Microchip ATmega32U4 high-performance low-power 8-bit AVR microcontroller with integrated USB 2.0 full-speed device controller, up to 16MHz operation, 32KB Flash memory, 2.5KB SRAM and 1KB EEPROM, 12-channel 10-bit ADC, timers, PWM, SPI, TWI/I2C, USART, JTAG debug interface, watchdog timer, brown-out detection and multiple sleep modes, operating voltage range 2.7V to 5.5V, available in TQFP-44 and QFN-44 packages. Search Keywords: ATmega32U4, Microchip ATmega32U4, Atmel ATmega32U4, AVR USB microcontroller, 8-bit AVR MCU, ATmega32U4 USB, ATmega32U4 TQFP44, ATmega32U4 QFN44, 32KB Flash AVR, Arduino Leonardo MCU, Pro Micro MCU, ATmega32U4 datasheet Hashtags: #ATmega32U4 #MicrochipATmega32U4 #AtmelATmega32U4 #AVRMicrocontroller #8bitMCU #USBMicrocontroller #USBFullSpeed #32KBFlash #ArduinoLeonardoMCU #ProMicroMCU #TQFP44 #QFN44MCU AVR 32K FLASH 16MHZ 44-TQFP Atmel ATMEGA32U4-AU, 8bit AVR Microcontroller, 16MHz, 1 kB, 32 kB Flash, 44-Pin TQFP USB-C Pro Micro ATmega32U4 / Elite-C compatible module
1 Use
0 Stars
Power Management IC for iMX8M 5V 6A 6 Buck + 5 LDO The PCA9450CHNY is a highly integrated Power Management Integrated Circuit (PMIC) from NXP Semiconductors, specifically designed to power the i.MX 8M family of application processors, particularly the i.MX 8M Plus. It integrates multiple high-efficiency DC-DC buck converters, LDO regulators, power sequencing logic, load switching, voltage monitoring, and system control functions into a single device. The PCA9450C variant features a configurable dual-phase 6 A buck regulator for powering high-current processor cores while supporting Dynamic Voltage Scaling (DVS) for optimized power efficiency. Key Features Six high-efficiency switching regulators (Buck converters) PCA9450C variant supports a configurable 6 A dual-phase buck regulator Three 3 A buck regulators with Dynamic Voltage Scaling (DVS) Remote-sense capability on major buck outputs for IR-drop compensation Five integrated LDO regulators Supports DDR4, LPDDR4, and DDR3L memory configurations 400 mA load switch with active discharge Dual-channel logic level translator Integrated 32.768 kHz crystal oscillator driver Fast-mode Plus (Fm+) 1 MHz I²C interface Programmable power sequencing and voltage control Power ON/OFF and Standby/Run mode control inputs Protection features including UVLO, thermal shutdown, fault monitoring, and soft-start Operating temperature range: −40°C to +105°C 56-pin HVQFN package (7 mm × 7 mm, 0.4 mm pitch) Optimized for i.MX 8M Mini, Nano, and Plus processors, especially the i.MX 8M Plus for the PCA9450C variant. #CommonPartsLibrary #PCA9450CHNY #PCA9450C #NXP #PMIC #PowerManagementIC #PowerSupply #VoltageRegulator #BuckConverter #LDO #DynamicVoltageScaling #DVS #IMX8M #IMX8MPlus #EmbeddedSystems #IndustrialElectronics #PowerManagement #HVQFN56 #Semiconductor #IntegratedCircuit #IC #CommonPartsLibrary #ElectronicsDesign #HardwareDesign #PCBDesign #EmbeddedLinux #IoT #ProcessorPowerManagement #PowerSequencing #SystemPower #NXPSemiconductors
3 Uses
0 Stars
SDRAM - Mobile LPDDR4 Memory IC 48Gbit 2.133 GHz MT53E1536M32D4DT-046 WT:A is a high-density 48Gb (6GB) LPDDR4/LPDDR4X SDRAM memory device from Micron Technology. It is designed for high-performance, low-power applications requiring fast memory bandwidth and efficient power management. The device features a 32-bit data bus, supports data rates up to 4266 MT/s, and is packaged in a compact 200-ball FBGA, making it suitable for embedded computing, industrial systems, networking equipment, AI edge devices, automotive electronics, and mobile platforms. Key Features 48Gb (6GB) LPDDR4/LPDDR4X SDRAM Organized as 1.5G × 32 bits Data transfer rates up to 4266 MT/s Maximum clock frequency of 2133 MHz Low-power operation with 1.1V core supply 32-bit memory interface 200-ball FBGA package JEDEC LPDDR4-compliant architecture Per-bank refresh support Temperature-compensated refresh Self-refresh and deep power-down modes Partial-array self-refresh capability High bandwidth with reduced power consumption Optimized for compact embedded designs Operating temperature range: –30°C to +85°C Typical Applications Embedded Linux computers Single-board computers (SBCs) AI and edge computing platforms Industrial automation systems Networking and telecommunications equipment Automotive infotainment and control systems Tablets and mobile devices FPGA and SoC-based designs #commonpartslibrary #integratedcircuit #memory #dram #sdram #lpddr4 #lpddr4x #mobiledram #micron #embeddedsystems #embeddedcomputing #industrialelectronics #automotiveelectronics #edgecomputing #artificialintelligence #networking #telecommunications #highspeedmemory #lowpowerdesign #computerhardware #electroniccomponents #semiconductor #datasheet #fbga #memorychip #electronicsdesign #pcbdesign #hardwareengineering #electronicengineering #systemonchip #fpga #iot #internetofthings #computermemory #digitalelectronics #surfaceMount #smt #bga #storage #highperformancecomputing #hpc #mobiledevices #industrialautomation #electronicdesign #componentlibrary #fluxlibrary #parametricpart #eda #schematic #pcb #electronicdesignautomation #chipdesign #embeddedhardware #memorymodule #lowpowerelectronics #highbandwidthmemory #electronics #hardwaredevelopment #engineering #electricalengineering
0 Uses
0 Stars
ST Microelectronics STM32L031K6T6TR LQFP-32_L7.0-W7.0-P0.80-LS9.0-BL LCSC Part Number: C2054289 JLCPCB Part Class: Extended Part Manufactured by ST(意法半导体) STMicroelectronics STM32L031x4/6 ultra-low-power 32-bit ARM Cortex-M0+ microcontroller family, operating up to 32MHz, with up to 32KB Flash memory, 1KB EEPROM and 8KB SRAM. Features 12-bit ADC with hardware oversampling, ultra-low-power comparators, timers, RTC, watchdogs, SysTick, I2C, SPI, USART and low-power UART interfaces. Supports multiple internal/external clock sources, low-power modes, backup registers and operation from 1.8V to 3.6V supply, with power-down operation down to 1.65V. Suitable for low-power embedded, battery-powered, sensor, industrial and portable applications. Search Keywords: STM32L031x4, STM32L031x6, STM32L031, STMicroelectronics STM32L031, STM32L031 MCU, STM32L0 microcontroller, ARM Cortex-M0+ MCU, ultra low power STM32, 32MHz microcontroller, STM32 32KB Flash, STM32 EEPROM MCU, STM32L031 I2C SPI USART, STM32L031 low power UART, STM32L031 ADC, STM32L031 datasheet Hashtags: #STM32L031 #STM32L031x4 #STM32L031x6 #STMicroelectronics #STM32L0 #CortexM0Plus #ARMMicrocontroller #UltraLowPowerMCU #32MHzMCU #32KBFlash #EEPROMMCU #I2CMCU #SPIMCU #USARTMCU #LowPowerUART #ADC12bit
23 Uses
0 Stars
ST Microelectronics STM32L432KCU6 UFQFPN-32_L5.0-W5.0-P0.50-TL-EP3.5 LCSC Part Number: C1337280 JLCPCB Part Class: Extended Part Manufactured by ST(意法半导体) STMicroelectronics STM32L432KC ultra-low-power 32-bit ARM Cortex-M4 microcontroller with FPU running up to 80MHz, featuring 256KB Flash memory, 64KB SRAM, USB 2.0 Full-Speed device support, Quad-SPI interface, RTC with calendar and alarms, true random number generator (TRNG), DMA controller, CAN 2.0B, UART, LPUART, SPI, I2C, SAI audio interface, 12-bit 5MSPS ADC, dual 12-bit DACs, operational amplifier with PGA, comparators, capacitive sensing channels, advanced timers and ultra-low-power modes. Operates from 1.71V to 3.6V and is optimized for battery-powered, industrial, medical, IoT and portable embedded applications. Search Keywords: STM32L432KC, STM32L432KCU6, STM32L432KCU6TR, STM32L432, STM32L4 series, STM32 Cortex-M4 MCU, STM32 low power microcontroller, STM32 256KB Flash 64KB SRAM, STM32 USB FS MCU, STM32 CAN MCU, STM32 Quad SPI MCU, STM32L432 datasheet, STM32L432 development board, Nucleo-L432KC, ARM Cortex-M4 FPU Hashtags: #STM32L432KC #STM32L432KCU6 #STM32L432 #STM32L4 #STMicroelectronics #CortexM4 #ARMMicrocontroller #LowPowerMCU #EmbeddedSystems #USBFS #CANBus #QuadSPI #ADC12bit #DAC12bit #RTC #TRNG #IoTMCU #IndustrialMCU #MedicalElectronics #NucleoL432KC
34 Uses
0 Stars
Coin, 20.0mm Lithium Manganese Dioxide 3 V Battery Non-Rechargeable (Primary) The CR2032 is a compact, coin-cell lithium battery widely used in portable electronic devices, providing long-lasting, stable power in a small form factor. It features a cylindrical shape with a flat positive terminal and a metal casing that serves as the negative terminal. Known for its high energy density and wide operating temperature range, this battery is ideal for memory backup, real-time clocks, small medical devices, remote controls, wearable electronics, and low-drain consumer electronics. Its reliability, shelf life, and lightweight design make it a standard choice for a broad range of compact electronic applications. Engineering Specifications Battery Type: Lithium Coin Cell Chemistry: Lithium Manganese Dioxide Standard Designation: CR2032 Nominal Voltage: 3 Volts Capacity: Typical Rated Capacity for Consumer Electronics Discharge Characteristics: Suitable for Low-Drain Applications Dimensions: Standard Diameter and Height for CR2032 Operating Temperature Range: Wide Range for Consumer and Industrial Use Shelf Life: Extended, Suitable for Long-Term Storage Terminals: Flat Positive Top, Metal Casing Negative Bottom RoHS Compliant: Yes Applications: Watches, Calculators, Motherboard CMOS Backup, Fitness Trackers, Remote Controls, Medical Devices, Sensors, Small Electronics #CR2032 #LithiumBattery #CoinCell #3Volt #LongLifeBattery #PortableElectronics #Wearables #ConsumerElectronics #MemoryBackup #LowDrainDevice #IndustrialElectronics #BatteryComponent #PCBDesign #CompactPower
0 Uses
0 Stars
ARM-MSeries LQFP-48(7x7) Microcontrollers (MCU/MPU/SOC) ROHS ST Microelectronics STM32G0B1CBT6 LQFP-48_L7.0-W7.0-P0.50-LS9.0-BL LCSC Part Number: C2847904 JLCPCB Part Class: Extended Part Manufactured by ST(意法半导体) STMicroelectronics STM32G0B1 series 32-bit Arm Cortex-M0+ microcontroller, up to 64MHz CPU frequency, 1.7V to 3.6V operating voltage, up to 512KB Flash memory and 144KB SRAM, USB 2.0 full-speed device/host support, USB Type-C Power Delivery controller, FDCAN, I2C, USART, SPI, HDMI CEC, 12-bit ADC, 12-bit DACs, timers, RTC, DMA, CRC unit, SWD debug interface, 96-bit unique ID, operating temperature options up to -40°C to +125°C, available in LQFP, UFQFPN, UFBGA and WLCSP packages. Search Keywords: STM32G0B1, STM32G0B1xB, STM32G0B1xC, STM32G0B1xE, STMicroelectronics STM32G0B1, STM32G0B1 MCU, STM32G0B1 microcontroller, Arm Cortex-M0+ microcontroller, STM32G0 64MHz MCU, STM32G0B1 USB Type-C PD, STM32G0B1 USB FS, STM32G0B1 FDCAN, STM32G0B1 512KB Flash, STM32G0B1 144KB SRAM, STM32G0B1 LQFP, STM32G0B1 UFQFPN, STM32G0B1 UFBGA, STM32G0B1 WLCSP, STM32G0B1 datasheet Hashtags: #STM32G0B1 #STM32G0B1xB #STM32G0B1xC #STM32G0B1xE #STMicroelectronics #STM32MCU #STM32G0 #ArmCortexM0Plus #32bitMicrocontroller #64MHzMCU #512KBFlashMCU #144KBSRAM #USBTypeCPD #USBFS #FDCAN #I2CMCU #SPIMCU #USARTMCU #ADCmicrocontroller #DACmicrocontroller #LQFP #UFQFPN #UFBGA #WLCSP
47 Uses
0 Stars
Thermal Image Sensor 32H x 24V TO-39 # MLX90640ESF-BAB-000-TU Engineering Specifications **General Description** The MLX90640ESF-BAB-000-TU is a contactless infrared thermal imaging sensor manufactured by Melexis. It incorporates a microbolometer array that detects infrared radiation emitted by objects and converts the captured thermal energy into temperature data, enabling the creation of thermal images without physical contact. The device is designed for compact and cost-effective thermal imaging applications, offering high thermal sensitivity and accurate temperature measurement capabilities. It integrates a digital signal-processing engine, calibration data memory, and a digital communication interface, allowing direct connection to microcontrollers, embedded systems, and industrial monitoring equipment. The sensor provides real-time thermal mapping across its field of view and is suitable for applications involving human presence detection, predictive maintenance, industrial automation, smart building systems, medical screening, consumer electronics, robotics, and thermal monitoring solutions. Its factory calibration ensures stable performance throughout its operating life while minimizing external calibration requirements. **Engineering Specifications** **Manufacturer:** Melexis **Manufacturer Part Number:** MLX90640ESF-BAB-000-TU **Component Type:** Infrared thermal imaging sensor **Sensor Technology:** Microbolometer thermal sensor array **Measurement Method:** Non-contact infrared temperature sensing **Output Type:** Digital thermal image data **Communication Interface:** I²C-compatible serial interface **Temperature Measurement Capability:** Object temperature monitoring and thermal imaging **Thermal Imaging Function:** Real-time thermal map generation **Integrated Processing:** On-chip signal processing and calibration management **Calibration:** Factory calibrated with stored calibration parameters **Power Supply Configuration:** Single-supply operation **Power Consumption:** Optimized for low-power embedded applications **Refresh Rate:** Programmable thermal frame refresh operation **Thermal Sensitivity:** High-sensitivity infrared detection **Field of View Variant:** Wide-angle thermal imaging configuration **Accuracy Characteristics:** High-precision temperature measurement with integrated compensation algorithms **Memory Features:** Internal EEPROM for calibration coefficients **Operating Mode:** Continuous and programmable thermal acquisition **Data Output Format:** Digital temperature and thermal pixel information **Environmental Stability:** Designed for reliable operation across varying ambient conditions **Electromagnetic Compatibility:** Suitable for embedded and industrial electronic systems **Package Type:** Surface-mount package with infrared-transparent window **Mounting Style:** Surface mount technology **Package Construction:** Reflow-solderable assembly **Lead Finish:** Lead-free finish **Environmental Compliance:** RoHS compliant and halogen-free **Reliability Features:** Factory-tested and production-calibrated thermal imaging device **Typical Applications** Thermal cameras Human presence detection systems Occupancy monitoring Industrial predictive maintenance Electrical equipment inspection Smart building automation HVAC monitoring systems Medical screening devices Consumer electronics Robotics and autonomous systems Fire detection and prevention systems Industrial process monitoring Energy management systems Automotive thermal sensing applications Security and surveillance equipment #MLX90640 #MLX90640ESF #Melexis #ThermalSensor #InfraredSensor #ThermalImaging #Microbolometer #TemperatureSensor #IndustrialAutomation #EmbeddedSystems #IoT #PredictiveMaintenance #SmartBuilding #ThermalCamera #ElectronicComponents #EngineeringSpecifications
3 Uses
0 Stars
SIM Card Connectors 1040310811 SIM-SMD_8P-1040310811 LCSC Part Number: C585350 JLCPCB Part Class: Extended Part Manufactured by MOLEX Molex 104031-0811 microSD card socket connector, push-pull type, surface mount (SMT), 8-position microSD memory card receptacle with card-detect switch, 1.42mm profile height, liquid crystal polymer (LCP) housing UL94V-0, phosphor bronze contacts with gold plating, stainless steel shell, designed for removable microSD storage applications in embedded systems, IoT devices, consumer electronics and portable equipment. Search Keywords: 104031-0811, Molex 104031-0811, Molex microSD socket, microSD card connector SMT, push pull microSD connector, microSD card receptacle, card detect microSD socket, 8 pin microSD connector, low profile microSD socket, SMT memory card connector, Molex 104031 series, microSD holder with card detect Hashtags: #1040310811 #Molex1040310811 #Molex #MicroSDSocket #MicroSDConnector #MemoryCardConnector #PushPullSocket #CardDetectSwitch #SMTConnector #EmbeddedStorage #MicroSDHolder #LCPHousing #PortableElectronics #IoTHardware #PCBConnector
51 Uses
0 Stars
SPI Flash Serial Flash Memory with Dual/Quad SPI The W25Q16JVUXIQ is a 16-Mbit (2-MByte) Serial NOR Flash memory device from Winbond. It is designed for embedded systems that require non-volatile code and data storage with minimal pin count, low power consumption, and high-speed access. The device supports standard SPI, Dual SPI, and Quad SPI interfaces, making it suitable for firmware storage, boot memory, IoT devices, microcontrollers, consumer electronics, and execute-in-place (XIP) applications. Key Features 16-Mbit (2-MByte) Flash Memory Capacity Operating Voltage: 2.7 V to 3.6 V Standard SPI, Dual SPI, and Quad SPI Interface Support Maximum SPI Clock Frequency: 133 MHz Equivalent Data Transfer Rates: 266 MHz (Dual SPI) 532 MHz (Quad SPI) Continuous Read and XIP (Execute-In-Place) Capability 4 KB Sector Erase, 32 KB Block Erase, 64 KB Block Erase, and Chip Erase 256-Byte Programmable Page Size Minimum 100,000 Program/Erase Cycles per Sector More Than 20 Years Data Retention Ultra-Low Power Consumption Typical power-down current below 1 µA 64-Bit Unique Serial Number Three 256-Byte Security Registers with OTP Protection JEDEC ID and SFDP Support Software and Hardware Write Protection Operating Temperature Options up to +85°C and +105°C Compact 8-Pad USON Package (2 mm × 3 mm) suitable for space-constrained designs #CommonPartsLibrary #IntegratedCircuit #Memory
104 Uses
0 Stars
2.4GHz Wi-Fi+Bluetooth LE SoC ESP32-S3FH4R2 is a highly integrated low-power Wi-Fi and Bluetooth LE System-on-Chip (SoC) from Espressif Systems. It is based on a dual-core Xtensa® LX7 processor running at up to 240 MHz and is designed for IoT, smart home, industrial control, AIoT, audio processing, and embedded applications. The ESP32-S3FH4R2 variant includes 4 MB of in-package Quad SPI Flash and 2 MB of in-package Quad SPI PSRAM, reducing external component count and simplifying PCB design. Key Features Dual-core Xtensa® LX7 CPU Up to 240 MHz operating frequency 32-bit architecture with floating-point unit (FPU) SIMD instructions for AI and signal-processing workloads Integrated Memory 4 MB in-package Flash 2 MB in-package PSRAM 512 KB on-chip SRAM 384 KB ROM Additional RTC memory for low-power operation Wireless Connectivity IEEE 802.11 b/g/n 2.4 GHz Wi-Fi Bluetooth® 5 Low Energy (LE) Long-range and low-power wireless communication support Rich Peripheral Set Up to 45 programmable GPIOs USB OTG and USB Serial/JTAG SPI, I²C, I²S, UART, SDIO TWAI® (CAN 2.0 compatible) Camera interface LCD interface PWM, pulse counter, RMT, DMA controller Analog Features Two 12-bit SAR ADCs Temperature sensor 14 capacitive touch sensing inputs Security Features Secure Boot Flash Encryption AES, SHA, RSA, HMAC hardware accelerators True Random Number Generator (RNG) Digital Signature peripheral Low-Power Operation Multiple power-saving modes ULP-RISC-V coprocessor ULP-FSM coprocessor Deep-sleep support with RTC memory retention
24 Uses
0 Stars
Accelerometer X, Y, Z Axis ±2g, 4g, 8g, 16g 0.05Hz ~ 1.6kHz 14-LGA (3x5) The ADXL345-EP is an extended performance version of the ADXL345, which is a small, thin, ultralow power, 3-axis accelerometer with high resolution (13-bit) measurement at up to ±16 g. Digital output data is formatted as 16-bit twos complement and is accessible through either a SPI (3- or 4-wire) or I2 C digital interface. The ADXL345-EP is well suited for extended temperature range industrial and aerospace equipment. It measures the static acceleration of gravity in tilt-sensing applications, as well as dynamic acceleration resulting from motion or shock. Its high resolution (3.9 mg/LSB) enables measurement of inclination changes less than 1.0°. Several special sensing functions are provided. Activity and inactivity sensing detect the presence or lack of motion by comparing the acceleration on any axis with user-set thresholds. Tap sensing detects single and double taps in any direction. Freefall sensing detects if the device is falling. These functions can be mapped individually to either of two interrupt output pins. An integrated memory management system with a 32-level first in, first out (FIFO) buffer can be used to store data to minimize host processor activity and lower overall system power consumption. Low power modes enable intelligent motion-based power management with threshold sensing and active acceleration measurement at extremely low power dissipation. The ADXL345-EP is supplied in a small, thin, 3 mm × 5 mm × 1 mm, 14-lead, enhanced plastic package. Ultralow power: as low as 23 µA in measurement mode and 0.1 µA in standby mode at VS = 2.5 V (typical) Power consumption scales automatically with bandwidth User-selectable resolution from 10 to 13 bits 4 mg/LSB scale factor in all g ranges 32-sample FIFO minimizes host processor load Single tap, double tap, and free-fall detection Activity/inactivity monitoring Supply voltage range: 2.0 V to 3.6 V I/O voltage range: 1.7 V to VS SPI (3- and 4-wire) and I2C digital interfaces Flexible interrupt modes mappable to either interrupt pin Measurement ranges selectable via serial command Bandwidth selectable via serial command 10,000 g shock survival Pb free/RoHS compliant Small and thin: 3 mm × 5 mm × 1 mm LGA package #CommonPartsLibrary #Sensor #Motion-sensor #accelerometer
49 Uses
0 Stars
Buffers / Drivers SN74HCT125DRE4 SOIC-14_L8.6-W3.9-P1.27-LS6.0-BL LCSC Part Number: C2675588 JLCPCB Part Class: Extended Part Manufactured by TI(德州仪器) Texas Instruments SN74HCT125/SN54HCT125 quadruple bus buffer IC with 3-state outputs, contains four independent non-inverting buffers with TTL-compatible inputs, positive logic function Y=A, 4.5V to 5.5V operating voltage range, high-current outputs capable of driving up to 15 LSTTL loads, ±6mA output drive at 5V, low input current, typical 12ns propagation delay, suitable for bus line driving, memory address buffering and digital logic interface applications, available in SOIC-14 and PDIP-14 packages. Search Keywords: SN74HCT125, SN54HCT125, Texas Instruments SN74HCT125, TI SN74HCT125, SN74HCT125 buffer, 74HCT125 buffer, quad bus buffer, quadruple bus buffer, 3-state buffer IC, tri-state buffer IC, non-inverting buffer IC, TTL-compatible CMOS buffer, HCT logic buffer, bus line driver, memory address buffer, SN74HCT125D, SN74HCT125N, SOIC-14 buffer, PDIP-14 buffer, SN74HCT125 datasheet Hashtags: #SN74HCT125 #SN54HCT125 #74HCT125 #TexasInstrumentsSN74HCT125 #TIBufferIC #BusBuffer #QuadBusBuffer #TriStateBuffer #3StateBuffer #NonInvertingBuffer #HCTLogic #TTLCompatibleInput #LogicBufferIC #BusLineDriver #AddressBuffer #SOIC14 #PDIP14
31 Uses
0 Stars
SPI Flash Memory with Dual/Quad SPI The W25Q128JV (128M-bit) Serial Flash memory provides a storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The device operates on a single 2.7V to 3.6V power supply with current consumption as low as 1µA for power-down. All devices are offered in space-saving packages. The W25Q128JV array is organized into 65,536 programmable pages of 256-bytes each. Up to 256 bytes can be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q128JV has 4,096 erasable sectors and 256 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data and parameter storage. (See Figure 2.) The W25Q128JV supports the standard Serial Peripheral Interface (SPI), Dual/Quad I/O SPI: Serial Clock, Chip Select, Serial Data I/O0 (DI), I/O1 (DO), I/O2 and I/O3. SPI clock frequencies of W25Q128JV of up to 133MHz are supported allowing equivalent clock rates of 266MHz (133MHz x 2) for Dual I/O and 532MHz (133MHz x 4) for Quad I/O when using the Fast Read Dual/Quad I/O. These transfer rates can outperform standard Asynchronous 8 and 16-bit Parallel Flash memories. New Family of SpiFlash Memories – W25Q128JV: 128M-bit / 16M-byte – Standard SPI: CLK, /CS, DI, DO – Dual SPI: CLK, /CS, IO0, IO1 – Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 – Software & Hardware Reset(1) Highest Performance Serial Flash – 133MHz Single, Dual/Quad SPI clocks – 266/532MHz equivalent Dual/Quad SPI – 66MB/S continuous data transfer rate – Min. 100K Program-Erase cycles per sector – More than 20-year data retention Efficient “Continuous Read” – Continuous Read with 8/16/32/64-Byte Wrap – As few as 8 clocks to address memory – Allows true XIP (execute in place) operation Low Power, Wide Temperature Range – Single 2.7 to 3.6V supply – <1µA Power-down (typ.) – -40°C to +85°C operating range – -40°C to +105°C operating range Flexible Architecture with 4KB sectors – Uniform Sector/Block Erase (4K/32K/64K-Byte) – Program 1 to 256 byte per programmable page – Erase/Program Suspend & Resume Advanced Security Features – Software and Hardware Write-Protect – Power Supply Lock-Down – Special OTP protection – Top/Bottom, Complement array protection – Individual Block/Sector array protection – 64-Bit Unique ID for each device – Discoverable Parameters (SFDP) Register – 3X256-Bytes Security Registers with OTP locks – Volatile & Non-volatile Status Register Bits Space Efficient Packaging – 8-pin SOIC 208-mil – 16-pin SOIC 300-mil (additional /RESET pin) – 8-pad WSON 6x5-mm / 8x6-mm – 24-ball TFBGA 8x6-mm (6x4/5x5 ball array) – 24-ball WLCSP – Contact Winbond for KGD and other options #CommonPartsLibrary #IntegratedCircuit #Memory
35 Uses
0 Stars
Satellite Positioning Modules L76KB-A58 GPSM-SMD_18P-L10.1-W9.7-P1.10 LCSC Part Number: C2916234 JLCPCB Part Class: Extended Part Manufactured by Quectel(移远) Quectel L76 compact GNSS module, concurrent multi-GNSS receiver supporting GPS, GLONASS, BeiDou, Galileo and QZSS, 33 tracking channels, 99 acquisition channels and 210 PRN channels, supports EASY AGPS and AlwaysLocate technology, integrated LOCUS embedded logger with internal flash memory, low power consumption, suitable for automotive, industrial PDA, consumer, industrial and portable positioning applications. Search Keywords: Quectel L76, L76 GNSS module, Quectel L76 GPS module, compact GNSS module, multi GNSS receiver, GPS GLONASS BeiDou Galileo QZSS module, L76 GPS GLONASS module, L76M33, L76 compact GPS module, Quectel GNSS receiver, GNSS module with AGPS, EASY AGPS module, AlwaysLocate GNSS, LOCUS logger GNSS module, low power GNSS module, Quectel L76 datasheet Hashtags: #QuectelL76 #L76GNSS #L76GPS #QuectelGNSS #GNSSModule #GPSModule #MultiGNSS #GPSReceiver #GLONASSModule #BeiDouModule #GalileoModule #QZSSModule #CompactGNSSModule #AGPSModule #EASYAGPS #AlwaysLocate #LOCUSLogger #LowPowerGNSS
28 Uses
0 Stars
ESP32-C3FN4 QFN-32_L5.0-W5.0-P0.50-BL-EP3.7 LCSC Part Number: C2848860 JLCPCB Part Class: Extended Part Manufactured by ESPRESSIF(乐鑫) Espressif ESP32-C3FN4 2.4GHz Wi-Fi 802.11b/g/n and Bluetooth 5.0 LE wireless SoC, RISC-V single-core microcontroller, integrated 4MB flash memory, 2.402GHz to 2.48GHz RF transceiver, antenna not included, surface-mount package, suitable for IoT devices, wireless sensors, smart home, BLE and Wi-Fi embedded applications. Search Keywords: ESP32-C3FN4, Espressif ESP32-C3FN4, ESP32 C3FN4, ESP32-C3 4MB flash, ESP32-C3 WiFi Bluetooth SoC, ESP32-C3FN4 RF transceiver, ESP32-C3FN4 Bluetooth 5.0, ESP32-C3FN4 WiFi 802.11bgn, ESP32-C3FN4 SMD, ESP32-C3FN4 DigiKey, ESP32-C3FN4 datasheet, 1904-ESP32-C3FN4TR-ND, 1904-ESP32-C3FN4CT-ND, ESP32-C3 RISC-V SoC Hashtags: #ESP32C3FN4 #ESP32C3 #EspressifESP32C3 #EspressifSystems #WiFiBluetoothSoC #WiFiSoC #BluetoothLESoC #BLE5 #80211bgn #RISCVMicrocontroller #4MBFlash #RFTransceiver #24GHzWiFi #IoTSoC #WirelessMCU
19 Uses
0 Stars
ATTINY1616-MFR QFN-20_L3.0-W3.0-P0.40-TL-EP1.7 LCSC Part Number: C1338523 JLCPCB Part Class: Extended Part Manufactured by MICROCHIP(美国微芯) Microchip ATtiny1614/1616/1617 tinyAVR 1-series 8-bit microcontroller, AVR CPU running up to 20MHz, up to 16KB self-programmable Flash memory, 256B EEPROM and 2KB SRAM, 1.8V to 5.5V operating voltage range, single-pin UPDI programming and debug interface, power-on reset and brown-out detector, internal 16/20MHz oscillator, timers, watchdog, USART, SPI, I2C/TWI, 10-bit ADC, DAC, analog comparators, event system, configurable custom logic and peripheral touch controller, available in 14-pin, 20-pin and 24-pin packages depending on variant. Search Keywords: ATtiny1614, ATtiny1616, ATtiny1617, Microchip ATtiny1614, Microchip ATtiny1616, Microchip ATtiny1617, tinyAVR 1-series, AVR 8-bit microcontroller, ATtiny 16KB Flash, ATtiny UPDI, ATtiny1616 microcontroller, ATtiny1617 MCU, ATtiny1614 MCU, 20MHz AVR microcontroller, ATtiny I2C SPI USART, ATtiny1616 datasheet, ATtiny1614 datasheet, ATtiny1617 datasheet Hashtags: #ATtiny1614 #ATtiny1616 #ATtiny1617 #MicrochipATtiny #MicrochipMCU #tinyAVR #tinyAVR1Series #AVRMicrocontroller #8bitMicrocontroller #ATtinyMCU #UPDI #16KBFlashMCU #20MHzMCU #I2CMCU #SPIMCU #USARTMCU #ADCmicrocontroller #TouchControllerMCU
32 Uses
0 Stars
ESP32-S3-WROOM-1-N8 is a high-performance Wi-Fi and Bluetooth Low Energy (BLE) module from Espressif Systems. It is built around the ESP32-S3 SoC, featuring a dual-core Xtensa LX7 processor, integrated 2.4 GHz Wi-Fi and Bluetooth 5 LE connectivity, 8 MB SPI flash memory, and a PCB antenna. The module is optimized for AIoT, edge computing, human-machine interfaces, smart devices, and industrial IoT applications. Key Features Dual-core Xtensa® LX7 CPU running up to 240 MHz for high-performance embedded applications. 8 MB onboard SPI Flash (N8 variant) for firmware and data storage. 2.4 GHz Wi-Fi (802.11 b/g/n) with data rates up to 150 Mbps. Bluetooth 5 LE support including: Long Range mode 2 Mbps PHY Bluetooth Mesh Extended Advertising AI acceleration support through ESP32-S3 vector instructions for machine learning and signal-processing workloads. USB 1.1 OTG and USB Serial/JTAG integrated, simplifying debugging and USB device applications. Up to 45 GPIOs with extensive peripheral support: SPI I²C I²S UART PWM ADC Touch Sensors TWAI® (CAN-compatible) Camera Interface LCD Interface SDIO Host MCPWM Integrated 40 MHz crystal oscillator, RF matching circuitry, and PCB antenna for reduced external component count. Operating voltage range: 3.0 V to 3.6 V. Compact surface-mount module suitable for space-constrained designs. Typical Applications Smart home and home automation devices HMI displays and touchscreen products Voice recognition and audio processing Edge AI and machine learning applications Industrial IoT gateways and sensors Video streaming and camera systems USB-connected embedded devices Smart agriculture and healthcare equipment N8 specifically indicates 8 MB Flash and no PSRAM, making it a good choice for applications requiring substantial program storage but not large external RAM. #RF-transceiver #Module #ESP32
108 Uses
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ESP32-S3-MINI-1-N8 is a compact, low-power Wi-Fi and Bluetooth module from Espressif Systems based on the ESP32-S3 SoC. It integrates a dual-core Xtensa LX7 processor, 8 MB flash memory, crystal oscillator, RF matching circuitry, and a PCB antenna in a small SMD package, making it ideal for IoT devices, smart home products, industrial automation, HMI applications, AIoT edge devices, and USB-connected embedded systems. Key Features Dual-core 32-bit Xtensa LX7 CPU Up to 240 MHz operating frequency Includes single-precision floating-point unit (FPU) for enhanced processing performance. Integrated Memory 8 MB Quad SPI Flash (N8 variant) 512 KB SRAM 384 KB ROM 16 KB RTC SRAM. Wireless Connectivity 2.4 GHz Wi-Fi 4 (802.11 b/g/n) Data rates up to 150 Mbps Bluetooth 5 LE with Bluetooth Mesh support Simultaneous Wi-Fi and Bluetooth operation through an integrated coexistence mechanism. Rich Peripheral Set Up to 39 GPIOs USB 2.0 OTG USB Serial/JTAG SPI, I²C, I²S, UART PWM, MCPWM SDIO Host ADC Touch sensing Temperature sensor TWAI® (CAN 2.0 compatible) Timers and watchdogs. Integrated Components On-board 40 MHz crystal oscillator PCB antenna RF matching network Compact certified module design. Operating Conditions Supply voltage: 3.0 V to 3.6 V Operating temperature: −40°C to +85°C. Compliance RoHS and REACH compliant RF-certified module for simplified product development. #RF_transceiver #Module #Esp32
203 Uses
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ESP32-C3-MINI-1-H4 is a compact, low-power wireless module from Espressif Systems built around the ESP32-C3 SoC. It integrates a 32-bit RISC-V processor, 2.4 GHz Wi-Fi, Bluetooth 5 LE, onboard 4 MB flash memory, crystal oscillator, RF matching circuitry, and a PCB antenna in a small surface-mount package. The module is designed for IoT devices, smart home products, industrial automation, wearable electronics, and wireless sensor applications. Key Features 32-bit RISC-V single-core processor with clock speeds up to 160 MHz. 2.4 GHz Wi-Fi 4 (802.11 b/g/n) connectivity. Bluetooth 5 Low Energy (BLE 5.0) support with long-range capability. 4 MB embedded SPI flash memory (H4 variant). 384 KB ROM and 408 KB SRAM for application execution. Integrated PCB antenna for simplified RF design. USB Serial/JTAG controller for programming and debugging without an external USB-to-UART bridge. Multiple peripheral interfaces: UART SPI I²C I²S PWM GPIO ADC USB JTAG Operating voltage range: 3.0 V to 3.6 V. Supports secure boot, flash encryption, and hardware cryptographic acceleration. Compact SMD module suitable for space-constrained designs. Typical Applications Smart home and home automation devices Wireless sensors and data loggers IoT gateways and edge devices Industrial monitoring and control systems Bluetooth beacons Wearable electronics Consumer connected products H4 Variant Note: The ESP32-C3-MINI-1-H4 version includes 4 MB flash memory and supports an extended operating temperature range up to 105°C, making it suitable for more demanding industrial environments. #RF-Transceiver #ESP32 #Module
99 Uses
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