• Terminal
    Terminal
    An electrical connector acting as reusable interface to a conductor and creating a point where external circuits can be connected.
  • Ground
    A common return path for electric current. Commonly known as ground.
  • Net Portal
    A net identifier used to create connectivity to other Net Portal with the same designator. #portal
  • Power Net Portal
    Power net portal is a special schematic object used to define a power or ground net. Power ports allow you to conveniently indicate a power net at any location in the design. Power nets of the same designator automatically connect throughout your design #portal #power
  • Generic Resistor
    A generic fixed resistor for rapid developing circuit topology. Save precious design time by seamlessly add more information to this part (value, footprint, etc.) as it becomes available. Standard resistor values: 1.0Ω 10Ω 100Ω 1.0kΩ 10kΩ 100kΩ 1.0MΩ 1.1Ω 11Ω 110Ω 1.1kΩ 11kΩ 110kΩ 1.1MΩ 1.2Ω 12Ω 120Ω 1.2kΩ 12kΩ 120kΩ 1.2MΩ 1.3Ω 13Ω 130Ω 1.3kΩ 13kΩ 130kΩ 1.3MΩ 1.5Ω 15Ω 150Ω 1.5kΩ 15kΩ 150kΩ 1.5MΩ 1.6Ω 16Ω 160Ω 1.6kΩ 16kΩ 160kΩ 1.6MΩ 1.8Ω 18Ω 180Ω 1.8KΩ 18kΩ 180kΩ 1.8MΩ 2.0Ω 20Ω 200Ω 2.0kΩ 20kΩ 200kΩ 2.0MΩ 2.2Ω 22Ω 220Ω 2.2kΩ 22kΩ 220kΩ 2.2MΩ 2.4Ω 24Ω 240Ω 2.4kΩ 24kΩ 240kΩ 2.4MΩ 2.7Ω 27Ω 270Ω 2.7kΩ 27kΩ 270kΩ 2.7MΩ 3.0Ω 30Ω 300Ω 3.0KΩ 30KΩ 300KΩ 3.0MΩ 3.3Ω 33Ω 330Ω 3.3kΩ 33kΩ 330kΩ 3.3MΩ 3.6Ω 36Ω 360Ω 3.6kΩ 36kΩ 360kΩ 3.6MΩ 3.9Ω 39Ω 390Ω 3.9kΩ 39kΩ 390kΩ 3.9MΩ 4.3Ω 43Ω 430Ω 4.3kΩ 43KΩ 430KΩ 4.3MΩ 4.7Ω 47Ω 470Ω 4.7kΩ 47kΩ 470kΩ 4.7MΩ 5.1Ω 51Ω 510Ω 5.1kΩ 51kΩ 510kΩ 5.1MΩ 5.6Ω 56Ω 560Ω 5.6kΩ 56kΩ 560kΩ 5.6MΩ 6.2Ω 62Ω 620Ω 6.2kΩ 62KΩ 620KΩ 6.2MΩ 6.8Ω 68Ω 680Ω 6.8kΩ 68kΩ 680kΩ 6.8MΩ 7.5Ω 75Ω 750Ω 7.5kΩ 75kΩ 750kΩ 7.5MΩ 8.2Ω 82Ω 820Ω 8.2kΩ 82kΩ 820kΩ 8.2MΩ 9.1Ω 91Ω 910Ω 9.1kΩ 91kΩ 910kΩ 9.1MΩ #generics #CommonPartsLibrary
  • Generic Capacitor
    A generic fixed capacitor for rapid developing circuit topology. Save precious design time by seamlessly add more information to this part (value, footprint, etc.) as it becomes available. Standard capacitor values: 1.0pF 10pF 100pF 1000pF 0.01uF 0.1uF 1.0uF 10uF 100uF 1000uF 10,000uF 1.1pF 11pF 110pF 1100pF 1.2pF 12pF 120pF 1200pF 1.3pF 13pF 130pF 1300pF 1.5pF 15pF 150pF 1500pF 0.015uF 0.15uF 1.5uF 15uF 150uF 1500uF 1.6pF 16pF 160pF 1600pF 1.8pF 18pF 180pF 1800pF 2.0pF 20pF 200pF 2000pF 2.2pF 22pF 20pF 2200pF 0.022uF 0.22uF 2.2uF 22uF 220uF 2200uF 2.4pF 24pF 240pF 2400pF 2.7pF 27pF 270pF 2700pF 3.0pF 30pF 300pF 3000pF 3.3pF 33pF 330pF 3300pF 0.033uF 0.33uF 3.3uF 33uF 330uF 3300uF 3.6pF 36pF 360pF 3600pF 3.9pF 39pF 390pF 3900pF 4.3pF 43pF 430pF 4300pF 4.7pF 47pF 470pF 4700pF 0.047uF 0.47uF 4.7uF 47uF 470uF 4700uF 5.1pF 51pF 510pF 5100pF 5.6pF 56pF 560pF 5600pF 6.2pF 62pF 620pF 6200pF 6.8pF 68pF 680pF 6800pF 0.068uF 0.68uF 6.8uF 68uF 680uF 6800uF 7.5pF 75pF 750pF 7500pF 8.2pF 82pF 820pF 8200pF 9.1pF 91pF 910pF 9100pF #generics #CommonPartsLibrary
  • Generic Inductor
    A generic fixed inductor for rapid developing circuit topology. *You can now change the footprint and 3D model at the top level anytime you want. This is the power of #generics
  • RMCF0805JT47K0
    47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film #forLedBlink
  • 875105359001
    10uF Capacitor Aluminum Polymer 20% 16V SMD 5x5.3mm #forLedBlink #commonpartslibrary #capacitor #aluminumpolymer #radialcan
  • CTL1206FYW1T
    Yellow 595nm LED Indication - Discrete 1.7V 1206 (3216 Metric) #forLedBlink
R1
Resistance
Resistance
L1
Inductance
6.8u H
R4
Resistance
Resistance
VIN
VOUT
FB
R3
Resistance
Resistance
LBI
VIN
R5
Resistance
Resistance
FB
GND
C2
Capacitance
2.2u F
VOUT
LBI
R2
Resistance
Resistance
VIN
C1
Capacitance
10u F
C3
Capacitance
220u F
VOUT
IC1

TPS61032RSAR Module

TPS61032RSAR Module
Description

Created
Last updated by vasyl
1 Contributor(s)
vasyl

Controls

Availability & Pricing

DistributorQty 1
Digi-Key$1.72–$3.07
LCSC$2.93
Mouser$3.29

Assets

Simulation

µs

Simulation Speed

Boost Converter Project Overview

Explain this project in detail. Describe its purpose, core components, and how they interact. Break down the design, implementation, and functionality step by step. Highlight key technologies, dependencies, and design choices, including trade-offs and optimizations. Discuss potential challenges, performance considerations, and real-world applications. If applicable, suggest areas for improvement, scalability, and future enhancements.

Using

General
Project Schematic
Below is an overview of the TPS61032RSAR Module project based on the available project data and schematic details:

Project Purpose
This project implements a boost (step-up) converter module that is based on the TPS61032RSAR from Texas Instruments. Designed as a submodule for power management, the circuit aims for a 96% efficiency while supporting up to 4 A in a switch-mode configuration. The module is intended for applications where an input voltage must be converted to a higher, regulated output voltage with high efficiency.

Core Components

Table


ComponentRoleReference
TPS61032RSAR (IC1)Main boost converter IC performing the switching operation and voltage conversionTPS61032RSAR
Passive Resistors (R1, R2, R3, R4, R5)Form part of the feedback network and other biasing/protection networks. They help set the converter’s output voltage.R1, R2, etc.
Passive Capacitors (C1, C2, C3)Provide decoupling, filtering, and voltage smoothing. One capacitor is used as bulk capacitance while another provides high-frequency noise filtering.C1, C2, C3
Inductor (L1)Serves as the energy storage element during the switching operation; its value is critical for ensuring proper energy transfer.L1
Terminals and Net PortalsVIN and VOUT terminals establish the connection for input and output power, while ground GND components ensure a common return path.Various terminal symbols as defined in the schematic
Route Branch Points and Net Portals (FB, LBI, etc.)Facilitate proper net labeling and connectivity across the schematic, ensuring that critical signals (like the feedback loop) are routed correctly.FB, LBI

How the Components Interact
  1. Power Conversion
    • The TPS61032RSAR is the heart of the design. It regulates the boost conversion process by switching current through the inductor (L1).
    • During the switching cycle, energy is stored in L1 when the switch is closed and then released to the output when the switch opens.
  2. Feedback & Regulation
    • A resistor divider (formed by several of the resistors, e.g., R1, R2, etc.) samples the output voltage and feeds back a portion of it to the IC. This feedback enables the TPS61032RSAR to maintain the desired output voltage.
  3. Decoupling and Filtering
    • Capacitors (C1, C2, and C3) are deployed for decoupling the supply rails and filtering out high-frequency noise generated during switching.
    • Their placement and value selection are crucial to ensure that voltage spikes and ripple are minimized.
  4. Connectivity and Signal Integrity
    • Dedicated terminals (VIN and VOUT) along with net portals and branch points ensure that the correct voltages are distributed properly throughout the circuit.
    • Special attention is given to the ground network, ensuring a consistent reference across the entire design.

Design and Implementation Breakdown
  • Schematic Layout:
    The schematic is drawn in Flux, where each component is placed with its connections clearly defined. Critical nets such as feedback, switching nodes, and power rails are highlighted using net portals and branch points to maintain connectivity throughout the design.
  • Component Selection:
    Values for passive components (capacitors for decoupling/filtering, resistors for setting the output voltage via the feedback network, and an inductor for energy storage) have been chosen by referring to standard industry practices and datasheet recommendations from Texas Instruments. The selection aims to balance efficiency, size, and performance.
  • Signal Flow:
    The TPS61032RSAR regulates the boost conversion:
    • Input Stage: Power is received at the VIN terminal and connected throughout the circuit.
    • Switching Stage: The integrated switch in the IC directs energy through the inductor.
    • Output Stage: Processed energy reaches the output terminal (VOUT) after smoothing by the capacitor network.
  • Design Reviews & Constraints:
    The project review indicates that while many checks (such as missing footprints and portal connections) have passed, there are some Design Rule Check (DRC) errors related to overlapping copper. These will need further review in the PCB layout phase to ensure manufacturability.

Key Technologies and Dependencies
  • Texas Instruments Boost IC: The TPS61032RSAR is critical for achieving high efficiency. Its performance depends on proper passive component selection and PCB layout practices.
  • Component Libraries: Selection of default resistors, capacitors, and inductors from the Flux library ensure that parts are available and compatible with the design.
  • Datasheet Guidelines: Adherence to datasheet recommendations (e.g., decoupling guidelines and feedback network design) is essential to ensure reliable operation.

Considerations and Trade-offs
  • Efficiency Versus Complexity:
    Achieving 96% efficiency in a boost converter involves careful balancing of switching losses, conduction losses, and component parasitics. While high efficiency is a key design goal, it may require fine-tuning of component values and layout strategies.
  • DRC Issues:
    Overlapping copper and trace routing errors noted in the review section suggest potential risks in manufacturability. Addressing these issues might involve redesigning certain net routes or optimizing the PCB footprint placements.
  • Thermal Management:
    At 4 A current, self-heating in the IC and associated power components must be managed. This could require additional thermal vias or heat-sinking considerations in the PCB design.

Potential Challenges and Areas for Improvement
  • Layout Optimization:
    The current design has reported DRC errors (e.g., overlapping copper traces). Tight spatial utilization might require re-evaluating the layout to ensure clearances and design rule compliance.
  • Component Tolerances and Variability:
    The performance of the boost converter is sensitive to the tolerances in the inductor and capacitor values. Options for improvement may include selecting more precise components or adding adjustable elements if critical.
  • Enhanced Protection Circuits:
    Future enhancements might involve integrating additional protection features such as reverse-polarity protection, overcurrent safeguards, or thermal shutdown circuits.
  • Scalability:
    The module’s design, as a reusable boost converter submodule, lends itself to integration into larger power management systems. Improvements could focus on modular interconnects or standardized interfaces to ease inclusion in complex systems.

Real-World Applications
  • Portable and Battery-Powered Devices:
    The boost converter can supply regulated higher voltages from limited battery supplies for devices like handheld electronics, IoT sensors, or wearable technology.
  • Renewable Energy Systems:
    Systems requiring power regulation from variable sources (such as solar panels) can benefit from this efficient boost converter design.
  • Industrial Control Systems:
    Ensuring reliable power delivery in variable industrial environments can be achieved using such high-efficiency converters.

In summary, the TPS61032RSAR Module project embodies a power management solution that leverages a highly efficient boost converter IC, a carefully selected network of passive components, and a structured schematic design for reliable operation. While the current schematic is robust, further refinement in PCB layout and thermal management, along with additional protection circuits, could enhance overall performance and scalability in real-world applications.
List required decoupling capacitors.
Ensure DRC compliance.
Optimize thermal design.

Checks that the power traveling across a given resistor is under its rating with 50% headroom.
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Checks that IC pins that require pull up or pull down resistors have them.
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Checks that capacitors have appropriate voltage ratings to prevent overheating and ensure reliable circuit operation.
Checks that all parts have a part number and are available from distributors.
Reports issues with Auto-Layout if Copilot cannot route something or must ignore a configuration.
Reports parts that have no footprint.
Reports nodes that are assigned to a layer that doesn't exist in the layout stackup.
Reports terminals that are not connected properly. NOTE: Only connections to the center of pads are considered valid.
Reports nodes that are using rules that are not supported anymore.
Reports layers that have multiple copper fills of different nets. Make sure the Connected Layers rule value of nets with fills is valid.
Detect any via, trace or copper fill island that is not connected to any net.