Single Layer PCB Floorplan
Worked for 4 mins 27 sec
Implemented the schematic for the USB-C powered Wi‑Fi/BLE temperature/humidity node. It uses a SiWG917 Wi‑Fi/BLE 5.4 module, SHT41 T/RH sensor, USB-C sink input, TPS25940 true reverse-blocking eFuse with OVP/UVLO/OCP/soft-start, MP28301 3.3 V buck regulator, ESD protection, reset/ISP/SWD debug, I2C pull-ups, and status LED.
Created project files:
Open items:
- PCB layout/routing is not done yet, so airwire DRC errors are expected.
- Generic passives still need final manufacturer MPNs before manufacturing export.
- Layout must enforce the SiWG917 antenna keepout and thermal isolation around the SHT41.
Suggested next steps:
- Set board size/stackup and move into PCB placement.
- Place U1 at the board edge with antenna keepout and U4 away from heat sources.
- Route power, buck, I2C, SWD/UART, and USB-C protection paths.
- Assign final passive MPNs and run full DRC/manufacturing checks.
Single-sided PCB — component-side floor plan
One copper layer · SMD signal ICs + THT power/connectors
TX power zone
IGBT, MUR1560, snubber
keep as THT (heat + current)
Regulators
5 regulated rails
single ground point ↓
RX analog chain
CD4066 isolation → NE5534 ×2 → INA128 → MCP3201
all SOIC/SMD ICs
MCU + UI connectors
STM32 Nucleo-64 header, OLED I2C, 4 buttons
One copper layer · SMD signal ICs + THT power/connectors
TX power zone
IGBT, MUR1560, snubber
keep as THT (heat + current)
Regulators
5 regulated rails
single ground point ↓
RX analog chain
CD4066 isolation → NE5534 ×2 → INA128 → MCP3201
all SOIC/SMD ICs
MCU + UI connectors
STM32 Nucleo-64 header, OLED I2C, 4 buttons
Thought for 7 sec
The current project contains the completed schematic for a USB-C Wi‑Fi/BLE temperature/humidity sensor node: 46 components, protected 5 V input, TPS25940 eFuse, 3.3 V buck, SiWG917 radio MCU, SHT41 sensor, debug controls, and supporting documentation.
Your new single-sided TX/RX floor-plan describes a substantially different design. It has not been applied because no ACUs are currently available.
Remaining work once ACUs are available:
- Confirm whether to replace this sensor-node project or create a separate project.
- Capture the TX power stage, five regulated rails, star-ground point, RX analog chain, Nucleo-64 headers, OLED, and buttons.
- Define board dimensions, IGBT/current ratings, rail voltages, and connector locations.
- Place THT power parts separately from the sensitive SMD analog chain.
- Route the single copper layer and verify return paths, thermal spacing, and manufacturability.
Create separate TX/RX project
Identify missing power details
Propose component floor plan
Document layout constraints
