Crystals
STM32F103C8T6
ARM® Cortex® M3 STM32F1 Microcontroller IC 32-Bit Single-Core 72MHz 64KB (64K x 8) FLASH Medium-density performance line Arm®-based 32-bit MCU with 64 or 128 KB Flash, USB, CAN, 7 timers, 2 ADCs, 9 com. interfaces Arm® 32-bit Cortex®-M3 CPU core – 72 MHz maximum frequency, 1.25 DMIPS/MHz (Dhrystone 2.1) performance at 0 wait state memory access – Single-cycle multiplication and hardware division • Memories – 64 or 128 Kbytes of Flash memory – 20 Kbytes of SRAM • Clock, reset and supply management – 2.0 to 3.6 V application supply and I/Os – POR, PDR, and programmable voltage detector (PVD) – 4 to 16 MHz crystal oscillator – Internal 8 MHz factory-trimmed RC – Internal 40 kHz RC – PLL for CPU clock – 32 kHz oscillator for RTC with calibration • Low-power – Sleep, Stop and Standby modes – VBAT supply for RTC and backup registers • 2x 12-bit, 1 µs A/D converters (up to 16 channels) – Conversion range: 0 to 3.6 V – Dual-sample and hold capability – Temperature sensor • DMA – 7-channel DMA controller – Peripherals supported: timers, ADC, SPIs, I 2Cs and USARTs • Up to 80 fast I/O ports – 26/37/51/80 I/Os, all mappable on 16 external interrupt vectors and almost all 5 V-tolerant Debug mode: – Serial wire debug (SWD) and JTAG interfaces • Seven timers – Three 16-bit timers, each with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input – 16-bit, motor control PWM timer with dead-time generation and emergency stop – Two watchdog timers (independent and window) – SysTick timer 24-bit downcounter • Up to nine communication interfaces – Up to two I2C interfaces (SMBus/PMBus®) – Up to three USARTs (ISO 7816 interface, LIN, IrDA capability, modem control) – Up to two SPIs (18 Mbit/s) – CAN interface (2.0B Active) – USB 2.0 full-speed interface • CRC calculation unit, 96-bit unique ID • Packages are ECOPACK #commonpartslibrary #integratedcircuit #microcontroller #stm32f1
5 Uses
ESP32-C3-WROOM-02-N4
Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz PCB Trace Surface Mount The ESP32-C3-WROOM-02-N4 is a compact, general-purpose Wi-Fi and Bluetooth Low Energy (BLE) module developed by Espressif Systems. It is built around the ESP32-C3 SoC and integrates RF components, crystal oscillator, flash memory, and PCB antenna in a single module. It is designed for a wide range of applications such as IoT devices, smart home systems, industrial automation, and consumer electronics, offering a balance of performance, low power consumption, and cost efficiency. Key Features MCU & Memory 32-bit RISC-V single-core processor up to 160 MHz 384 KB ROM 400 KB SRAM + 8 KB RTC SRAM Integrated 4 MB SPI flash (N4 variant) Connectivity 2.4 GHz Wi-Fi (802.11 b/g/n) Supports Station, SoftAP, and Station + SoftAP modes Bluetooth 5 (BLE) with mesh support Data rates up to 150 Mbps (Wi-Fi) Peripherals & Interfaces Up to 15 GPIOs Interfaces: SPI, UART, I2C, I2S LED PWM ADC (SAR) Timers & watchdog USB Serial/JTAG support TWAI® (CAN 2.0 compatible) #commonpartslibrary #transceiver #module #wireless #rf
64 Uses
DF12C(3.0)-50DS-0.5V(81)
50 Position Connector Receptacle, Center Strip Contacts Surface Mount Gold The DF12C(3.0)-50DS-0.5V(81) is a high-density, board-to-board mezzanine connector from Hirose Electric’s DF12 series. It features a 0.5 mm pitch with 50 contacts in a dual-row configuration, designed for compact PCB layouts requiring reliable high-speed and high-signal-count interconnections. This connector is optimized for applications such as embedded systems, industrial electronics, communication devices, and portable equipment where space-saving and robust mating performance are critical. Manufacturer Information Manufacturer: Hirose Electric Co., Ltd. Series: DF12 Part Number: DF12C(3.0)-50DS-0.5V(81) Mechanical Specifications Connector Type: Board-to-Board (Mezzanine) Mounting Type: Surface Mount (SMT) Contact Configuration: Dual Row Number of Positions: 50 Pitch: 0.5 mm Stacking Height: 3.0 mm Mating Style: Receptacle (Socket) Contact Plating: Gold over Nickel Termination Style: Solder (SMT pads) Board Retention: None (standard SMT anchoring) Electrical Specifications Rated Current: 0.5 A per contact (typical) Rated Voltage: 50 V AC/DC Contact Resistance: ≤ 100 mΩ (initial) Insulation Resistance: ≥ 100 MΩ Withstanding Voltage: 250 V AC for 1 minute Material Specifications Insulator Material: LCP (Liquid Crystal Polymer), UL94V-0 rated Contact Material: Copper Alloy Plating: Gold plating on contact area, Tin on solder tails Environmental Specifications Operating Temperature Range: -35°C to +85°C Storage Temperature Range: -10°C to +60°C Humidity: Up to 85% RH (non-condensing) Packaging Information Packaging Type: Tape and Reel Reel Quantity: Typically 1,000–2,000 pcs per reel Applications Embedded systems Industrial control equipment Communication devices Portable electronics High-density PCB interconnections Compliance & Standards RoHS Compliant: Yes Halogen-Free: Yes UL Flammability Rating: UL94V-0 Mating Connector Compatible with DF12 series plug connectors with 3.0 mm stacking height and 0.5 mm pitch #commonpartslibrary #connector
CX3225SB16000D0GZJC1
16 MHz ±15ppm Crystal 8pF 60 Ohms 4-SMD, No Lead The CX3225SB16000D0GZJC1, manufactured by Kyocera AVX, is a 16.000 MHz crystal oscillator element designed to provide precise frequency reference for microcontrollers, communication ICs, and digital systems. It belongs to the CX3225SB series, known for compact size and stable frequency performance. Key Characteristics Type: Quartz crystal (passive frequency component) Frequency: 16 MHz Load Capacitance: 8 pF Frequency Stability: ±15 ppm Frequency Tolerance: ±15 ppm Operating Mode: Fundamental ESR (Equivalent Series Resistance): ~60–80 Ω Mechanical Details Package: 4-SMD, no-lead (surface mount) Size: 3.2 mm × 2.5 mm (3225 package) Height: ~0.6 mm (low profile) Operating Conditions Temperature Range: −25°C to +85°C Mounting Type: Surface mount (SMT) Function (Simple Explanation) This component: Generates a stable clock signal (16 MHz) Acts as the timing reference for MCUs, processors, or RF modules Works together with internal oscillator circuits inside ICs Microcontroller clock sources (e.g., ESP32, STM32, AVR) Communication modules Embedded systems Consumer electronics IoT devices #CommonPartsLibrary #Crystal #Oscillator #resonator
TSW-120-07-G-D
Connector Header Through Hole 40 position 0.100" (2.54mm) Raspberry Pi 40 pin header The TSW-120-07-G-D is a through-hole, double-row vertical header manufactured by Samtec. It features 40 total positions (2 rows of 20 pins) with a standard 2.54 mm pitch. This connector is widely used for board-to-board connections, prototyping, and general-purpose signal routing in embedded and electronic systems. It is designed for reliable mechanical and electrical performance with gold-plated contacts for enhanced conductivity and corrosion resistance. Manufacturer Samtec Inc. Manufacturer Part Number TSW-120-07-G-D Product Type Through-Hole Pin Header Number of Positions 40 (2 × 20) Number of Rows 2 Pitch 2.54 mm (0.100") Row Spacing 2.54 mm (0.100") Mounting Type Through Hole Orientation Vertical Contact Material Phosphor Bronze Contact Plating Gold (Au) over Nickel Plating Thickness Typically 10 µin (0.25 µm) Gold Insulator Material Black Liquid Crystal Polymer (LCP) Current Rating Typically 3.0 A per contact (depending on application conditions) Voltage Rating Typically 250 VAC Operating Temperature Range -55°C to +125°C Termination Type Solder Contact Style Square Post Post Length Standard Samtec “-07” tail length (approx. 2.92 mm tail, varies slightly per datasheet) Applications Embedded systems (e.g., Raspberry Pi GPIO headers) Development boards and expansion modules Board-to-board interconnects Prototyping and test setups Compliance RoHS Compliant Lead-Free Notes Compatible with standard 2.54 mm female headers and sockets Commonly used in stacking or mezzanine configurations Available in various plating options and pin lengths under the TSW series #commonpartslibrary #connector
18 Uses
DM3AT-SF-PEJM5
10 (8 + 2) Position Card Connector Secure Digital - microSD™ Surface Mount, Right Angle Gold microSD socket push push The DM3AT-SF-PEJM5 is a low-profile, surface-mount microSD card connector from Hirose Electric featuring a push-push insertion and ejection mechanism. Designed for compact and portable electronic devices, it supports standard microSD, microSDHC, and microSDXC cards. The connector provides reliable electrical contact through gold-plated copper alloy terminals and is rated for up to 10,000 insertion/removal cycles, ensuring long-term durability. With a right-angle SMT configuration, integrated card detection switch, and robust mechanical retention, this connector is well-suited for applications such as embedded systems, IoT devices, consumer electronics, and industrial equipment where space efficiency and dependable card interfacing are critical. Product Category: Memory Card Connectors Product Type: Card Connector Subcategory: Memory Connectors & Sockets Card Type: microSD Number of Contacts: 8 Number of Rows: 1 Pitch: 1.1 mm Mounting Type: PCB Mount Mounting Style: Standard Orientation: Right Angle Termination Style: SMD/SMT Insertion / Extraction Style: Push-Push Mating Cycles: 10,000 Current Rating: 500 mA Voltage Rating: 125 VAC Contact Material: Copper Contact Plating: Gold Housing Material: Liquid Crystal Polymer (LCP) Insulation Resistance: 1 GΩ Height: 1.68 mm Length: 13.85 mm Operating Temperature Range: -25°C to +85°C Color: Black Packaging Options: Reel, Cut Tape, MouseReel Factory Pack Quantity: 1500 RoHS Compliance: Yes Country of Origin: China Country of Assembly: China Country of Diffusion: China Unit Weight: 0.003527 oz #commonpartslibrary #connector #memory #cardsocket #microsd
282 Uses
