# MSOP-12-1EP_3x4mm_P0.65mm_EP1.65x2.85mm (Component) ## Description MSOP-12-1EP is a small surface-mount package commonly used for integrated circuits. It has a body size of approximately 3 mm x 4 mm (L x W) with 12 pins. The lead pitch between the pins is typically 0.65 mm. The package features an exposed pad (EP) with dimensions of approximately 1.65 mm x 2.85 mm (L x W). The EP is used for thermal management and should be connected to a heat sink or PCB pad for optimal heat dissipation. The package is also known as Mini Small Outline Package 12-1EP or MSOP-12EP. #part #template ## Component Details - **Owner:** vasyl - **Created:** 6/16/2023 - **Last Updated:** 6/16/2023 - **Visibility:** Public - **License:** https://creativecommons.org/licenses/by/4.0/ - **Used in:** 5 projects - **Mount Type:** Surface Mount - **Package / Case Code:** 12-MSOP - **Pin Count:** 12 ## Pins | Pin | Name | Type | |-----|------|------| | 1 | 1 | | | 2 | 2 | | | 3 | 3 | | | 4 | 4 | | | 5 | 5 | | | 6 | 6 | | | 7 | 7 | | | 8 | 8 | | | 9 | 9 | | | 10 | 10 | | | 11 | 11 | | | 12 | 12 | | --- *Generated from [https://www.flux.ai/vasyl/msop-12-1ep3x4mmp0p65mmep1p65x2p85mm~hnf](https://www.flux.ai/vasyl/msop-12-1ep3x4mmp0p65mmep1p65x2p85mm~hnf)*