Update PCB Stackup to 2 Layers


Yes, Senhor Vasquez — it is possible, but you need two resistors and must break the existing direct FB-to-3.3 V connection. Adding only one resistor will not fix it.
For the adjustable TPS62827:
VOUT=0.6 V(1+RTOPRBOTTOM)V_{OUT}=0.6\text{ V}\left(1+\frac{R_{TOP}}{R_{BOTTOM}}\right)
A suitable 1% resistor pair is:
  • R_TOP = 453 kΩ: output to FB
  • R_BOTTOM = 100 kΩ: FB to GND
This produces approximately:
0.6(1+453/100)=3.318 V0.6(1+453/100)=3.318\text{ V}
That is suitable for a nominal 3.3 V rail.
Required modification

Text


3.3 V output ── 453 kΩ ──┐
                          ├── TPS62827 FB
GND ────────── 100 kΩ ───┘
Procedure:
  1. Completely disconnect USB and the LiPo.
  2. Locate the PCB trace directly connecting U6 FB pin 3 to the 3.3 V output.
  3. Carefully cut that trace and confirm with a multimeter that FB is no longer shorted to the output.
  4. Solder 453 kΩ between the 3.3 V output and FB.
  5. Solder 100 kΩ between FB and GND.
  6. Keep both resistors and wires extremely close to U6; FB is sensitive to switching noise.
  7. Check for shorts under magnification.
  8. Initially power the board from a current-limited bench supply or USB current limiter, without the battery.
  9. Measure the output before allowing the ESP32-S3 and other loads to run. Expect approximately 3.3 V.
Important cautions
  • U6 is a tiny 1.5 mm VSON package, so soldering directly to FB pin 3 is difficult.
  • If the FB trace cannot be isolated cleanly, replacing the IC with TPS6282533DMQR may be safer.
  • Do not power the board until the modification is complete. With FB directly connected to the output, the adjustable part will attempt to regulate near 0.6 V, not 3.3 V.
  • Use 1% resistors. Avoid long jumper wires around the SW pin and inductor because those carry noisy switching signals.
Document and check mod
Show solder points
Calculate resistor options
Create rework guide
Check replacement option

Design Notes
  • Board target: ESP32-S3 module-based handheld Tamagochi with integrated 16MB flash and 8MB PSRAM.
  • Updated architecture: USB-C 5V sink input -> BQ24074 charger/power-path -> protected 1-cell LiPo -> TPS62827 3.3V buck -> ESP32-S3-WROOM-1-N16R8 and peripherals.
  • Current board remains a 160 mm x 100 mm 4-layer layout.
Module migration summary
  • Replaced the bare ESP32-S3 SoC with ESP32-S3-WROOM-1-N16R8.
  • Removed the external flash (U2), external PSRAM (U3), 40MHz crystal (Y1), and the discrete antenna / RF matching network because the WROOM module integrates memory, clocking, RF matching, and antenna.
  • Rewired the handheld nets to the module pinout while preserving the originally requested assignments for GPIO47, GPIO15, and GPIO16.
  • Re-placed the PCB so the module antenna extends past the board edge for RF performance.
Implemented pin map in current schematic
Native USB
  • USB D- -> GPIO19
  • USB D+ -> GPIO20
TFT ST7789
  • TFT_SCLK -> GPIO21
  • TFT_MOSI -> GPIO47
  • TFT_CS -> GPIO45
  • TFT_DC -> GPIO17
  • TFT_RST -> GPIO41
  • TFT_BL -> GPIO42
SD_MMC 1-bit
  • SD_CLK -> GPIO39
  • SD_CMD -> GPIO38
  • SD_D0 -> GPIO40
  • DAT3/CD pull-up footprint retained on socket for optional future use
Matrix keypad
  • Columns -> GPIO11, GPIO12, GPIO13
  • Rows -> GPIO4, GPIO5, GPIO6, GPIO7, GPIO8, GPIO9, GPIO14, GPIO15, GPIO16
5-way buttons
  • UP -> GPIO1
  • DOWN -> GPIO2
  • LEFT -> GPIO3
  • RIGHT -> GPIO10
  • CENTER -> GPIO18
Control / bring-up
  • BOOT -> GPIO0
  • EN / RESET -> EN
  • UART RX -> RXD0
  • UART TX -> TXD0
Power tree changes implemented
Removed legacy stage
  • Removed U4 (AP63203WU-7) and its dedicated switch-node parts L1 and C17.
  • 3V3 is no longer sourced from the old VBUS buck stage.
USB-C front end retained and extended
  • Kept the existing USB-C connector J1, CC pull-downs R3 and R4 (5.1k), and USB data ESD array D1 unchanged.
  • Added D2 (SMF5.0A) from VBUS to GND for dedicated VBUS surge / clamp protection.
  • Added C1 = 10uF and C18 = 100nF on VBUS at the charger input.
Charger / power-path stage
  • Added U5 = BQ24074RGTT.
  • Connected VBUS to U5 IN.
  • Connected U5 OUT to new intermediate rail VSYS.
  • Connected U5 BAT to battery positive net BAT_POS.
  • Tied EN1 high to VBUS, EN2 low to GND, and ~CE low to GND.
  • Left ITERM intentionally open.
  • Added charger support parts:
    • R13 = 1.8k on ISET -> target charge current about 494 mA
    • R14 = 3.1k on ILIM -> about 500 mA input limit in ILIM mode
    • R17 = 10k on TS to GND as the current default bias choice
    • R18 = 18k on TMR
    • C2 = 10uF on BAT
  • Added status pull-ups and test access:
    • R15 = 100k pull-up on ~PGOOD to 3V3
    • R16 = 100k pull-up on ~CHG to 3V3
    • TP13 on ~PGOOD
    • TP12 on ~CHG
Battery connector and protection
  • Added J5 = S2B-PH-SM4-TB(LF)(SN) JST-PH 2-pin SMD battery connector.
  • Chose on-board battery protection so the design does not depend on sourcing a pre-protected LiPo pack.
  • Added protection stage:
    • U7 = DW01A
    • Q1 = FS8205A
    • R19 = 100 ohm between BAT_POS and DW01A VDD
    • R20 = 1k from CSI to GND
    • C25 = 100nF across DW01A local supply
New 3.3V regulator stage
  • Added U6 = TPS62827DMQR.
  • Connected VSYS to U6 VIN and U6 EN.
  • Connected U6 VOUT/FB path through L2 to the existing 3V3 rail.
  • Added buck support parts:
    • L2 = 470nH
    • C14 = 4.7uF on VIN
    • C24 = 100nF on VIN
    • C15 = 22uF on 3V3
    • C22 = 100nF on 3V3
  • U6 PG intentionally unused.
Placement notes
  • The new power block (U5, U6, U7, Q1, J5, D2, and support passives) has been placed near the USB-C / battery-entry side of the board with the charger and buck stages clustered for short current loops.
  • U1 was re-positioned back to the top-right board edge with about 5 mm antenna overhang so the RF keepout is preserved.
  • TP12 and TP13 remain accessible for probing.
Verification status
  • ERC status for the modified power tree is clean for floating pins, missing power pins, and undriven nets.
  • All newly added parts have footprints assigned.
  • PCB routing is still incomplete: the board currently reports 127 airwires, so additional routing work is still required before fabrication.
Remaining follow-up items
  • Route the updated power nets and the remaining board connections to eliminate airwires.
  • If desired later, replace the current TS grounding approach with a proper battery NTC network matched to the final pack choice.
  • Review copper width / thermal spreading around the charger, battery path, and buck converter before manufacturing export.
  • Module migration summary

  • Implemented pin map in current schematic

  • Native USB

  • TFT ST7789

  • SD_MMC 1-bit

  • Matrix keypad

  • 5-way buttons

  • Control / bring-up

  • Power tree changes implemented

  • Removed legacy stage

  • USB-C front end retained and extended

  • Charger / power-path stage

  • Battery connector and protection

  • New 3.3V regulator stage

  • Placement notes

  • Verification status

  • Remaining follow-up items