PCB Design for Dual-Plate Sensor Node

No pude ejecutar el cambio de tamaño porque se agotaron los créditos justo después de recibir la instrucción.
Estado actual:
  • El esquemático del clip óptico de dos placas ya está creado y cableado.
  • Incluye ESP32‑C3, USB‑C, NCP361, TP4056, AP2112K, OLED, LED rojo/IR, fototransistor y conector inter‑placas.
  • La revisión ERC del esquemático quedó limpia.
  • Ya existen los archivos de especificación, presupuesto de potencia y firmware inicial.
Pendiente:
  • Configurar el layout con dos PCBs:
    • Placa superior: 35 mm × 20 mm
    • Placa inferior: 18 mm × 10 mm
  • Definir contornos/ubicación de ambas placas.
  • Colocar componentes por placa.
  • Revisar DRC de colocación.
  • Luego pedir confirmación antes de rutear.
Configura los contornos de ambas placas con esas dimensiones.
No puedo configurar los contornos ahora porque esta sesión no tiene créditos disponibles para ejecutar cambios en el proyecto.
Pendiente exacto para cuando se pueda continuar:
  • Crear/configurar dos contornos de PCB en el mismo layout:
    • Placa superior: 35 mm × 20 mm
    • Placa inferior: 18 mm × 10 mm
  • Separarlas físicamente en el canvas para fabricación/panelización.
  • Mantener la placa superior para USB‑C, carga, regulación, ESP32‑C3, OLED y LEDs.
  • Mantener la placa inferior para fototransistor y resistor pulldown.
  • Validar que los contornos queden correctos antes de colocar componentes.
Cuando haya créditos disponibles, puedo aplicar esos contornos y seguir con la colocación.
Configurar contornos después
Crear contornos manualmente
Revisar dimensiones
Separar placas
Guardar dimensiones
U4
J1
J3
R5
Resistance
10000 Ω
U1 IO5 - D1 IR Anode
U3 OUT+ - SW1 ~
R4
Resistance
4700 Ω
U4 VOUT - C4 P1
U2 ~{FLAG} - R9 P2
U1 IO9 - DS1 SCL
J1 CC2 - R2 P1
U1 IO5 - D1 IR Anode
U4 VOUT - C4 P1
R3
Resistance
4700 Ω
U2 OUT - C2 P1
D1 IR Cathode - R7 P1
Q1 E - R8 P1
J1 DP2 - U1 IO19
D1 IR Cathode - R7 P1
U2 OUT - C2 P1
Q1 E - R8 P1
U4 VOUT - C4 P1
U2 ~{FLAG} - R9 P2
U4 VOUT - C4 P1
U3 BAT+ - J2 1
Q1 E - R8 P1
U4 VOUT - C4 P1
SW1 ~ - U4 VIN
J1 VBUS_B - U2 IN
U4 VOUT - C4 P1
J1 VBUS_B - U2 IN
U3 OUT+ - SW1 ~
D1 RED Cathode - R6 P1
J1 DN1 - J1 DN2
U4 VOUT - C4 P1
J1 CC2 - R2 P1
U1 IO9 - DS1 SCL
J1 DN1 - J1 DN2
U3 BAT+ - J2 1
R9
Resistance
1000000 Ω
U4 EN - C3 P1
J1 DP2 - U1 IO19
U1 IO4 - D1 RED Anode
R2
Resistance
5100 Ω
J1 CC1 - R1 P1
J1 CC1 - R1 P1
U4 EN - C3 P1
Q1 E - R8 P1
U1 IO8 - DS1 SDA
R6
Resistance
220 Ω
U4 VOUT - C4 P1
U1 IO8 - DS1 SDA
U1 EN - R5 P2
U1 IO8 - DS1 SDA
U1 EN - R5 P2
U1 IO9 - DS1 SCL
SW1 ~ - U4 VIN
U1 IO4 - D1 RED Anode
R8
Resistance
10000 Ω
J1 VBUS_B - U2 IN
U4 VOUT - C4 P1
U2 OUT - C2 P1
J1 DN1 - J1 DN2
D1 RED Cathode - R6 P1
U4 VOUT - C4 P1
R7
Resistance
220 Ω
R1
Resistance
5100 Ω
U1 EN - R5 P2
U4 VOUT - C4 P1
U2 OUT - C2 P1
U3
C7 P2 - U1 GND
J1 SHIELD - U2 GND
J1 SHIELD - U2 GND
GND
U3 BAT- - J2 2
J1 SHIELD - U2 GND
U3 BAT- - J2 2
U3 BAT- - J2 2
J1 SHIELD - U2 GND
J1 SHIELD - U2 GND
C7 P2 - U1 GND
GND
U3 BAT- - J2 2
C7 P2 - U1 GND
U3 BAT- - J2 2
U3 BAT- - J2 2
J1 SHIELD - U2 GND
J1 SHIELD - J1 SHIELD
U3 BAT- - J2 2
GND
J1 SHIELD - U2 GND
J1 SHIELD - U2 GND
J1 SHIELD - J1 SHIELD
U3 BAT- - J2 2
GND
C7 P2 - U1 GND
U3 BAT- - J2 2
U3 BAT- - J2 2
Q1
U2
C4
Capacitance
1 uF
C3
Capacitance
1 uF
C2
Capacitance
1 uF
C7
Capacitance
100 nF
J2
C1
Capacitance
1 uF
D1
C5
Capacitance
10 uF
U1
C6
Capacitance
100 nF
DS1
SW1

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Project Specification: ESP32-C3 Optical Clip
Project Overview
Status: Draft. Two-board optical clip electronics with an upper control/power/display board and a lower optical receiver board.
Intended Use
Consumer-use prototype clip with LEDs pointing downward toward a phototransistor receiver. Powered by USB-C and a single-cell LiPo battery.
What the Device Should Do
  • Power from USB-C 5 V and charge a LiPo cell.
  • Run from the LiPo through an ON/OFF switch and 3.3 V LDO.
  • Use ESP32-C3 for Wi-Fi/BLE capability and USB programming via GPIO19/GPIO18.
  • Display information on a 0.96 in I2C OLED.
  • Drive 660 nm red and 940 nm infrared LEDs.
  • Read phototransistor signal through ADC on GPIO0 via a 3-wire inter-board connector.
Main Features
  • USB-C 5 V sink input with CC pull-down resistors.
  • LiPo charging using TP4056-class charger/power path as requested.
  • 3.3 V rail using AP2112K-class LDO.
  • ESP32-C3 Wi-Fi + BLE MCU module.
  • I2C OLED on GPIO8/GPIO9.
  • Red LED on GPIO4 and IR LED on GPIO5.
  • Lower-board PT1302B phototransistor receiver with pulldown resistor.
System Architecture

Diagram


USB-C node_5V TP4056 LiPo Charger LiPo Battery ON/OFF Switch AP2112K 3.3V LDO ESP32-C3 0.96in I2C OLED 660nm Red LED 940nm IR LED 3-Wire Interboard Connector PT1302B Phototransistor Board
Hardware Subsystems
  • Upper board: USB-C, charger, LiPo connector, switch, LDO, ESP32-C3, OLED, LED drivers, inter-board connector.
  • Lower board: phototransistor and pulldown, aligned mechanically with LEDs.
Interfaces and Connections
  • USB-C: VBUS, GND, D+, D-, CC1, CC2.
  • USB data: D+ to ESP32-C3 GPIO19, D- to GPIO18.
  • I2C: OLED SDA to GPIO8, SCL to GPIO9.
  • LED outputs: GPIO4 red, GPIO5 IR.
  • ADC input: phototransistor emitter node to GPIO0.
  • Inter-board connector: 3.3 V, GND, ADC signal.
Power and Runtime Expectations
  • USB-C 5 V input when charging/programming.
  • LiPo battery powers device through switch and 3.3 V LDO.
  • Low-power firmware should duty-cycle LEDs, OLED, and radios.
Power Tree and Power Budget
Initial estimate to be updated from datasheets during implementation: USB-C 5 V -> charger/protection -> LiPo -> switch -> AP2112K 3.3 V -> ESP32-C3, OLED, LEDs, phototransistor.
Manufacturing and Assembly Expectations
Compact SMD design suitable for consumer prototype. Two small PCBs connected by 3-wire cable/JST connector. Antenna keepout required for ESP32-C3 module.
Firmware-Relevant Hardware Requirements
  • Native USB programming on GPIO18/GPIO19.
  • ADC sampling on GPIO0.
  • I2C OLED on GPIO8/GPIO9.
  • GPIO-controlled LED timing on GPIO4/GPIO5.
Physical Design Expectations
Upper board sits on top of clip with LEDs pointing downward. Lower board sits below with phototransistor aligned to LEDs. ESP32-C3 antenna must face outward at board edge with copper keepout.
Important Design Decisions
  • ESP32-C3 module preferred over bare chip to avoid RF design risk.
  • USB-C is sink-only, no USB-PD controller unless later requested.
  • LiPo charging follows user's TP4056 architecture, but true load sharing/protection may require an enhanced charger/power-path IC.
Assumptions
  • Single-cell LiPo battery.
  • OLED is 3.3 V compatible I2C SSD1306-style module/display.
  • LEDs are GPIO-driven at modest current; exact current may be adjusted for safe ESP32 GPIO limits.
  • User accepts SMD parts unless later requesting hand-solderable parts.
Change Notes
  • Revised from environmental sensor node to two-board optical clip design per user request.
  • Project Overview

  • Intended Use

  • What the Device Should Do

  • Main Features

  • System Architecture

  • Hardware Subsystems

  • Interfaces and Connections

  • Power and Runtime Expectations

  • Power Tree and Power Budget

  • Manufacturing and Assembly Expectations

  • Firmware-Relevant Hardware Requirements

  • Physical Design Expectations

  • Important Design Decisions

  • Assumptions

  • Change Notes

Assets

Assets are files uploaded to this project which can be used in various ways.

ESP32-C3 Optical Clip thumbnail
Two-board ESP32-C3 optical clip with USB-C LiPo charging, OLED display, red/IR LEDs, and remote phototransistor receiver.

Properties

Properties describe core aspects of the project.

Pricing & Availability

Distributor

Qty 1

Arrow

$1.00–$1.42

Digi-Key

$10.95–$11.19

HQonline

$0.18

LCSC

$3.82–$3.88

Mouser

$11.06

TME

$2.12

Verical

$0.78–$1.40

Controls