Getting Started with Flux

flux

હા—હવે સીધા આ Flux projectમાં જ કામ કરીશ, local KiCad copyમાં નહીં. પહેલાં fresh ERC/DRC તપાસીશ, પછી સાચી wiring/placement સમસ્યાઓ સુધારી routing આગળ વધારીશ; errors છુપાવવા rules ઢીલા નહીં કરું.
Worked for 4 mins 25 sec
Thought for 15 sec
1/3 Flux projectના fresh checks અને routing blockers તપાસવા
Thought for 8 sec
Completed design checks — found 228 issues.
Thought for 6 sec
2/3 પુરાવા આધારિત electrical/layout fixes અને routing કરવું

Flux projectના fresh checks અને routing blockers તપાસવા

પુરાવા આધારિત electrical/layout fixes અને routing કરવું

Final ERC/DRC અને બદલાવ verify કરવું

Thought for 24 sec
Awaiting 1 task
Thought for 5 sec
Checking routing progress.
"Flux PCB Routing Repairs" completed.

flux

આ વખતે સીધા તમારા Flux projectમાં તપાસ અને USB breakoutનો પ્રયાસ કર્યો, પરંતુ કોઈ wiring, placement કે routing બદલાવ save થયો નથી.
Fresh inspection મુજબ:
  • 153 airwires બાકી છે; redundant traces 0 છે.
  • J2–J7ના 12 keepout errors અને 10 ERC errors બાકી છે.
  • 52 missing-MPN errors અને એક board-density warning મળ્યાં છે.
  • USB breakout આસપાસના અન્ય copperથી blocked છે; નવા USB traces બન્યા નથી. Header geometry/checker discrepancy અને stackup thicknessની અસ્પષ્ટતા હજી unresolved છે.
આગળ USBના actual copper blockers સુધારવા, header clearance અને stackup reconcile કરવા, પછી routing તથા fresh ERC/DRC જરૂરી છે—errors છુપાવવા rules ઢીલા કર્યા નથી. Project હજી manufacturing કે flight માટે ready નથી; તમારા ACUs પૂરા થતાં execution રોકાયું.

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Files

Schematic

Layout

3D View

Schematic is Auto-placed

The schematic has been arranged automatically. Flux can redraw it to be more readable, with components placed in related groups and wires drawn more legibly. This takes about 10-60 mins.

Local KiCad Engineering Handoff
પુરાવાની સ્થિતિ
2026-10-09ના current Flux projectના live stackup, rulesets અને તમામ 80 componentsની properties વાંચીને આ નોંધ બનાવી છે. આ configured project values છે; manufacturer-approved stackup PDF, fabrication order અથવા actual measurements નથી. Circuit/layout/rules બદલ્યાં નથી. Local KiCad copyમાં rules અલગ હોઈ શકે; નીચેના આંકડા આપમેળે KiCadમાં લાગુ થયેલા છે એમ ન માનશો.
Fabricator / board identification

Table

વિષયહાલની માહિતીસ્થિતિ
Selected stackup profileJLCPCB SDI 4 Layer v1; actual geometry label JLCPCB SDI geometry - GND referencesFluxમાં applied
Manufacturing rules profileStandard Density SDI v3, Flux officialapplied; આ standalone vendor acceptance નથી
Actual ordered PCB manufacturerunknownfabrication order ઉપલબ્ધ નથી
Manufacturer stackup code / PCB fabrication part numberunknownproject profileને vendor stackup code ન ગણશો
Finished board thickness / toleranceunknownfinished-thickness definition અને fab drawing unverified
Copper finish, plating build-up, material grade, Tg, Dk toleranceunknownvendor document જરૂરી
Measured physical PCB geometry/thicknessunknownassembled board measurements ઉપલબ્ધ નથી
Configured four-layer stackup

Table

ક્રમLayer/materialભૂમિકાThicknessConfigured εr
1Top copperSignal0.035 mm, nominal 1 oz—
2FR-4 dielectricL1–L2 separation0.210 mm4.4
3Mid-Layer 1 copperGND plane0.035 mm, nominal 1 oz—
4Core dielectricL2–L3 separation1.065 mm4.6
5Mid-Layer 2 copperGND plane0.035 mm, nominal 1 oz—
6FR-4 dielectricL3–L4 separation0.210 mm4.4
7Bottom copperSignal0.035 mm, nominal 1 oz—
Solder mask configured 0.025 mm each side, εr 4. Silk/paste each configured 0.010 mm per side; solder-paste thickness must not be used as bare-board thickness.
Arithmetic only: dielectric total 1.485 mm; dielectric + all four copper layers = 1.625 mm; adding two configured masks = 1.675 mm. Previous/exported substrate aggregate 1.555 mm equals dielectric + two inner copper layers. These numbers are not verified finished-board thickness. Do not change core simply to force an aggregate match. Actual outer finished copper after plating, tolerance, compression and mask inclusion remain unknown.
Minimum rules vs actual manufacturer capability

Table

Requested itemLive configured project valueManufacturer-verified specification
Minimum trace width0.127 mmunknown
Preferred general signal width0.15 mmunknown
Minimum trace/copper spacing0.127 mm; preferred 0.15 mmunknown
Via hole minimum / configured through-hole0.25 mmunknown; drill-tool vs finished-hole convention not confirmed
Via pad minimum / configured diameter0.55 mmunknown
Via nominal annular ring(0.55 − 0.25)/2 = 0.15 mmguaranteed minimum unknown; no drill/registration allowance calculated
Component pad/slot hole floor0.50 mm proxyunknown; PTH/NPTH/slot class limits not separately verified
Via-to-via clearance0.30 mm Flux via-object proxyunknown; do not infer drill-wall spacing
PTH-pad to PTH-pad0.45 mm copper-edge proxyunknown
PTH-pad to trace0.30 mm proxyunknown
NPTH copper clearance0.20 mm minimum, 0.25 mm preferredunknown
Copper-fill board inset0.50 mmunknown; not an all-feature edge-clearance guarantee
SMD soldermask expansion0.050 mmunknown
Through vias are configured L1→L4, pad 0.55 mm / hole 0.25 mm; no verified microvia, blind/buried-via or impedance-qualified process is specified. Declared plane roles are intent, not proof of completed copper-plane connectivity.
Net-specific widths (do not flatten into one rule)
EXT_5V_INPUT / EXT_5V_FUSED / CORE_5V: 0.30 mm; 3V3: 0.25 mm; 3V3_IMU: 0.15 mm; USB_VBUS: 0.15 mm; GND escape: 0.127 mm. These are existing engineering allocations, not motor-current routing. Full vendor stackup is needed before treating USB 90 Ω targets as realized copper impedance.
Manufacturer / part numbers in the captured project
These are source BOM/property declarations, not independent pin/footprint qualification. Linked datasheets are stored source URLs; availability/current revision has not been checked in this handoff.

Table

ReferencesManufacturerMPNStored datasheet / drawing
U1STMicroelectronicsSTM32F405RGT6Stored datasheet
U2TDK InvenSenseICM-42688-PStored datasheet
U3WinbondW25Q128JVSIM TRStored datasheet
U4/U5Diodes IncorporatedAP2112K-3.3TRG1Stored datasheet
J1GCTUSB4105-GF-A-120Stored spec / mechanical drawing
J2–J7Würth Elektronik61300611121Stored drawing
Q1Infineon2N7002H6327XTSA2Stored datasheet
D2STMicroelectronicsUSBLC6-2SC6Stored datasheet
D3–D7NexperiaPRTR5V0U4D,125Stored datasheet
D8SlkorSS14Stored datasheet
F2Littelfuse0603L050YRStored datasheet
Y1AbraconASE-8.000MHZ-L-C-TStored datasheet
C5/C6MurataGRM21BR71C225KA12LStored datasheet
C16–C19MurataGRM21BR71C475KE51Lmanufacturer graph/qualification provenance is in prior project notes; no guaranteed full-condition qualification claimed
Other capacitorsunknownunknowngeneric, source voltage rating16 V, tolerance10%, 0603; per-value dielectric/bias/ripple qualification required
R1–R36unknownunknowngeneric0603, source power rating0.1 W/tolerance1%; R28 source voltage rating50 V; concrete part qualification pending
Mechanical and power facts / limits
39×39 mm prototype board target and 30.5×30.5 mm mounting spacing; exact Ø4 mm side-open notch geometry unknown/unverified, no authoritative CAD drawing supplied. Original 4.9 mm height compatibility with current through-hole headers unverified. No stack mating or connector cable compatibility claim.
FC input policy captured in source: external regulated 4.75–5.25 V, current-limited; raw LiPo not allowed on power input. USB is data/sensing only, not core board power. Peripheral ports are custom pinouts, not verified stock-stack cable compatible. Battery-voltage sense is not a battery-power input. ESC manufacturing stackup/power stages and 55 A testing are outside this FC handoff and unknown/unverified.
Safe local handoff
  1. Preserve original files/backup. Verify exported KiCad rules separately: legacy export defaults may differ from live Flux values.
  2. Qualify physical datasheet pin numbers/electrical types and footprint geometry before making ERC-driven edits. No blanket PWR_FLAG/NC or relaxed rules to hide issues.
  3. Select manufacturer stackup/order code and obtain actual capability/tolerance document before committing thickness, impedance or minimum drill/annular ring constraints.
  4. Keep a change log and return schematic, PCB, project, local libraries and full ERC/DRC reports. Hardware measurements and load/thermal tests remain separate physical tasks.

  • પુરાવાની સ્થિતિ

  • Fabricator / board identification

  • Configured four-layer stackup

  • Minimum rules vs actual manufacturer capability

  • Net-specific widths (do not flatten into one rule)

  • Manufacturer / part numbers in the captured project

  • Mechanical and power facts / limits

  • Safe local handoff