Work done
- Updated project description to “Through-Hole Breakout Board for Tinysine TS3008 Bluetooth Audio Module” with relevant hashtags.
- Confirmed the TS3008 footprint includes terminal symbols for all available signals.
- Defined and saved the system architecture; provided a Mermaid diagram showing the module connected to headers and mounting holes.
- Added four through-hole mounting hole components to preserve existing hole sizes.
- Added 2.54 mm through-hole single-row pin headers for power, USB, audio, and GPIO signal groups.
- Connected each TS3008 terminal to its corresponding header pin and renamed nets to match module labels.
- Defined a rectangular board outline and resized the PCB layout accordingly.
Tasks remaining
- Place the TS3008 module, all pin headers, and mounting holes on the PCB within the defined outline (step 5.1).
- Route all nets using Auto-Layout for short, direct connections (step 6.1).
- Run ERC and resolve any schematic errors (step 7.1).
- Run DRC and fix any layout violations (step 7.2).
- Generate Gerber files for fabrication (step 8.1).
- Export the BOM and pick-and-place files for assembly (step 8.2).
Success criteria review
- Signals accessible via through-hole headers: ❌ (placement and full routing not yet completed)
- Through-hole–only components (module as sole SMD), preserved mounting hole sizes, reasonable board size: ❌ (outline set, but placement and routing outstanding)
- ERC/DRC clean and manufacturing files generated: ❌
Recommended next step
Proceed with component placement on the PCB (step 5.1), then run Auto-Layout routing (step 6.1) to move toward validation and file generation.