Resolving Copper DRC Errors
Thought for 7 sec
I can’t cancel that server-side auto-layout job from the chat tools. You’ll need to discard it manually in the Flux UI job/auto-layout panel.
Once it is cleared, send:
rerun focused route
Then I’ll run exactly:
- one routing attempt
- one DRC count check
- stop immediately.
rerun focused route
Thought for 8 sec
I’ll run exactly one routing attempt, then one DRC count check, and stop.
Worked for 47 sec
Routing attempt failed: the same stuck
outOfCredit job is still active.Final DRC count check: 130 items remain.
Inspect stuck job
Manual USB routing
Check USB placement
Generate Rev A docs
Review export readiness
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MacroFab Polarity and Orientation Review — HyperPulse Blade 2
Status
Preliminary review completed from schematic/layout metadata. This is not yet a release sign-off because several generic/placeholder footprints remain and the board still has unrouted airwires/placement spacing issues.
Components requiring explicit orientation / polarity control
Table
| Ref(s) | Type | Required assembly marking / check | Status |
|---|---|---|---|
| U1 | nRF5340 QFN | Pin-1 dot/chamfer on footprint and assembly drawing | Required before release |
| U7 | BQ25180 DSBGA | Pin-A1 marker; X-ray inspection required | Required before release |
| U10 | DRV2605L DSBGA | Pin-A1 marker; X-ray inspection required | Required before release |
| U8 | BQ51013B VQFN EP | Pin-1 marker and exposed-pad orientation | Required before release |
| U11 | W25Q16JV USON | Pin-1 marker | Required before release |
| U12 | MAX17048 TDFN EP | Pin-1 marker and exposed-pad orientation | Required before release |
| U13 | UV sensor placeholder | Pin-1 marker; optical aperture orientation | Replace/verify exact VEML6075 footprint |
| U2,U3,U4,U5,U6 | LGA/module sensors/GPS | Pin-1/orientation markers; optical/RF orientation as applicable | Required before release |
| D1 | WS2812B-Mini RGB LED | Pin-1/DIN/VDD orientation; LED polarity/arrow in assembly drawing | Required before release |
| D2 | BAT54WS diode | Cathode marker on silkscreen/assembly layer | Required before release |
| J3 | LiPo connector | Clearly label VBAT and GND; connector pin-1/polarity | Required before release |
| J1,J2 | U.FL RF connectors | Orientation and keepout; RF launch direction | Required before release |
| Y1,Y2 | Crystals | Pin orientation per footprint | Required before release |
| RT1 | Battery NTC placeholder | Placement against LiPo cell; not polarity-sensitive | MacroFab to source Murata NCP15XH103F03RC |
| Generic capacitors | MLCCs mostly non-polarized | If any are changed to tantalum/electrolytic, add polarity marks | Review after final AVL |
MacroFab release blockers
- Replace/lock all generic passives with exact manufacturer MPNs, voltage ratings, tolerances, and packages.
- Replace or approve placeholders: RT1 Murata NTC, U13 VEML6075, M1 JL1049 LRA, and exact inductor/capacitor MPNs.
- Confirm every IC and diode footprint has pin-1/cathode indicators visible in fabrication/assembly outputs.
- Resolve remaining placement spacing issues and route all airwires.
- Re-run ERC/DRC after final routing and before generating manufacturing files.
Board dimensions
Current compact feasibility outline is 40 mm × 30 mm, 4-layer. The requested 30 mm × 22 mm target is physically smaller than the current component footprint area and is not feasible without reducing component count/package area or moving bulky items off-board.
Status
Components requiring explicit orientation / polarity control
MacroFab release blockers
Board dimensions
