50 Position Card Connector CompactFlash® - Type I, II Surface Mount, Right Angle Gold 1734451-1 is a 50-position CompactFlash (CF) card connector from TE Connectivity. It is a low-profile, right-angle, surface-mount connector designed for interfacing CompactFlash Type I and Type II memory cards with a printed circuit board (PCB). The connector features gold-plated contacts for reliable signal transmission and durability, making it suitable for embedded systems, industrial equipment, data acquisition devices, and legacy storage applications. This part is currently marked as obsolete by the manufacturer. Key Features 50-position CompactFlash card connector Supports CompactFlash Type I and Type II cards Right-angle PCB mounting orientation Surface-mount termination (SMT) 1.27 mm contact pitch Gold-plated contact mating area Brass contacts with nickel underplating Low-profile connector design Maximum contact current rating: 0.5 A per contact Thermoplastic housing, UL 94V-0 rated Designed for signal transmission applications Board-mount connector with hold-down feature Obsolete product status #TEConnectivity #CompactFlash #CFCardConnector #MemoryConnector #PCCardSocket #EmbeddedSystems #SMTConnector #RightAngleConnector #PCBDesign #ElectronicComponents #IndustrialElectronics #DataStorage #ConnectorSolution #HardwareDesign #ObsoletePart
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Bluetooth, WiFi 802.11b/g/n/ax, Bluetooth v5.4 Transceiver Module 2.4GHz Integrated, Chip Surface Mount Silicon Labs SiWG917 module is our lowest power Wi-Fi 6 plus Bluetooth LE 5.4, ideal for ultra-low power IoT wireless devices using Wi-Fi®, Bluetooth, Matter, and IP networking for secure cloud connectivity. It is optimal for developing battery operated devices that need long battery life. SiWG917 module includes an ultra-low power Wi-Fi 6 plus Bluetooth Low Energy (LE) 5.4 wireless CPU subsystem, and an integrated micro-controller (MCU) application subsystem, security, peripherals and power management subsystem all in a single 16 x 21.1 x 2.3 mm package. The wireless subsystem consists of a multi-threaded Network Wireless Processor (NWP) running up to 160 MHz, baseband digital signal processing, analog front end, 2.4 GHz RF transceiver and integrated power amplifier. The application subsystem consists of an ARM® Cortex®-M4 running up to 180 MHz, embedded SRAM, flash, ultra-low power sensor hub, and matrix vector processor. The ARM® Cortex®-M4 is dedicated for peripheral and application-related processing, while the NWP runs the wireless and networking stacks on independent threads, thus providing a fully integrated solution that is ready for a wide range of embedded wireless IoT applications. The modules come with modular radio type approvals for various countries, including USA (FCC), Canada (IC/ISED) and Japan (MIC), and are in compliance with the relevant EN standards (including EN 300 328 v2.2.2) for the conformity with the directives and regulations in EU and UK. KEY FEATURES • Wi-Fi 6 Single Band 2.4 GHz 20 MHz 1x1 stream IEEE 802.11 b/g/n/ax • Bluetooth LE 5.4 • Single chip Matter Over Wi-Fi Solution • ARM® Cortex® M4 Processor with FPU subsystem up to 180 MHz with rich set of Digital and Analog Peripherals. • Wi-Fi 6 Benefits: TWT for improved efficiency and longer battery life, MUMIMO/OFDMA for Higher Throughput, network capacity and low latency • Best in Class Device and Wireless Security • WLAN Tx power up to +17.5 dBm with integrated PA • Bluetooth LE Tx power up to +17 dBm with integrated PA • WLAN Rx sensitivity as low as -95.5 dBm • Wi-Fi 4 Standby Associated mode current: 71 μA @ 1-second listen interval • Embedded Flash option up to 8 MB/ optional external Flash up to 16 MB • Embedded PSRAM option up to 2 MB/ optional external PSRAM option up to 16 MB • Ultra-low power sensor hub peripherals • Matrix Vector Processor (MVP) • Embedded Wi-Fi, Bluetooth LE, Matter, and networking stacks supporting wireless coexistence • Three software-configurable MCU application memory options for sharing the RAM between the wireless, system, and application (192/256/320 KB) • Operating temperature: -40 to +85 ºC • Operating supply range: 3.0 to 3.63 V • Supply voltage for GPIOs: 1.71 to 3.63 V #WiFi6 #BluetoothLE54 #IoTModule #WirelessSoC #SiliconLabs #EmbeddedSystems #SmartHome #IndustrialIoT #LowPowerDesign #RFModule #ConnectedDevices #EdgeComputing #MatterReady #PCBDesign #ElectronicsEngineering
6 Uses
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ARM® Cortex®-M33 STM32H5 Microcontroller IC 32-Bit 250MHz 512KB (512K x 8) FLASH 64-LQFP (10x10) The STM32H533RET6 specification defines the engineering requirements for a high-performance embedded microcontroller designed for advanced control, computation, and communication applications. This specification establishes the functional, electrical, mechanical, environmental, and quality requirements necessary to ensure reliable operation in complex embedded systems across industrial, consumer, and communication environments. The device is intended for use in applications requiring real-time processing capability, efficient peripheral integration, and secure system operation. It supports embedded control systems, industrial automation, sensor data processing, communication gateways, and other applications requiring deterministic performance and flexible connectivity. Engineering Requirements The microcontroller shall be manufactured using advanced semiconductor processes to ensure high processing efficiency, low power consumption, and long-term operational reliability. The device shall support stable execution of embedded firmware under defined electrical, thermal, and environmental conditions. The architecture shall provide integrated memory resources, high-speed processing capability, and a wide range of peripheral interfaces to support system-level integration. Communication interfaces and on-chip peripherals shall operate reliably under specified conditions without degradation of performance or data integrity. Electrical characteristics shall ensure stable logic operation, accurate timing behavior, and robust signal integrity during normal operation, reset events, and power transitions. The device shall maintain functional stability under dynamic load conditions and environmental variation. Mechanical and package construction shall be suitable for surface-mount assembly and shall ensure mechanical robustness during soldering, handling, and operation. Workmanship shall be free from defects such as contamination, cracks, deformation, or structural inconsistencies that could impact performance or reliability. Inspection, validation, and testing shall be performed using controlled procedures and calibrated equipment to ensure compliance with all applicable engineering and quality requirements. Any deviation from this specification shall require formal engineering review, documented justification, and approval through established change control processes. Documentation Supporting documentation shall include official datasheets, reference manuals, qualification reports, electrical characterization data, inspection records, and revision-controlled manufacturing documentation. All records shall be maintained under formal configuration management and quality assurance systems. Revision Control Any modification to this specification shall be managed through the formal engineering change control system. All revisions shall undergo technical evaluation, validation, and approval prior to implementation to ensure continued compliance with design intent and applicable standards. #EngineeringSpecification #Microcontroller #STM32H5 #STMicroelectronics #EmbeddedSystems #RealTimeControl #IndustrialElectronics #Firmware #Semiconductor #QualityAssurance #EngineeringDocumentation
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ARM® Cortex®-M4 STM32F4 Microcontroller IC 32-Bit 180MHz 2MB (2M x 8) FLASH 176-LQFP (24x24) The STM32F427IIT6 specification defines the engineering requirements for a high-performance microcontroller device designed for embedded processing applications requiring advanced computational capability, rich peripheral integration, and reliable real-time control. This specification establishes the functional, electrical, mechanical, environmental, and quality requirements necessary to ensure consistent operation across industrial, consumer, and communication systems. The device is intended for use in complex embedded systems where high-speed processing, efficient memory handling, and extensive peripheral connectivity are required. It supports applications such as industrial automation, motor control, signal processing, communication interfaces, and advanced embedded control systems. Engineering Requirements The microcontroller shall be manufactured using advanced semiconductor fabrication processes to ensure high processing performance, low power consumption, and long-term reliability. The device shall provide stable operation across its intended voltage, temperature, and environmental conditions while maintaining deterministic real-time behavior. The integrated architecture shall support high-speed processing capabilities, embedded memory resources, and multiple communication interfaces for system-level integration. Peripheral functionality shall operate reliably under defined electrical and environmental conditions without degradation of performance. Electrical characteristics shall ensure stable logic levels, accurate timing behavior, and robust signal integrity across all supported operating modes. The device shall maintain functional reliability during power transitions, reset conditions, and dynamic load variations. Mechanical and package construction shall be suitable for surface-mount assembly processes and shall ensure mechanical integrity during soldering, handling, and operation. Workmanship shall be free from defects including contamination, physical damage, or structural inconsistencies that could impact reliability or performance. Inspection, validation, and testing shall be performed using controlled procedures and calibrated equipment to ensure compliance with all applicable engineering and quality standards. Any deviation from this specification shall require formal engineering review, documented justification, and approval through the established change control process. Documentation Supporting documentation shall include engineering datasheets, reference manuals, qualification reports, electrical characterization data, inspection records, and revision-controlled manufacturing documentation. All records shall be maintained under formal configuration management and quality assurance systems. Revision Control Any modification to this specification shall be processed through the established engineering change management system. All revisions shall undergo technical review, validation, and formal approval prior to implementation to ensure continued compliance with design intent and applicable industry requirements. #EngineeringSpecification #Microcontroller #EmbeddedSystems #STMicroelectronics #DigitalControl #IndustrialElectronics #Firmware #Semiconductor #QualityAssurance #EngineeringDocumentation #RealTimeSystems
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ARM® Cortex®-M4F STM32G4 Microcontroller IC 32-Bit 170MHz 512KB (512K x 8) FLASH 64-LQFP (10x10) The STM32G491RET6 from STMicroelectronics is a high-performance 32-bit microcontroller based on the Arm® Cortex®-M4 core with Floating Point Unit (FPU), designed for advanced embedded applications requiring high computational performance, precise analog processing, and real-time control. It belongs to the STM32G4 series and integrates enhanced analog peripherals, motor-control timers, communication interfaces, security features, and hardware accelerators such as CORDIC and FMAC. The device operates at up to 170 MHz, provides 512 KB Flash memory, and includes 96 KB SRAM, making it suitable for applications such as motor control, digital power conversion, industrial automation, robotics, and embedded control systems. Key Features Core: Arm® Cortex®-M4 32-bit CPU with FPU, DSP instructions, and MPU Maximum CPU Frequency: Up to 170 MHz (up to 213 DMIPS) Memory: 512 KB Flash memory with ECC support 96 KB SRAM with parity checking features Quad-SPI memory interface Operating Voltage: 1.71 V to 3.6 V Package: LQFP-64 Advanced Analog Features: 3 × 12-bit ADCs with high-speed conversion 4 × 12-bit DAC channels 4 × Rail-to-Rail operational amplifiers 4 × Fast analog comparators Internal voltage reference buffer Hardware Accelerators: CORDIC accelerator for trigonometric calculations FMAC (Filter Math Accelerator) for digital filtering applications Timers & Motor Control: Advanced PWM timers for motor-control applications Multiple 16-bit and 32-bit timers Support for encoder and PWM control Communication Interfaces: 2 × FDCAN interfaces 5 × USART/UART 3 × SPI interfaces 3 × I²C interfaces USB 2.0 Full-Speed interface SAI audio interface Security Features: True Random Number Generator (TRNG) CRC calculation unit Unique device ID Debug & Programming: SWD and JTAG debugging support Typical Applications Motor control and BLDC controllers Digital power converters Industrial automation equipment Robotics and motion control Smart sensors and embedded control systems Power management applications #STM32G491RET6 #STM32G4 #STMicroelectronics #ARM_CortexM4 #Microcontroller #MCU #EmbeddedSystems #MotorControl #DigitalPower #IndustrialAutomation #Robotics #IoT #ElectronicsDesign #PCBDesign
6 Uses
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PSRAM (Pseudo SRAM) Memory IC 512Mbit HyperBus 166 MHz 36 ns 24-TFBGA (6x8) The IS66/67WVH64M8DALL/BLL are 512Mb Dual Die device containing two units of 256Mbit Pseudo Static Random Access Memory, organized as 64M words by 8 bits. The device supports a HyperBus interface, Very Low Signal Count (Address, Command and data through 8 DQ pins), Hidden Refresh Operation, and Automotive Temperature Operation, designed especially for Mobile and Automotive applications Key Features 512-Mbit (64M × 8) HyperRAM™ PSRAM High-speed HyperBus interface Clock frequency up to 166 MHz Fast 36 ns access time Single-ended clock architecture with reduced pin count Operating voltage range: 2.7 V to 3.6 V Industrial temperature range: −40°C to +85°C Low-power volatile memory solution Surface-mount 24-TFBGA (6 mm × 8 mm) package Suitable for graphics, AI edge devices, networking, and embedded systems requiring large external memory capacity. #CommonPartsLibrary #IntegratedCircuit #HyperRAM #PSRAM #ISSI #MemoryIC #HyperBus #EmbeddedSystems #IndustrialElectronics #IoT #HighSpeedMemory #BGA #VolatileMemory #EdgeComputing #HMI #ElectronicsDesign
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SN74HCT245 / SN54HCT245 – octal bus transceiver with 3-state outputs designed for bidirectional data communication between two 8-bit buses. Features direction control (DIR) for selecting data flow direction and output enable (OE) for bus isolation. TTL-compatible inputs, low power consumption, and high-current outputs make it suitable for interfacing microcontrollers, memory devices, processors, FPGAs, LCD modules, industrial controllers, and digital communication systems. Operates from a 4.5 V to 5.5 V supply voltage and supports asynchronous data transfer. Search Keywords: SN74HCT245, SN54HCT245, HCT245, Octal Bus Transceiver, Bidirectional Bus Transceiver, 8 Bit Bus Buffer, 3 State Buffer, Tri State Buffer, TTL Compatible Logic IC, Data Bus Interface, Logic Level Buffer, Microcontroller Interface, Memory Bus Driver, Digital Logic IC, Bus Isolation IC, Direction Controlled Buffer, Parallel Data Interface, Industrial Control Logic, FPGA Interface, Processor Bus Transceiver Hashtags: #SN74HCT245 #SN54HCT245 #HCT245 #BusTransceiver #OctalBusTransceiver #TriStateBuffer #LogicIC #TTLCompatible #DigitalLogic #BusBuffer #MicrocontrollerInterface #FPGA #EmbeddedSystems #MemoryInterface #IndustrialElectronics #DataBus #ElectronicsDesign #PCBDesign #HardwareDesign #TexasInstruments
22 Uses
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3-to-8 line decoder/demultiplexer The 74HC238; 74HCT238 decodes three binary weighted address inputs (A0, A1 and A2) to eight mutually exclusive outputs (Y0 to Y7). The device features three enable inputs (E1 and E2 and E3). Every output will be LOW unless E1 and E2 are LOW and E3 is HIGH. This multiple enable function allows easy parallel expansion to a 1-of-32 (5 to 32 lines) decoder with just four '238 ICs and one inverter. The '238 can be used as an eight output demultiplexer by using one of the active LOW enable inputs as the data input and the remaining enable inputs as strobes. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC. • Wide supply voltage range from 2.0 to 6.0 V • CMOS low power dissipation • High noise immunity • Demultiplexing capability • Multiple input enable for easy expansion • Ideal for memory chip select decoding • Active HIGH mutually exclusive outputs • Input levels: • For 74HC238: CMOS level • For 74HCT238: TTL level • Complies with JEDEC standards • JESD8C (2.7 V to 3.6 V) • JESD7A (2.0 V to 6.0 V) • Latch-up performance exceeds 100 mA per JESD 78 Class II Level B • ESD protection: • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V • Multiple package options • Specified from -40 °C to +85 °C and from -40 °C to +125 °C #74HC238N #74HCSeries #CMOSLogic #DecoderIC #Demultiplexer #DigitalLogic #AddressDecoder #ChipSelect #LogicGate #IntegratedCircuit #ElectronicsDesign #EmbeddedSystems
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ESP32-C3-MINI-1 ESP32-C 802.11 b/g/n (WiFi/WLAN/Wi-Fi 4), Bluetooth® 5.x (BLE) Transceiver 2.4GHz Evaluation Board ESP32-C3-DevKitM-1 is a compact entry-level development board from Espressif Systems based on the ESP32-C3-MINI-1 module. It integrates a 32-bit RISC-V single-core microcontroller, 2.4 GHz Wi-Fi, and Bluetooth Low Energy (BLE) connectivity, making it suitable for IoT devices, embedded applications, smart sensors, and wireless control projects. The board exposes most GPIO pins through headers for easy prototyping and supports programming through USB. Key Features: 32-bit RISC-V Single-Core Processor Based on ESP32-C3 SoC architecture Clock frequency up to 160 MHz Wireless Connectivity Integrated 2.4 GHz Wi-Fi (802.11 b/g/n) Bluetooth 5 Low Energy (BLE) support Memory 4 MB embedded Flash memory inside the ESP32-C3-MINI-1 module GPIO and Peripheral Interfaces Multiple programmable GPIO pins Supports interfaces such as: SPI UART I²C I²S PWM ADC USB Serial/JTAG Development Board Features Built-in ESP32-C3-MINI-1 module with PCB antenna USB interface for programming and power 5 V to 3.3 V onboard voltage regulator Breadboard-friendly pin headers Applications IoT gateways Smart home devices Wireless sensors Industrial automation Wearable electronics Embedded control systems #ESP32C3 #ESP32 #DevKitM1 #Espressif #RISCVD #WiFiMCU #BluetoothLE #IoT #EmbeddedSystems #Microcontroller #WirelessModule #SmartDevices #ElectronicsDesign #Prototyping
7 Uses
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Macronix MX66UM1G45G – 1 Gbit (128 MB) Octal SPI (xSPI) Serial NOR Flash memory designed for high-performance embedded systems. Supports Octal I/O interface for high-speed code execution, firmware storage, data logging, graphics assets, and external memory expansion. Features sector, block, and chip erase operations, page programming, status monitoring, low-power standby mode, and endurance of up to 100,000 program/erase cycles. Suitable for microcontrollers, processors, industrial systems, automotive electronics, networking equipment, IoT devices, HMI displays, and embedded Linux applications. Search Keywords: MX66UM1G45G, Macronix Flash Memory, Octal SPI Flash, OctaFlash, xSPI Flash, Serial NOR Flash, 1Gbit Flash Memory, 128MB Flash, External Flash Memory, Boot Flash, Firmware Storage, Execute In Place Flash, XIP Memory, High Speed Flash Memory, Embedded Storage, Industrial Flash Memory, Automotive Flash Memory, MCU External Memory, Processor Boot Memory, Non Volatile Memory MX66UM1G45G Hashtags: #MX66UM1G45G #Macronix #OctalSPI #OctaFlash #xSPI #NORFlash #SerialFlash #FlashMemory #ExternalMemory #NonVolatileMemory #FirmwareStorage #XIP #EmbeddedSystems #Microcontroller #IndustrialElectronics #AutomotiveElectronics #IoTDevices #ElectronicsDesign #PCBDesign #EmbeddedHardware
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