| 16 | JTAG_DIO | Fuser2 debug data |
| 17 | RESETN | Reset input, active low |
| 18 | M3SDA | Master 3 I2C SDA |
| 19 | RESV2 | Reserved, do not connect |
| 20 | RESV1 | Reserved, do not connect |
Table
| Item | Datasheet value |
|---|---|
| Package body | 2.5 mm x 3.0 mm |
| Pitch | 0.5 mm |
| Footprint pad set A | 0.250 x 0.475 mm (6x) |
| Footprint pad set B | 0.475 x 0.250 mm (8x) |
| Footprint pad set C | 0.250 x 0.250 mm (6x) |
| Solder mask frame around each pad | 50 um |
Table
| Area | Result | Notes |
|---|---|---|
| Pin count | Pass | Symbol has 20 terminals and footprint has 20 pads |
| Pin names | Pass | Symbol terminal names match datasheet pin names |
| Pin numbering | Pass | Symbol terminal numbering matches footprint terminal mapping and datasheet numbering |
| Package family | Pass | Footprint is consistent with LGA-20, 2.5 mm x 3.0 mm |
| Footprint pad pattern | Pass | Pad size groups in the footprint match datasheet recommendation |
| 3D model presence | Pass | STEP model is attached |
| Datasheet availability | Pass | Datasheet URL already present |
Table
| Severity | Issue | Why it matters |
|---|---|---|
| Medium | RESV1 and RESV2 are exposed as ordinary terminals even though the datasheet says do not connect | This can lead to accidental routing in downstream designs and cause board failure or undefined behavior |
| Medium | VREG is just a generic terminal in the symbol, but the datasheet requires an external 0.1 uF to 0.5 uF decoupling capacitor, 0.22 uF typ, on this pin | If a user treats it like a normal signal pin instead of regulator output/decoupling node, the part may not function correctly |
| Low | All symbol terminals currently have pin type Unspecified | This will not break manufacturing, but it weakens ERC and makes misuse of supply, output, reset, and DNC pins easier |
| Low | HIRQ appears in the datasheet as a host interrupt output signal, but the symbol metadata does not encode that direction | Not a footprint problem, but it can reduce ERC quality |
| Low | HCSB has an important mode-selection role in I2C operation that is not obvious from the bare pin name alone | Could cause incorrect integration if a user does not read the datasheet |
BHI385