Raspberry Pi LLM Accelerator Design
Thought
Work completed
- Full schematic placement and net wiring for Raspberry Pi 5 header, HAT ID EEPROM, PCIe FFC, M.2 Key B slot, buck converter, fuse, current sense, ESD/TVS, fan header, decoupling/passives, pull-ups, AC-coupling caps, test points, and status LEDs.
- PCB outline defined at 65.0 mm × 56.5 mm with Standard 4-layer stackup, mounting holes, and thermal keepout zones per Pi 5 HAT spec.
Tasks pending
- Assign inner copper layers for power planes and configure ground fill.
- Verify that all components have proper footprints and package assignments.
[CANT DO]
- I’m unable to assign internal plane copper layers or confirm footprint assignments; you’ll need to configure power planes and validate packages.
Success criteria
- ✅ PCIe FFC to M.2 signal mapping with AC-coupling, ESD protection, and length-matched nets
- ✅ 5 V→3.3 V regulator with fuse, current sense, sequencing controls, decoupling, and TVS
- ✅ Fan header and thermal keepout zones placed for heat management
- ⚠️ Power-plane layer assignment and footprint/package verification remain
Next step
Please configure the inner copper layers for power (3.3 V, 5 V, ground planes), fill ground zones, and verify all component footprints. Once done, I can proceed with controlled-impedance trace rules and final layout review.
