Project Clone History


Can you check history of the changes of this project and let me know if this project was cloned from some other project/template or not
I’ll check the project metadata and earliest available history for evidence of a clone or template origin.
The history strongly suggests this project began as a copy of another design, rather than from a blank project. It was created on November 28, 2025; the earliest recorded change, #bf5968fd at 09:08 UTC, renamed “AI Brick Phone v1 44a9” → “ESP32 x86 PC”, followed by removal of existing microphone, audio, and battery-charging circuitry.
I couldn’t confirm the exact source project or whether it was formally cloned, forked, or created from a template—the available metadata exposes no lineage, and the earliest detailed diffs were unavailable.

Enclosure Verification
Independent review summary
This review independently inspected the current PCB layout, enclosure model nodes, all enclosure/front-panel build123d sources, resolved asset conversions, and the existing enclosure-build file. Statuses below are based on authored geometry and current layout data; claims needing physical component envelopes or a real card/plug are marked Concern or Unverified rather than assumed correct.
Reviewed assets
  • 3D Model


    Design view of Enclosure Verification
  • 3D Model


  • 3D Model


  • 3D Model


  • 3D Model


All five assets resolve to derived GLB/STL/STEP/OBJ/3MF outputs. Separate active model nodes exist at (0,0,0), rotation 0, scale 1, with zIsUp, physical materials, and edge display enabled.
Fit verification

Table


ItemStatusEvidence
PCB datum and scalePassLayout is a centered rectangular 72 × 100 mm board with 1.30 mm stackup thickness. Models are authored in mm and placed at root (0,0,0) with scale 1.
Separate base, lid, bezelPassThree independent assets and three independent model nodes resolve. Lid can be toggled separately.
Base below board z=0PassBase floor spans z=-9.30…-7.30 mm; PCB spans z=0…-1.30 mm. Walls span z=-7.30…18.0 mm.
Board contained in planPassInner cavity is 80 × 112 mm (x=±40, y=±56) versus PCB x=±36, y=±50: nominal edge clearance 4 mm X, 6 mm Y.
Bottom-side clearanceUnverifiedPCB underside to floor top is 6.0 mm. A bottom-side component exists with a roughly 22.47 × 35.94 mm planar bound, but its Z height is not available from layout read-back.
H1–H4 M2 standoff alignmentPassStandoff centers exactly match H1 (-33,-47), H2 (33,-47), H3 (33,47), H4 (-33,47). Tops meet PCB underside at z=-1.30 mm. Posts are Ø6.0 mm with Ø3.0 mm insert pockets.
M3 closure boss locationsPass after fixCenters are (±20,±54) and lid holes use the same coordinates. Bosses are outside the PCB Y extent and away from the port rows.
M3 boss-to-PCB clearanceConcern after fixOriginal Ø8.0 mm bosses were exactly tangent to the PCB edge at y=±50 (0 mm nominal clearance). Boss radius was reduced to 3.70 mm, yielding 0.30 mm nominal clearance and 1.65 mm radial material around the Ø4.10 mm insert pocket. This is improved but still tighter than the preferred ~0.5 mm FDM PCB clearance.
Lid registrationPassLip outer size 79.6 × 111.6 mm fits the 80 × 112 mm cavity with 0.20 mm per side clearance. Lip depth is 1.8 mm, spanning z=16.2…18.0 mm.
Lid fastener head fitConcernLid has Ø3.6 mm through holes and Ø6.2 × 1.3 mm counterbores. This is plausible for a low-profile M3 head, but a standard socket-head height may exceed the 1.3 mm recess; final screw-head style must be confirmed.
Nominal wall/floor thicknessPassBase walls/floor are 2.0 mm; lid is 2.4 mm; revised boss ligament is 1.65 mm, meeting the 1.6 mm FDM structural floor. Cutouts are full-through booleans, not thin membranes.
General boss/component collisionsUnverifiedXY review finds no nominal overlap after the boss fix. Exact Z envelopes for VGA, mini-DIN, switches, and the bottom assembly are unavailable, so full mesh collision clearance cannot be certified.
VGA cutoutConcernBase opening is 29 × 17 mm, centered at y=28.59, matching VGA placement Y. VGA planar bound is 23 × 31.03 mm; exact shell/plug/thumbscrew envelope and Z height still require a cable trial.
USB-C cutoutPass / first-print checkOpening is 14 × 7.5 mm, centered at y=-1.41, matching USB1. It is larger than the 14.04 × 4.96 mm planar footprint height envelope and the wall remains 2 mm thick; plug overmold/reach should still be trialed.
PS/2 keyboard and mouse cutoutsConcernBoth are 16 × 16 mm, centered at the connector Y positions -17.5 and -35.0. The connector planar bounds are 12.84 × 16.8 mm. Openings are conservative, but exact keyed-plug overmolds and connector Z are not verified.
POWER cutoutConcernOpening is 13 × 8 mm at y=31.83. POWER has a large 18.94 × 16.33 mm planar bound with an offset model; actuator direction/travel is not derivable with confidence.
RESET / BOOT / MUTE cutoutsConcernEach opening is 7 × 7 mm, aligned to Y 15.76, 5.11, and -9.48. Exact actuator travel and finger/tool access need a wall coupon or first print.
ESP32 vent placementPassFour 17 × 2.4 mm slots cover x=-5.8…11.2, y=18.8…34.7, overlapping the ESP1 body bound x≈-7.23…12.53, y≈15.05…46.45 while leaving about 11.75 mm at the +Y end unvented for the antenna region. Closure bosses are far outside this area.
ESP32 antenna clearancePass in authored geometryNo lid boss or decorative metal feature occupies the +Y module end; vents stop at y=34.7 while the module extends to about y=46.45. RF performance still warrants an assembled test.
Speaker openingPass3×3 grille of Ø2.5 mm holes is centered at (0.7,-39.2), exactly matching SPK1 center. Grille centers span x=-4.3…5.7, y=-43.7…-34.7 inside the speaker planar bound.
Card2 connector orientationPassCard2 is at (27.693,-27.893) with rotationZ=90°, at the +X board edge. Its planar X extent reaches approximately x=35.59, only ~0.41 mm inside the PCB edge, consistent with outward +X insertion.
Card2 straight insertion corridorConcern, geometrically alignedBase slot spans x=38…46, bezel slot spans approximately x=41.5…44.9; both share y=-27.89 and z=0.5…3.9. Slot width is 15 mm, exceeding an 11 mm microSD card width. The decorative button and locating pegs are outside the slot Y corridor. However, the exact card center-plane/Z and push-push extraction stroke were not recoverable from the OCR mechanical drawing, so a physical card test remains mandatory.
Bezel scale and positionPassFascia is 2.4 × 28 × 14 mm on the +X face, extending the enclosure from x=42 to 44.4; assembled X envelope is therefore 86.4 mm.
Materials/colorsPassBase and lid source color is warm beige #d8c8a8; bezel is dark gray #33373b. All three model nodes have physical materials enabled.
Revised front-panel verification

Table


ItemStatusEvidence
Updated base and separate front assets/nodesPassBase, Front Nameplate, and Power Indicator Window model nodes independently resolve to the current storage assets. Each is active at (0,0,0), rotation 0, scale 1, with physical materials enabled.
Nameplate wording / brandingPass after fixThe submitted wording ESP32 PERSONAL COMPUTER contained the ESP32 product brand. It was replaced with neutral RETRO PERSONAL COMPUTER; no logo or copied trade dress is present.
Nameplate FDM printabilityPassPlaque is 66 × 4 × 1.2 mm. Recess is 0.60 mm deep and all 3×5 block-letter pixels/strokes are 0.70 mm, wider than a 0.4 mm nozzle line and approximately 3–4 layers deep at 0.16–0.20 mm layers.
Nameplate clearancePassPlaque spans z=13.4…17.4, leaving 0.4 mm above the SD bezel (z≤13.0) and 0.6 mm below the lid seam (z=18.0). It is remote from closure bosses at y=±54.
Indicator seatingPassOpening is 1.20 × 3.00 mm. Stem is 0.90 × 2.70 mm, giving 0.15 mm clearance per side. Exterior flange is 1.80 × 3.60 mm and seats against the outer wall at x=42.
Indicator retentionConcernThe exterior flange prevents inward loss, but outward retention still relies on the documented transparent adhesive fillet; there is no mechanical inner snap/collar. Verify adhesive compatibility and pull-out resistance on the first print.
BOOT/RESET/MUTE interferencePass after fixOriginal 2.6 mm opening left only 0.49/0.56 mm webs. Opening was narrowed and centered at y=10.435, spanning 9.835…11.035; BOOT ends at 8.61 and RESET begins at 12.26, leaving 1.225 mm web to each. MUTE is far away at y=-9.48.
SD path, seam, and boss interferencePassIndicator at y=10.435, z=4.0 is far from Card2/SD at y=-27.89, lid seam at z=18, and closure bosses at y=±54. Nameplate remains above the SD bezel.
Indicator component clearancePass in XY / Unverified in full 3DStem begins at x=38.8; PCB edge is x=36, and the nearby control footprints remain inboard. Exact switch/LED Z meshes are not exposed for collision measurement, so first-print confirmation remains appropriate.
Clear-blue materialPassWindow source uses reserved clear acrylic color #d8ecff; its model node has physical materials enabled, so the clear/translucent material mapping resolves deterministically.
PWR LED offset documentationPassPWR is an 0805 LED at (-20.69,4.85). Revised window center is (front,10.435), giving 5.585 mm Y offset and approximately 62.9 mm straight distance to the outer front. Direct free-space illumination is not credible; flexible PMMA fiber or a wired LED is accurately recommended.
Existing enclosure fitPass, previous caveats unchangedStandoffs, bosses, cavity, lid, ports, SD bezel/path, vents, speaker grille, and board datum were not altered. Only the small front indicator opening and two separate cosmetic parts changed. Existing component-height, plug-fit, Card2 stroke, and M3-head concerns remain as previously recorded.
USB1 cutout correction check

Table


ItemStatusEvidence
Updated base asset and nodePassEnclosure Base resolves to esp32-retro-enclosure-base-915c208c-abb6-4ec1-9d6b-0a142acabe1e.build123d, at root (0,0,0), scale 1, rotation 0, Z-up. Derived GLB/STL/STEP outputs resolve.
USB1 reference geometryPassUSB1 element is at (-30.9989,-1.4122) with rotationZ=270°; its 3D model carries Z offset 7.3 mm. The supplied photo establishes the vertical rear-face orientation, overriding misleading planar aspect assumptions.
Cutout geometryPassBase source defines a rounded YZ through-cut at y=-1.4122, z=7.30, 7.0 mm W × 16.0 mm H, with 0.8 mm corner radius. Source preview is visibly tall/narrow.
Connector / plug accessPass with first-print checkCutout is centered on USB1 and fully crosses the 2 mm rear wall. The vertical 16 mm dimension provides the observed upright connector/plug envelope; the 7 mm narrow dimension is appropriate to the rotated plug profile but should be checked with the intended cable overmold.
Remaining rear-panel materialPassOpening spans z=-0.7…15.3 mm in a wall spanning z=-7.3…18.0 mm, retaining 6.6 mm below and 2.7 mm above. Rounded 0.8 mm corners avoid sharp stress risers.
Neighboring featuresPassUSB Y span is -4.9122…2.0878; it is 4.5878 mm clear of the keyboard opening edge, and far from VGA, PS/2 mouse, front controls, M3 closure bosses, and all H1–H4 standoffs. No other source geometry changed.
Build filePassenclosure-build links the current base asset and states the same dimensions, center, radius, and observed vertical orientation.
VGA cutout revision check

Table


ItemStatusEvidence
Updated base asset/nodePassEnclosure Base resolves to esp32-retro-enclosure-base-84083149-83c5-4c98-9a59-d7df26d29db6.build123d, active at root with scale 1, rotation 0, and Z-up; derived manufacturing/viewer exports resolve.
Cutout geometryPassSource defines a rounded YZ through-cut at y=28.5878, z=8.00, 34.0 mm W × 12.0 mm H, R1.2 mm. The asset preview shows a wide, low-profile rear opening.
VGA alignment and shell clearancePassVGA element is at (-25.7671,28.5878), rotation 270°, with a 23 × 31.03 mm planar bound. The cutout is centered on the actual connector Y coordinate and its 34 mm width provides about 1.5 mm per side against the 31.03 mm horizontal panel envelope.
Plug and thumbscrew accessConcern / first-print checkThe 34 mm width is appropriate for the D-sub shell/jackscrew corridor, but exact plug overmold and thumbscrew head dimensions were not recoverable from the connector datasheet OCR. Trial-fit the intended VGA cable and tighten both thumbscrews before the cosmetic print.
Rear-panel material and adjacent cutoutsPassVGA spans y=11.5878…45.5878, leaving 9.50 mm to USB1's upper edge and 12.41 mm to the +Y outer wall. It spans z=2…14, retaining 9.3 mm of rear wall below and 4.0 mm above. Keyboard/mouse openings, M3 bosses, H1–H4 standoffs, and all front features are unchanged by source comparison.
Build filePassenclosure-build links the current base asset and records the same VGA dimensions, center, corner radius, revised orientation, and plug/thumbscrew first-print check.
VGA lower-edge follow-up

Table


ItemStatusEvidence
Asset/node resolutionPassEnclosure Base resolves to current asset esp32-retro-enclosure-base-1340efde-4d70-452e-ae3b-66fea866c2fa.build123d, active at root with scale 1, rotation 0, and Z-up.
VGA opening dimensionsPassSource locks VGA_W=34.0, VGA_TOP_Z=14.00, and VGA_BOTTOM_Z=-0.50; calculated height is 14.5 mm and center z=6.75 mm. Corner radius remains 1.2 mm.
Connector clearancePass by authored seating datumThe opening reaches 0.5 mm below the VGA model's z=0 seating plane while retaining its 14.0 mm top edge, providing the requested lower-edge clearance.
USB1 / PS2 / panel integrityPassVGA Y extent is unchanged (11.5878…45.5878), leaving 9.50 mm to USB1. Keyboard and mouse openings are unchanged. With the lower edge at z=-0.5, the rear wall retains 6.8 mm below and 4.0 mm above the opening; bosses and standoffs are unchanged.
First-print checkConcernConfirm the actual VGA cable's plug overmold and thumbscrews fit the 14.5 mm opening; those external cable dimensions are not represented by the board model.
Tight-X enclosure verification

Table


ItemStatusEvidence
Base cavity and wallsPassCurrent base source specifies INNER_X=74.0 mm, INNER_WALL_X=±37.0 mm, OUTER_X=78.0 mm, and WALL=2.0 mm. A 72.0 mm board spanning x=±36 therefore has 1.0 mm nominal clearance per side.
Lid / bezel mating framePassLid source uses the same INNER_X=74.0 / OUTER_X=78.0 frame. Its lip outer X width is 73.6 mm, yielding 0.20 mm per-side fit clearance in the 74.0 mm base cavity. The active replacement SD bezel uses front face x=39.0 mm, matching the tightened base outer face.
Asset and model-node resolutionPassBase, lid, tightened SD bezel, nameplate, and indicator assets all provide derived exports. Current Base and SD Bezel nodes resolve to their 74 mm-inner-X assets at root (0,0,0), scale 1, rotation 0, Z-up, with physical materials enabled.
PCB, standoff, and boss containmentPassPCB edge is x=±36; H1–H4 at x=±33 with Ø6 posts extend to x=±36; closure bosses at x=±20 remain well inside walls. No nominal intersection is introduced.
Left-side connectorsPassVGA, USB1, keyboard PS/2, and mouse PS/2 all have full-depth rear through-wall cuts: x=-43…-35, crossing the tightened rear wall x=-39…-37. VGA remains 34.0 × 14.5 mm, and USB1 remains 7.0 × 16.0 mm. Their Y windows remain separated: VGA ends at y=11.5878, USB ends at y=2.0878, and keyboard begins at y=-9.5.
Right-side controls / SDPass in authored geometryPOWER, RESET, BOOT, MUTE, Card2, and the indicator use full-depth front cuts spanning x=35…43, crossing the tightened front wall x=37…39. POWER's planar X extent reaches about x=37.87, but its matching through-cut at y=31.83 prevents wall intersection.
Component and external-access clearanceConcernThe 1.0 mm bare-board edge margin is intentional, but it leaves only about 0.27–0.58 mm nominal lateral clearance around some non-cutout-adjacent side footprints (POWER/PS2 bounds). Cutouts remove the wall where the ports/control faces need access; verify actual plug overmolds and button travel on a first print. Exact 3D body envelopes remain unavailable.
Unrelated-feature preservationPassSource comparison shows the tight-X change retains the prior VGA lower edge z=-0.5, tall USB1 cutout, PS/2 cutouts, standoff/boss coordinates, floor/wall Z stack, front indicator, and SD slot geometry; only the shared X frame and associated cosmetic assets changed.
Lowered SD / controls verification

Table


ItemStatusEvidence
Base and bezel assets/nodesPassBase resolves to esp32-retro-enclosure-base-286090ec…; the active bezel node resolves to corrected asset esp32-retro-floppy-sd-bezel-inner-x74-b86ca23e…. Both are active at root (0,0,0), scale 1, rotation 0, Z-up, and have derived manufacturing/viewer outputs.
Card2 base/bezel slot alignmentPassBoth sources use SLOT_Z/CARD_SLOT_Z=0.80 mm, height 3.4 mm, and unchanged Y center -27.89 mm; their vertical spans coincide at z=-0.9…2.5 mm.
Actual Card2 insertion planeConcern / unverified exact datumCard2's placed model has no explicit Z offset and the available datasheet OCR defers dimensions to a missing customer drawing. The 0.8 mm center agrees with the visible near-PCB insertion mouth and the broad slot span covers the expected card thickness, but a real push-push card test remains the only definitive check.
RESET / BOOT / MUTE alignmentPass to model envelope; actuator travel unverifiedOpenings retain Y centers 15.76, 5.11, and -9.48 mm, but now center at z=3.70 mm with range 0.2…7.2 mm. Their 1825027-8 models are placed at z=0.2 mm and identify a 7.0 mm body envelope, matching the opening. Precise molded plunger travel was not available from the datasheet.
POWER slide-switch alignmentPass to model center; travel unverifiedPOWER retains Y 31.83 mm; its opening center is now z=3.60 mm, equal to the SS-12D11G5R model Z placement, with range -0.4…7.6 mm. Exact slider overtravel/finger sweep requires a physical check.
Horizontal centers and unrelated geometryPassSource comparison shows only affected Z values changed. INNER_X=74 mm; label, lid, VGA 34×14.5 opening, vertical USB1, PS/2 apertures, bosses, standoffs, indicator, and all feature Y centers remain unchanged.
Panel webs / floor / seamPass after fixSD slot bottom is z=-0.9, still 6.4 mm above floor top z=-7.3. POWER bottom is -0.4; button bottoms are 0.2; all tops are ≤7.6, over 10 mm below the parting line at 18.0. Horizontal webs are unchanged, including ~1.22 mm around the indicator. The submitted bezel left only 1.1 mm below the slot; bezel body was lowered 0.1 mm to provide the 1.2 mm FDM minimum, with 1.5 mm clearance to the nameplate.
Part connectivityPassAsset compilation reports one connected bezel solid; the base asset resolves and converts successfully. No opening reaches the floor or separates the wall/body.
First-print ergonomicsConcernVerify microSD push-to-eject depth and fingertip extraction, RESET/BOOT/MUTE plunger access without tools, and full POWER slider travel with the actual actuator cap.
Fix made
Completed — lid clear-bore correction: Updated only the active lid asset to

3D Model


. The four closure axes remain (±20, ±54) mm; each now has a Ø3.6 mm clearance bore spanning z=15.2…21.4 mm and a concentric Ø6.2 mm × 1.3 mm-deep top counterbore spanning z=19.1…20.5 mm. Both tools are deliberately the final geometry operations, after the lip and every other subtraction, so the Ø3.6 passage fully traverses lip plus plate with no material reintroduced. Asset validation reports one solid, 78 × 116 × 4.2 mm. The base asset/node/source was not edited or replaced in this correction.
Completed: The four M3 closure bosses originally used radius 4.0 mm at y=±54, making them nominally tangent to the PCB edge at y=±50. The base source was revised to radius 3.70 mm, re-uploaded, and the existing model node now resolves to the new asset. Post-fix values are 0.30 mm PCB clearance and 1.65 mm boss wall around the Ø4.10 mm insert pocket.
Completed — front panel: Replaced branded ESP32 PERSONAL COMPUTER lettering with neutral RETRO PERSONAL COMPUTER. Narrowed the indicator opening from 2.60 mm to 1.20 mm, centered it at y=10.435, and matched the separate lens geometry; this increases the BOOT/RESET panel webs from 0.49/0.56 mm to 1.225 mm each.
No other geometry was changed because the remaining uncertainties depend on physical plug, actuator, component-height, insert, or card-stack dimensions that are not reliably available from the project data.
Remaining first-print checks
  1. Seat the PCB on H1–H4 and verify the bottom-side assembly clears the 6.0 mm under-board gap.
  2. Confirm all top-side parts, especially VGA and both mini-DIN connectors, remain below the lid interior at z=18.0 mm.
  3. Check the revised M3 bosses do not rub the PCB edge; target at least a slip fit despite the tight 0.30 mm nominal gap.
  4. Trial the selected M3 screw head in the Ø6.2 × 1.3 mm lid counterbore and confirm driver access.
  5. Insert and remove a real microSD card through the full bezel/base corridor with the PCB screwed down; verify push-push overtravel and fingertip access.
  6. Test actual VGA, USB-C, keyboard, and mouse plugs for overmold clearance and full seating through the 2 mm wall.
  7. Verify POWER/RESET/BOOT/MUTE travel with a wall coupon or first print.
  8. Run ESP32 RF/Wi-Fi and thermal tests with the lid installed; confirm the antenna-end solid lid region does not materially reduce performance.
  9. Tune M2/M3 heat-set pocket diameters to the actual insert vendor and filament shrinkage before the final cosmetic print.
  10. Confirm the indicator's transparent adhesive retention and optical coupling; use flexible PMMA fiber or a wired LED because the onboard PWR LED is approximately 62.9 mm away and laterally offset.
  • Independent review summary

  • Reviewed assets

  • Fit verification

  • Revised front-panel verification

  • USB1 cutout correction check

  • VGA cutout revision check

  • VGA lower-edge follow-up

  • Tight-X enclosure verification

  • Lowered SD / controls verification

  • Fix made

  • Remaining first-print checks