Crystals
A crystal is a solid material in which the atoms, molecules, or ions are arranged in an orderly repeating pattern extending in all three spatial dimensions. Crystalline materials are known for their beauty and symmetry, and they have a wide range of practical uses in fields such as electronics, jewelry, and construction. One of the key uses of crystals is in electronic devices, where they are used as semiconductors to control the flow of electricity. Crystalline materials are also used in the production of jewelry, as they can be cut and polished to create stunning gemstones. In construction, crystalline materials such as quartz and granite are often used as decorative building materials due to their durability and attractive appearance. If you are looking for high-quality crystals for your next project, flux.ai has the world's largest community-driven public library of them, with footprints, symbols, datasheets, and simulation models. Our library is constantly expanding and is a valuable resource for anyone working with crystalline materials. So, if you want to find the perfect crystal for your needs, be sure to check out flux.ai's extensive collection.
NX3225GD 8.000MHZ STD-CRA-3
The NX3225GD 8.000MHz STD-CRA-3 is a surface-mount quartz crystal resonator designed to provide a stable and accurate clock reference for electronic circuits. It is housed in a compact ceramic package suitable for space-constrained applications and is optimized for low power consumption and reliable frequency generation. This crystal is commonly used in microcontrollers, wireless communication modules, industrial control systems, consumer electronics, IoT devices, and embedded systems requiring precise timing and frequency control. Features Fundamental mode quartz crystal resonator Nominal frequency of 8.000 MHz Compact surface-mount ceramic package High frequency stability and accuracy Low equivalent series resistance Suitable for low-power oscillator circuits Excellent aging characteristics RoHS-compliant construction Designed for automated SMT assembly processes Reliable operation across industrial temperature environments Electrical Characteristics Crystal type: Quartz Crystal Resonator Frequency: 8.000 MHz Oscillation mode: Fundamental Load capacitance: Standard load capacitance configuration Frequency tolerance: Standard precision grade Frequency stability: Industrial-grade stability performance Equivalent series resistance optimized for MCU and RF oscillator circuits Low drive level operation High insulation resistance Mechanical Characteristics Surface-mount package Ceramic hermetic enclosure Compact footprint suitable for high-density PCB layouts Compatible with standard reflow soldering processes Designed for automated pick-and-place assembly Applications Microcontroller clock generation Wireless communication devices Bluetooth and RF modules IoT and smart devices Industrial automation equipment Embedded control systems Consumer electronics Timing and synchronization circuits Sensor interface modules Portable battery-powered products Compliance RoHS compliant Lead-free package Environmentally friendly manufacturing standards Suitable for commercial and industrial electronic applications #commonpartslibrary #crystal #quartzcrystal #frequencycontrol #timingdevice #clocksource #oscillator #smtcomponent #embeddedsystems #wirelesscommunication #industrialelectronics #consumerelectronics #iotdevices #passivecomponents #electroniccomponents
31 Uses0 StarsCC1101RGP
The CC1101RGP is a low-power sub-gigahertz RF transceiver designed for wireless communication applications requiring reliable long-range data transmission and high receiver sensitivity. It integrates a complete radio frequency front-end, packet handling engine, modulation and demodulation circuitry, frequency synthesizer, and advanced power management features within a compact package. The device supports multiple modulation formats and is optimized for industrial, scientific, medical, smart metering, home automation, remote control, wireless sensor networks, and Internet of Things applications. Its flexible configuration options enable designers to achieve an optimal balance between communication range, data throughput, power consumption, and system robustness. Features Sub-gigahertz RF transceiver for license-free ISM frequency bands High receiver sensitivity for extended communication range Programmable output power for optimized power consumption Multiple modulation schemes including FSK, GFSK, ASK, OOK, and MSK Integrated packet handling and error detection functions Fast frequency synthesizer settling time Low current consumption in transmit, receive, and sleep modes Hardware support for address filtering and data buffering Programmable channel spacing and data rate configuration Integrated RSSI, LQI, and clear channel assessment functions SPI interface for configuration and data communication Suitable for battery-powered wireless devices Applications Smart metering systems Wireless sensor networks Industrial monitoring and control Home and building automation Remote keyless entry systems Alarm and security systems Asset tracking devices Telemetry and data acquisition systems IoT communication nodes Proprietary wireless communication networks Electrical Characteristics Wide operating supply voltage range Low-power transmit and receive operation Programmable RF output power levels High-performance frequency synthesizer Low standby and sleep current consumption Integrated crystal oscillator support Robust RF performance across supported frequency bands Interface and Connectivity Serial Peripheral Interface communication Digital control and status signals Configurable interrupt outputs Integrated FIFO buffers for transmit and receive data External antenna connection through matching network Package Information Surface-mount package suitable for automated assembly Compact footprint for space-constrained applications RoHS-compliant device construction #commonpartslibrary #integratedcircuit #wirelesscommunication #rftransceiver #subghz #iot #embeddedsystems #industrialautomation #smartmetering #wirelesssensornetwork #lowpowerdesign #telemetry #homeautomation #remotecontrol #texasinstruments
86 Uses0 StarsNX1612SA-32MHZ-STD-CIS-3
Small and thin surface-mount crystal units NX1612SA-32MHZ-STD-CIS-3 is a compact surface-mount quartz crystal oscillator designed for stable clock generation in embedded electronic systems and wireless communication devices. Manufactured in a miniature ceramic package, this crystal provides precise frequency control with low phase noise and high frequency stability, making it suitable for microcontrollers, RF modules, IoT devices, and portable electronics. The device operates at a nominal frequency of thirty-two megahertz and is optimized for low power consumption and reliable startup characteristics. Its compact footprint enables integration into high-density PCB layouts while maintaining strong resistance to environmental stress and mechanical vibration. The crystal is compatible with standard oscillator circuits and supports stable operation across industrial temperature ranges. This component is commonly used in timing reference applications, communication systems, sensor modules, wearable devices, and battery-powered embedded platforms requiring accurate and stable clock signals. #commonpartslibrary #crystaloscillator #timingdevice #frequencycontrol #embeddedhardware #wirelesssystems #rfdesign #iotdevices #electronicscomponents #surfacemountdevice
40 Uses0 StarsNX3225GD-8MHZ-STD-CRA-3
CRYSTAL 8MHz 8pF SMD The NX3225GD-8MHZ-STD-CRA-3 is an automotive-grade surface-mount quartz crystal unit from NDK designed to provide a stable 8 MHz clock reference for microcontrollers, automotive ECUs, and embedded systems. It belongs to the NX3225GD series and is optimized for high reliability under harsh environmental conditions. Key Features 8 MHz fundamental-mode crystal Compact 3.2 mm × 2.5 mm × 1.0 mm SMD package 8 pF load capacitance ±50 ppm frequency tolerance ±150 ppm frequency stability over temperature Automotive-qualified with AEC-Q200 compliance Wide operating temperature range: −40°C to +150°C Excellent resistance to heat, vibration, shock, and solder cracking Stable startup characteristics in severe environments RoHS compliant Typical Applications Automotive engine control units (ECUs) MCU and CPU clock generation Industrial embedded systems Communication equipment Consumer electronics and IoT devices #CommonPartsLibrary #crystal oscillator #resonator
280 Uses0 Stars2125281000
Micro-Fit+ Right-Angle Header, 3.00mm Pitch, Dual Row, 10 Circuits, UL 94V-0, Glow-Wire Capable Connector Header Through Hole, Right Angle 10 position 0.118" (3.00mm) The 2125281000 is a Molex Micro-Fit+ right-angle PCB header connector designed for compact and reliable wire-to-board power connections in industrial, embedded, and automotive-adjacent applications. It features a 3.00 mm pitch, dual-row 10-circuit configuration (2x5), and through-hole mounting for strong mechanical retention. The connector supports high-current applications while maintaining a compact footprint. Key Features Manufacturer: Molex Series: Micro-Fit+ MPN: 2125281000 Connector Type: Right-angle PCB header Mounting Type: Through-hole Orientation: Right-angle / side-entry Pitch: 3.00 mm Positions: 10 circuits (2x5) Current Rating: Up to 12.5 A per contact Voltage Rating: 600V AC/DC Contact Plating: Matte tin Housing Material: Glass-filled Liquid Crystal Polymer (LCP) Operating Temperature: -40°C to +105°C Shrouded Design: 4-wall shrouding for secure mating Locking Feature: Locking ramp and board lock for vibration resistance Flammability Rating: UL94 V-0 Glow-Wire Capable: Suitable for safety-focused designs Application: Power and wire-to-board connections Typical Applications Power distribution boards Embedded systems Industrial control equipment Robotics Battery-powered devices Automotive support electronics High-current peripheral connections #CommonPartsLibrary #Connector
84 Uses0 StarsSTM32F407VGT6
ARM Microcontrollers - MCU ARM M4 1024 FLASH 168 Mhz 192kB SRAM 100-LQFP (14x14) Arm® Cortex®-M4 32b MCU+FPU, 210DMIPS, up to 1MB Flash/192+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera • Core: Arm® 32-bit Cortex®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator) allowing 0-wait state execution from Flash memory, frequency up to 168 MHz, memory protection unit, 210 DMIPS/ 1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions • Memories – Up to 1 Mbyte of Flash memory – Up to 192+4 Kbytes of SRAM including 64- Kbyte of CCM (core coupled memory) data RAM – 512 bytes of OTP memory – Flexible static memory controller supporting Compact Flash, SRAM, PSRAM, NOR and NAND memories • LCD parallel interface, 8080/6800 modes • Clock, reset and supply management – 1.8 V to 3.6 V application supply and I/Os – POR, PDR, PVD and BOR – 4-to-26 MHz crystal oscillator – Internal 16 MHz factory-trimmed RC (1% accuracy) – 32 kHz oscillator for RTC with calibration – Internal 32 kHz RC with calibration • Low-power operation – Sleep, Stop and Standby modes –VBAT supply for RTC, 20×32 bit backup registers + optional 4 KB backup SRAM • 3×12-bit, 2.4 MSPS A/D converters: up to 24 channels and 7.2 MSPS in triple interleaved mode • 2×12-bit D/A converters • General-purpose DMA: 16-stream DMA controller with FIFOs and burst support • Up to 17 timers: up to twelve 16-bit and two 32- bit timers up to 168 MHz, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input • Debug mode – Serial wire debug (SWD) & JTAG interfaces – Cortex-M4 Embedded Trace Macrocell™ • Up to 140 I/O ports with interrupt capability – Up to 136 fast I/Os up to 84 MHz – Up to 138 5 V-tolerant I/Os • Up to 15 communication interfaces – Up to 3 × I2C interfaces (SMBus/PMBus) – Up to 4 USARTs/2 UARTs (10.5 Mbit/s, ISO 7816 interface, LIN, IrDA, modem control) – Up to 3 SPIs (42 Mbits/s), 2 with muxed full-duplex I2S to achieve audio class accuracy via internal audio PLL or external clock – 2 × CAN interfaces (2.0B Active) – SDIO interface • Advanced connectivity – USB 2.0 full-speed device/host/OTG controller with on-chip PHY – USB 2.0 high-speed/full-speed device/host/OTG controller with dedicated DMA, on-chip full-speed PHY and ULPI – 10/100 Ethernet MAC with dedicated DMA: supports IEEE 1588v2 hardware, MII/RMII #CommonPartsLibrary #IntegratedCircuit #Microcontroller #STM32F407
45 Uses0 StarsDF12C(3.0)-50DS-0.5V(81)
50 Position Connector Receptacle, Center Strip Contacts Surface Mount Gold The DF12C(3.0)-50DS-0.5V(81) is a high-density, board-to-board mezzanine connector from Hirose Electric’s DF12 series. It features a 0.5 mm pitch with 50 contacts in a dual-row configuration, designed for compact PCB layouts requiring reliable high-speed and high-signal-count interconnections. This connector is optimized for applications such as embedded systems, industrial electronics, communication devices, and portable equipment where space-saving and robust mating performance are critical. Manufacturer Information Manufacturer: Hirose Electric Co., Ltd. Series: DF12 Part Number: DF12C(3.0)-50DS-0.5V(81) Mechanical Specifications Connector Type: Board-to-Board (Mezzanine) Mounting Type: Surface Mount (SMT) Contact Configuration: Dual Row Number of Positions: 50 Pitch: 0.5 mm Stacking Height: 3.0 mm Mating Style: Receptacle (Socket) Contact Plating: Gold over Nickel Termination Style: Solder (SMT pads) Board Retention: None (standard SMT anchoring) Electrical Specifications Rated Current: 0.5 A per contact (typical) Rated Voltage: 50 V AC/DC Contact Resistance: ≤ 100 mΩ (initial) Insulation Resistance: ≥ 100 MΩ Withstanding Voltage: 250 V AC for 1 minute Material Specifications Insulator Material: LCP (Liquid Crystal Polymer), UL94V-0 rated Contact Material: Copper Alloy Plating: Gold plating on contact area, Tin on solder tails Environmental Specifications Operating Temperature Range: -35°C to +85°C Storage Temperature Range: -10°C to +60°C Humidity: Up to 85% RH (non-condensing) Packaging Information Packaging Type: Tape and Reel Reel Quantity: Typically 1,000–2,000 pcs per reel Applications Embedded systems Industrial control equipment Communication devices Portable electronics High-density PCB interconnections Compliance & Standards RoHS Compliant: Yes Halogen-Free: Yes UL Flammability Rating: UL94V-0 Mating Connector Compatible with DF12 series plug connectors with 3.0 mm stacking height and 0.5 mm pitch #commonpartslibrary #connector
2 Uses0 StarsCX3225SB16000D0GZJC1
16 MHz ±15ppm Crystal 8pF 60 Ohms 4-SMD, No Lead The CX3225SB16000D0GZJC1, manufactured by Kyocera AVX, is a 16.000 MHz crystal oscillator element designed to provide precise frequency reference for microcontrollers, communication ICs, and digital systems. It belongs to the CX3225SB series, known for compact size and stable frequency performance. Key Characteristics Type: Quartz crystal (passive frequency component) Frequency: 16 MHz Load Capacitance: 8 pF Frequency Stability: ±15 ppm Frequency Tolerance: ±15 ppm Operating Mode: Fundamental ESR (Equivalent Series Resistance): ~60–80 Ω Mechanical Details Package: 4-SMD, no-lead (surface mount) Size: 3.2 mm × 2.5 mm (3225 package) Height: ~0.6 mm (low profile) Operating Conditions Temperature Range: −25°C to +85°C Mounting Type: Surface mount (SMT) Function (Simple Explanation) This component: Generates a stable clock signal (16 MHz) Acts as the timing reference for MCUs, processors, or RF modules Works together with internal oscillator circuits inside ICs Microcontroller clock sources (e.g., ESP32, STM32, AVR) Communication modules Embedded systems Consumer electronics IoT devices #CommonPartsLibrary #Crystal #Oscillator #resonator
41 Uses0 StarsTSW-120-07-G-D
Connector Header Through Hole 40 position 0.100" (2.54mm) Raspberry Pi 40 pin header The TSW-120-07-G-D is a through-hole, double-row vertical header manufactured by Samtec. It features 40 total positions (2 rows of 20 pins) with a standard 2.54 mm pitch. This connector is widely used for board-to-board connections, prototyping, and general-purpose signal routing in embedded and electronic systems. It is designed for reliable mechanical and electrical performance with gold-plated contacts for enhanced conductivity and corrosion resistance. Manufacturer Samtec Inc. Manufacturer Part Number TSW-120-07-G-D Product Type Through-Hole Pin Header Number of Positions 40 (2 × 20) Number of Rows 2 Pitch 2.54 mm (0.100") Row Spacing 2.54 mm (0.100") Mounting Type Through Hole Orientation Vertical Contact Material Phosphor Bronze Contact Plating Gold (Au) over Nickel Plating Thickness Typically 10 µin (0.25 µm) Gold Insulator Material Black Liquid Crystal Polymer (LCP) Current Rating Typically 3.0 A per contact (depending on application conditions) Voltage Rating Typically 250 VAC Operating Temperature Range -55°C to +125°C Termination Type Solder Contact Style Square Post Post Length Standard Samtec “-07” tail length (approx. 2.92 mm tail, varies slightly per datasheet) Applications Embedded systems (e.g., Raspberry Pi GPIO headers) Development boards and expansion modules Board-to-board interconnects Prototyping and test setups Compliance RoHS Compliant Lead-Free Notes Compatible with standard 2.54 mm female headers and sockets Commonly used in stacking or mezzanine configurations Available in various plating options and pin lengths under the TSW series #commonpartslibrary #connector
179 Uses0 Stars
