PCB Design Help


Understood—I’ll treat this as a preliminary selection draft, not lock the parts into Route A Tier 2 yet. I’ll clearly flag the F2 diplexer’s unused high-band-port decision for later validation.### Preliminary replacement draft
  • F2 — TDK DPX162690DT-8058A1
    • 698–960 MHz low-band path, 50 Ω
    • 1.6 × 0.8 mm, 0603
    • Pin 2 common input, pin 6 low-band output
    • Pins 1, 3, 5 ground; pin 4 high-band port
    • No external LC matching; use 50 Ω transmission lines
    • Open issue: TDK does not specify whether unused pin 4 should be open or terminated. Confirm with TDK or prototype both configurations before locking it.
  • F3 — Johanson 2450BP08C0100002T
    • 2400–2500 MHz, 50 Ω
    • 1.1 × 0.9 × 0.45 mm
    • Pin 1 input, pin 4 output
    • Pins 2, 3, 5 ground
    • No external matching; use 50 Ω transmission lines and close ground vias
    • 1.2 dB maximum insertion loss; 12 dB minimum return loss
Draft recommendation: F3 is ready to adopt. F2 is electrically suitable and exceptionally compact, but remains provisional because it is a diplexer rather than a dedicated two-port BPF.
Document these preliminary F2 and F3 selections in the Route A Tier 2 BOM, keeping F2 marked provisional.
Updated the Designator-Level BOM with both preliminary selections. F2 remains explicitly provisional pending validation of its unused high-band port; F3 includes its verified pinout and no-match requirement.
draw the schematic
I’ll build a draft Route A Tier 2 schematic from the documented BOM, using the selected F1/F2/F3 parts where available and explicit placeholders for unresolved NFC, power-path, antenna-split, and CH6 details. I’ll then run a connectivity/ERC review and report every assumption that still blocks a release-ready schematic.
I prepared the complete Route A Tier 2 schematic build plan, including six detector channels, selected filters, op-amps, LEDs, NFC/power paths, and provisional placeholders. No schematic objects were added because the account has no available ACUs.
Remaining work:
  • Place and wire the full draft schematic.
  • Run ERC/connectivity verification.
  • Document unresolved assumptions directly in the schematic.
Once ACUs are available, I can execute the prepared build without further requirements.
Review build assumptions
Document design decisions
Review BOM risks
No schematic yet

Talk to Flux to get started.

Designator-Level BOM
Reconstruction target decision (2026-08-12): Route A Tier 2 / A-XIAO full configuration. Route B and Tier 1 are out of scope for the first schematic reconstruction. Tier 2 includes the six parallel detector channels, LEDs, R51–R56 analog bridges, XIAO module, NFC tag/harvesting path, supercapacitor, CR2032 path, and XIAO 5 V backfeed ORing path.
Basis and precedence
This expansion uses the Route A v0.5 schematic SVG as the authoritative source for designators and values, with rf-energy-sniffer_BOM_v05.xlsx for packages and tier populations. The re-uploaded tier workbook is v0.4 and is retained only as historical comparison; its 0402 passives, SGM8042 amplifiers, SMA, LNA, TPS63900, USB-C, and five-diode power scheme were explicitly removed or changed by v0.5.
Population codes: F = fitted, DNP = not fitted, OPT = optional/selection dependent, ? = source conflict or insufficient information.
Route A — source-backed designator BOM

Table


Designator(s)QtyFunctionValue / MPNPackage / implementationTier 1Tier 2Source status / unresolved data
ANT11Wideband antennaPCB monopole/meander, claimed 0.7–6 GHzPCB copperFFExact geometry/feed/matching missing
C1, C22CH1 filter capacitors100 nF0805FFVoltage rating, dielectric, tolerance missing
L1, L22CH1 filter inductors220 nH0805FFSRF/Q/current/tolerance missing; value is tuning start point
C3, C4, C53CH2 filter capacitors47 pF0805FFC0G/NP0 and tolerance should be specified
L3, L4, L53CH2 filter inductors150 nH0805FFSRF/Q/current/tolerance missing; value is tuning start point
F11CH3 band filterMini-Circuits BFTC-500+6-SMD LTCC, 3.81 × 3.81 mm, case FR933-1FF50 Ω internally matched; pin 2 RF IN, pin 5 RF OUT, pins 1/3/4/6 GND. No external matching required. Passband is 400–600 MHz rather than 400–510 MHz, so signals from 510–600 MHz will also reach CH3 and upper-band selectivity is reduced. Add RF-port DC-blocking capacitor(s) only if DC is present.
F21CH4 band filterTDK DPX162690DT-8058A1 (provisional)6-terminal multilayer diplexer, EIA 0603, 1.6 × 0.8 mmFFProvisional selection. 50 Ω low-band path covers 698–960 MHz. Pin 2 = common/input, pin 6 = low-band output, pins 1/3/5 = GND, pin 4 = unused high-band port. No external LC matching; use 50 Ω transmission lines. Datasheet does not specify whether unused pin 4 should be left open or terminated, so validate before locking the schematic.
F31CH5 band filterJohanson 2450BP08C0100002T5-terminal ceramic SMD, 1.1 × 0.9 × 0.45 mmFFPreliminary selection suitable for adoption: 50 Ω, 2400–2500 MHz, 1.2 dB max insertion loss and 12 dB min return loss. Pin 1 = input, pin 4 = output, pins 2/3/5 = GND. No external matching; use 50 Ω transmission lines and close ground vias.
F41CH6 band filterPCB microstrip BPF, 5.725–5.875 GHzPCB copperFFExact topology and dimensions missing
D1–D66Zero-bias RF detectorSMS7630-040LFSOD-882FFPin mapping and polarity must be verified
C11–C166Detector smoothing capacitors100 pF0805FFC0G/NP0/tolerance/voltage missing
R11–R166Detector loads100 kΩ0805FFTolerance/power rating missing
U1, U22Quad video op-ampsSGM8044TSSOP-14FFFull orderable MPN and physical channel-to-pin mapping missing
R21–R266Op-amp feedback resistors30 kΩ0805FF1% recommended but not source-specified
R31–R366Op-amp gain-to-ground resistors1 kΩ0805FF1% recommended but not source-specified
LED1–LED66Channel indicatorsGreen, Vf approximately 2 V0805FFExact MPN, polarity, brightness/bin missing
R41–R466LED current limiting680 Ω0805FFTolerance/power rating missing
R51–R566Optional analog-output bridges0 Ω0805DNPOPT/FFit only when XIAO is powered and voltage-compatible
C61, C622U1/U2 supply decoupling100 nF0805FFExact association U1/U2 implied; bulk capacitance not defined
U31NFC tag / energy harvestingST25DV16KSource says SO-8, unverifiedDNPFExact suffix/package/pinout/support circuit missing
D10–D134Source ORingRB520S-30SOD-523See noteFTier 2 fits all four; diode orientation/net roles require confirmation
D121 of aboveTier 1 battery isolation per v0.5 BOMRB520S-30SOD-523F?FConflicts with schematic labeling and tier behavior; confirm before release
ZD11Rail clamp5.1 V ZenerSOD-323DNPFExact MPN, power rating, tolerance, polarity missing
C_SUP1NFC burst storage1 F / 5.5 V supercapacitorSMD TBDDNPFExact MPN, footprint, ESR/leakage/polarity missing
BT11Coin-cell holderCR2032 holderSMD TBDFFExact holder MPN/footprint missing
CELL11Coin cellCR2032, 3 V, 225 mAhOff-board/fitted to BT1OPT/FOPT/FExternal purchase; tier description conflicts on Tier 1 battery inclusion
XIAO11Optional MCU moduleXIAO ESP32-S3 or SAMD21Module footprint TBDDNPFProvisional designator; exact variant and pad mapping missing
L_NFC1NFC harvesting coilPCB coilPCB copperDNPFProvisional designator; source conflicts: 25×35 mm versus 15×24 mm; turns/tuning missing
MH1–MH44Mounting holesM2NPTH/PTH TBDFFPresent in PCB reference, absent from BOM; hole and annular-ring definition needed
PCB11Main PCB120×30 mm surfboard, 2-layer, 1.0 mm FR-4, 1 ozCustom PCBFFExact outline is available as SVG path; fabrication stackup/tolerances still required
Route A quantity summary
Excluding PCB copper structures, mounting holes, battery, and XIAO module:
  • Fixed discrete/component placements before tier options: 64
  • Optional analog bridges R51–R56: 6
  • Tier 2 power/NFC additions represented above: U3, D10–D13, ZD1, C_SUP, and NFC coil
The v0.5 worksheet’s area estimate reports 50 fitted 0805 parts for Tier 1 and 56 for Tier 2. The explicit schematic expansion contains 47 non-LED 0805 passives plus 6 LEDs = 53 nominal 0805 placements when R51–R56 are included, or 47 when they are DNP. This does not reconcile exactly with the area worksheet, indicating that some “matching miscellaneous” or power-support passives remain undocumented.
Missing aggregate rows that cannot yet be assigned designators

Table


Source BOM rowIntended quantityWhy it cannot be expanded safely
RF matching miscellaneous passive set1 set per boardNo values, topology, count, or channel allocation
ST25DV support passivesNot listedI²C pull-ups, GPO pull-up, decoupling, address/configuration, and NFC tuning parts absent
Power-path supportNot listedNo inrush/current limiting, rail bulk capacitor, discharge path, or test points specified
CH1 LNA / Si2302 load switchRemoved in v0.5Appears only in v0.4 and one stale schematic note; excluded pending explicit reinstatement
Route B — components known, designators not source-backed
The Route B entries exist only as grouped BOM rows and block-level text. No Route B schematic or designator mapping was provided in the reviewed files, so assigning references would be invention.

Table


ComponentQtyValue / MPNPackageTier 3Missing for expansion
RF switch1PE4250QFN TBDFExact suffix, pinout, control nets, matching, designator
Log detector1AD8318QFN TBDFExact suffix, support network, pin mapping, designator
MCU module1ESP32-S3-MINI-1ModuleFExact suffix/flash/antenna variant, pin allocation, designator
LDO1ME6211-3.3SOT-23-5FExact suffix, capacitor values, pin mapping, designator
USB-C connector116-pinTYPE-C TBDFMPN/footprint, CC resistors, ESD, netlist, designator
Decoupling/peripheral set1 setUnspecified0805FComponent count, values, ratings, and designators
v0.4 items intentionally excluded from the v0.5 Route A BOM
  • SMA connector
  • 100 pF SMA/input DC-block capacitor
  • RCLAMP0524P input TVS
  • SGM8042 dual op-amps and 0402 passives
  • PSA4-5043+ CH1 LNA, LNA support network, and Si2302 load switch
  • TPS63900 buck-boost and its support network
  • Board-mounted USB-C for Route A
  • Fifth ORing diode D14
These should not be added unless the user explicitly chooses to restore the v0.4 architecture.
Decisions required before procurement release
  1. Resolve the unused high-band-port treatment for provisional F2 DPX162690DT-8058A1 before locking its netlist. F3 is preliminarily selected as 2450BP08C0100002T; F1 is fixed as BFTC-500+ with its documented 400–600 MHz passband trade-off.
  2. Select the exact XIAO and ST25DV variants.
  3. Resolve D10–D13 connectivity and Tier 1’s fitted diode/battery behavior.
  4. Define the NFC coil and complete its tuning/support network.
  5. Define the RF branch/matching passive set.
  6. Assign exact MPNs/ratings to all generic passives, LED, supercapacitor, holder, and Zener.
  7. Provide the Route B detailed schematic before assigning its designators.
  • Basis and precedence

  • Route A — source-backed designator BOM

  • Route A quantity summary

  • Missing aggregate rows that cannot yet be assigned designators

  • Route B — components known, designators not source-backed

  • v0.4 items intentionally excluded from the v0.5 Route A BOM

  • Decisions required before procurement release