MIDI Device Build


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Understood—I’ll use the Pico Plus 2 only as the reference architecture, not as a module. The custom board will use a bare RP2350B with 16 MB QSPI flash, 8 MB PSRAM, USB-C, and the required RP2350 power/clock/boot circuitry, integrated with the MIDI and battery sections.
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"Bare RP2350B Schematic" completed.
The design direction was corrected to a custom bare RP2350B board equivalent to the Pico Plus 2 architecture, with 16 MB QSPI flash, 8 MB PSRAM, USB-C, BQ24074 power-path charging, TPS63031 power conversion, MIDI I/O, buttons, OLED, and battery monitoring. Forty-two schematic components have been selected and added.
Open items
  • The schematic is not yet wired; the project currently reports 0 nets.
  • Verify the completed component selection and remove any remnants of the abandoned module-based approach.
  • Arrange and wire every functional block.
  • Update the Project Specification and project description from Pico 2 module to bare RP2350B.
  • Run ERC and an independent electrical review.
  • Create the firmware pin map and board bring-up plan.
  • PCB layout has not started.
Execution stopped because your ACUs ran out.

Project Specification
Project Overview
  • Status: Review
  • Portable, battery-powered MIDI utility/controller based on a Raspberry Pi Pico 2 (RP2350).
  • Production intent: accessible assembly for prototypes through low-thousands volume, prioritizing available modules and conventional 2-layer PCB assembly.
Intended Use
  • Handheld or desktop music device used between computers, synthesizers, and other MIDI equipment.
  • Firmware already exists; hardware must expose reliable USB-MIDI and traditional DIN MIDI connections.
What the Device Should Do
  • Send and receive USB MIDI through USB-C.
  • Receive galvanically isolated MIDI through a 5-pin DIN input.
  • Transmit MIDI through a 5-pin DIN output.
  • Accept four momentary button inputs.
  • Show status and menus on a small OLED display.
  • Operate from USB power or an internal rechargeable battery, including operation while charging.
Main Features
  • Raspberry Pi Pico 2 module with RP2350.
  • USB-C for power, programming, and USB 2.0 device data.
  • 5-pin DIN MIDI IN and MIDI OUT.
  • Four front-panel tactile buttons.
  • 0.96-inch 128x64 SSD1306-compatible I2C OLED.
  • Protected 1-cell 1000 mAh LiPo battery.
  • Power-path charging, power switch, and battery state monitoring.
  • SWD/debug pads and production test access.
System Architecture

Diagram


USB-C Protection and power-path charger 1-cell LiPo Pico 2 VSYS USB D+ and D- Pico 2 / RP2350 I2C OLED 4 buttons DIN MIDI IN Optocoupler MIDI OUT buffer DIN MIDI OUT Battery monitor
Hardware Subsystems
Compute
  • Raspberry Pi Pico 2 castellated module to reduce clock, flash, regulator, and RP2350 escape-layout risk.
  • Use GPIO assignments compatible with the existing firmware; initial pin map will be documented after schematic capture.
USB
  • USB-C receptacle configured as a USB 2.0 device/sink.
  • CC1 and CC2 pull-down resistors, ESD protection, and controlled routing for D+/D-.
  • USB VBUS feeds the charger/power path; USB data connects to the Pico 2 USB pins.
DIN MIDI
  • MIDI IN uses a standards-compatible current loop and optocoupler, preserving galvanic isolation.
  • MIDI OUT uses a 3.3 V-compatible logic buffer and current-limiting network suitable for DIN MIDI receivers.
User Interface
  • Four normally-open tactile switches to GPIO with firmware pull-ups or external pull-ups as required.
  • SSD1306-compatible I2C OLED on a 4-pin board connector/module footprint.
Power
  • 1-cell protected LiPo, nominal 3.7 V, proposed capacity 1000 mAh.
  • USB charger with dynamic power path so the product can operate while charging.
  • Battery monitor/fuel gauge on I2C.
  • Pico 2 powered through VSYS; no separate 3.3 V regulator is planned unless the finalized load budget requires one.
Interfaces and Connections
  • USB-C: USB 2.0 device data and 5 V input.
  • MIDI IN: panel-mounted 5-pin DIN.
  • MIDI OUT: panel-mounted 5-pin DIN.
  • Battery: keyed 2-pin JST-PH connector, polarity clearly marked.
  • Display: 4-pin I2C connection (GND, VCC, SCL, SDA).
  • Debug: SWD and reset/test pads.
Power and Runtime Expectations
  • Operates from USB with or without a battery fitted.
  • Charges while operating.
  • Target charge current: approximately 500 mA, subject to battery rating and thermal verification.
  • Initial runtime target: at least 8 hours typical use from 1000 mAh.
Power Tree and Power Budget
Preliminary 3.3 V / VSYS Loads

Table


LoadTypicalPeakNotes
Pico 2 / RP2350 module45 mA120 mAConservative application estimate pending firmware measurement
0.96-inch OLED20 mA35 mAContent-dependent
MIDI IN optocoupler/output stage5 mA12 mAActive MIDI traffic
MIDI OUT buffer/current loop5 mA15 mAActive transmission
Fuel gauge and support0.1 mA1 mADepends on selected IC
Indicators and margin5 mA15 mAStatus LED plus contingency
Estimated total80 mA198 mAUse 250 mA design target at VSYS
  • Battery worst-case design current: 250 mA plus power-conversion losses; battery and protection should support at least 500 mA continuous.
  • Estimated runtime at 80 mA average from a 1000 mAh cell: roughly 10 hours after conversion and capacity margin; validate on hardware.
  • USB input path and charger will be rated for at least 1 A even though default charging is approximately 500 mA.
Manufacturing and Assembly Expectations
  • Two-layer custom carrier PCB where signal integrity and routing permit.
  • Pico 2 castellated module avoids bare-RP2350 manufacturing complexity.
  • Prefer 0603 passives and common SMT packages; DIN connectors, battery connector, buttons, and display connection may be through-hole for mechanical strength.
  • Select active parts with multiple distributors and avoid obsolete components.
  • Include accessible test pads for VBUS, VSYS, 3V3, GND, SWD, USB data, UART/MIDI signals, and button inputs.
Firmware-Relevant Hardware Requirements
  • USB device connection must use the Pico 2 native USB interface.
  • MIDI UART must support 31.25 kbaud.
  • I2C bus for OLED and battery monitor.
  • Four active-low button GPIOs.
  • Battery-voltage/state information available to firmware.
  • Boot, reset, and SWD access retained.
Physical Design Expectations
  • Provisional enclosure: desktop/handheld rectangular case, approximately 100 x 60 x 25 mm.
  • Provisional PCB envelope: maximum approximately 85 x 50 mm.
  • USB-C centered on one short edge; two DIN connectors on the opposite long or short edge based on fit.
  • OLED and four buttons accessible from the top face.
  • Battery mounted below or beside the PCB with insulation and strain relief.
  • Connector placement, mounting holes, component height, and final board outline remain provisional until the enclosure and exact off-board parts are approved.
Important Design Decisions
  • Use Pico 2 rather than bare RP2350 for fastest and lowest-risk path to production.
  • Use USB-C for combined power, programming, and USB-MIDI.
  • Use isolated DIN MIDI IN.
  • Use a power-path charger rather than a charger-only IC.
  • Use a replaceable 1-cell LiPo connected by JST-PH.
  • Use an I2C OLED to minimize GPIO count.
Assumptions
  • The existing firmware can accept a documented GPIO assignment or be configured to match it.
  • Device is a USB peripheral, not a USB host.
  • No USB Power Delivery is required.
  • No wireless connectivity, audio I/O, rotary encoders, or external storage is required.
  • Indoor consumer use, 0 to 40 C target environment.
  • The provisional enclosure and PCB dimensions require user approval before PCB layout.
Change Notes
  • Initial production-intent brief created from the agreed RP2350/Pico 2, USB-MIDI, DIN MIDI, OLED, four-button, and LiPo requirements.
  • Project Overview

  • Intended Use

  • What the Device Should Do

  • Main Features

  • System Architecture

  • Hardware Subsystems

  • Compute

  • USB

  • DIN MIDI

  • User Interface

  • Power

  • Interfaces and Connections

  • Power and Runtime Expectations

  • Power Tree and Power Budget

  • Preliminary 3.3 V / VSYS Loads

  • Manufacturing and Assembly Expectations

  • Firmware-Relevant Hardware Requirements

  • Physical Design Expectations

  • Important Design Decisions

  • Assumptions

  • Change Notes