Board size set to 30 mm × 20 mm; bottom layer configured as solid GND plane
Four NPTH mounting holes placed at (±13, ±8)
Paused after placement of mounting holes for your review of board size and mounting placement
Tasks not done / cannot automate
Stackup configuration (2-layer FR4 1.6 mm)
Net-class assignments and design rule width/clearance settings
Precise placement of USB-C, LCD FPC, charger, decoupling cluster, MCU and other components
PCB routing of power, control and signal nets
DRC/ERC cleanup
Gerber/Drill file/BOM/PnP/pin-map generation and packaging
Success criteria
Not yet met—the schematic is complete, but PCB layout, DRC clean-up, and fabrication outputs remain to be done.
Recommended next step
Configure the PCB stackup and layout rules (net classes, trace widths, clearances), then place the remaining components and route the board. Once routed and DRC-clean, I can generate the fabrication outputs and bundle them into SMD_V2_FAB_v1.zip.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant