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A small breakout/carrier PCB for the Moddo pinch SAMD11-based dev board. It converts the pinch 16-pin 1.27 mm header interface to breadboard-friendly 2.54 mm through-hole headers.
Intended Use
Prototype breakout board for plugging the pinch module into a breadboard or jumper-wire setup while preserving the module's original pinout.
What the Device Should Do
Provide a 2x8 1.27 mm through-hole mating header for the pinch board.
Fan all 16 pinch signals to 2.54 mm through-hole headers.
Provide two GND breakout locations.
Fit a 0.6 in breadboard span using 15.24 mm left/right column spacing.
Main Features
J1: 2x8 1.27 mm THT low-profile male header footprint, drill 0.65 mm, pad 1.0 mm.
J2/J3: 1x6 2.54 mm THT male headers, drill 1.0 mm, pad 1.7 mm.
J4: 1x5 2.54 mm THT male header, drill 1.0 mm, pad 1.7 mm.
Two-layer PCB with bottom GND pour.
Silkscreen labels for every breakout pin plus board name/revision.
System Architecture
Diagram
Interfaces and Connections
J1 pinout follows the supplied pinch J2 header mapping:
Table
J1 pin
Net
Breakout location
1
D0_SCL
Right column
2
3V3
Right column
3
D1_SDA
Right column
4
D7
Right column
5
D2
Bottom row
6
D8
Right column
7
D3
Bottom row
8
D9
Left column
9
D4
Bottom row
10
D10
Left column
11
RST
Bottom row
12
VBUS
Right column
13
D5
Left column
14
D11
Left column
15
D6
Left column
16
GND
Left column and bottom row
Physical Design Expectations
Approximate board: 18.3 mm x 17.5 mm with about 2 mm rounded corners.
Breakout hole coordinate datum: bottom-left D5 hole at X=0, Y=0 in the user-provided coordinate system.
Left/right breakout column spacing: 15.24 mm.
J1 center target in the user coordinate system: X=7.62 mm, Y≈4.75 mm.
Manufacturing and Assembly Expectations
Through-hole headers for hand assembly / breadboard use.
J1 exact low-profile 1.27 mm 2x8 MPN and vendor STEP model still need final sourcing.