EMG Board Design Specifications
Thought for 9 sec
- Added 11x Generic Resistor as R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, R11 (Pins: P2, P1)
- Added 26x Generic Capacitor as C1, C2, C3, C4, C5, C6, C7, C8, C9, C10, C11, C12, C13, C14, C15, C16, C17, C18, C19, C20, C21, C22, C23, C24, C25, C26 (Pins: P1, P2)
- Added 1x VLS252012HBX-2R2M-1 as L1 (Pins: P1, P2)
- Added 1x LQP15MN3N9B02D as L2 (Pins: 1, 2)
- Added 1x ANT016008LCS2442MA1 as AE1 (Pins: DUMMY_PAD_1, FEED_POINT, DUMMY_PAD_2, RADIATOR_ELECTRODE)
Thought
Work done
- Reviewed datasheets and pin mapping for the main blocks: U1, U2, U3, IC1, and U4
- Confirmed connector and clock resources for J1, J2, J3, J4, J5, Y2, and Y3
- Added the missing support passives and RF parts needed to complete the design, including the buck inductor L1, RF matching inductor L2, and antenna AE1
- Resolved several implementation details from datasheets, including the ADS1298 input/power pins, BQ24075 charger strap guidance, nRF52840 decoupling requirements, USBLC6 line mapping, and candidate Nordic RF match values
Success criteria review
- ✅ The major functional blocks are selected and present in the schematic: EMG AFE, MCU, USB/charging, battery input, buck regulator, and external connectors
- ✅ Key supporting components for power, clocks, I2C pull-ups, USB-C CC resistors, and RF matching were added
- ❌ The schematic is not yet wired: nets are still incomplete, so SPI, I2C, EMG inputs, USB, charger, and power rails are not fully implemented
- ❌ The layout stage is not yet completed: the 6-layer stackup, 50 ohm RF guidance, placement, and manufacturability checks still need to be applied
- ❌ Final clarification-dependent items are still open in practice: the U3 VSET selection should be finalized against the datasheet table, and the U2 to AE1 RF matching values should be aligned to the Nordic reference for the chosen antenna/layout
Next steps
I am blocked by credit exhaustion, so I cannot make more project changes in this run. The next concrete steps are to wire the full schematic around U1, U2, U3, IC1, J1, J3, and J4; correct any remaining value mismatches; then proceed to PCB layout setup with the required 6-layer stackup, board sizing, and component placement.
I am blocked by credit exhaustion, so I cannot make more project changes in this run. The next concrete steps are to wire the full schematic around U1, U2, U3, IC1, J1, J3, and J4; correct any remaining value mismatches; then proceed to PCB layout setup with the required 6-layer stackup, board sizing, and component placement.
