32Mb, Dual I/O, 4KB Subsector Erase, 3V Serial Flash Memory with 75 MHz SPI Bus Interface, DFN-8 NOR Serial Flash Embedded Memory DFN*6x5mm*P1.27mm*

8-bit Small Package Microcontroller, S08 core, 8kB Flash, 512B RAM, DFN-8 NXP S08 Microcontroller DFN*4x4mm*P0.8mm*

RS-485, RS-422 Full duplex 250kbps transceiver, DFN-8 #Interface #UART #commonpartslibrary

32Mb Serial Flash Memory, Standard/Dual/Quad SPI, DFN-8 flash memory SPI WSON*1EP*6x5mm*P1.27mm*

High-Speed CAN Transceiver, 1Mbps, 5V supply, Vio pin, -40C to +125C, DFN-8 High-Speed CAN Transceiver DFN*1EP*3x3mm*P0.65mm*

CAN FD Transceiver with Silent Mode, up to 8 Mbps, DFN-8 CAN FD Transceiver DFN*1EP*3x3mm*P0.65mm*

CAN FD Transceiver with Silent Mode, up to 8 Mbps, DFN-8 CAN FD Transceiver DFN*1EP*3x3mm*P0.65mm*

LIN 2.1/SAE J2602 transceiver, DFN-8 LIN 2.1 SAE J2602 Transceiver HVSON-8 DFN*1EP*3x3mm*P0.65mm*

High Frequency Half Bridge Driver, Output Current 2.0A, 100V, DFN-8 Half Bridge Gate Driver DFN*1EP*4x4mm*P0.5mm*

LIN Transceiver with Voltage Regulator, 3.3V/5V, DFN-8 LIN Transceiver regulator DFN*1EP*4x4mm*P0.8mm*

16-Bit, Multi-Channel ΔΣ Analog-to-Digital Converter with I2C Interface and On-Board Reference, DFN-8 adc 2ch 16bit i2c DFN*3x2mm*P0.5mm*

High-Speed CAN Transceiver, 1Mbps, 5V supply, SPLIT pin, -40C to +125C, DFN-8 High-Speed CAN Transceiver DFN*1EP*3x3mm*P0.65mm*

60V, 300mA, synchronous step-down dc-dc converter, 3.3V fixed output voltage, DFN-8 step-down dc-dc switching regulator DFN*2x2mm*P0.5mm*

3A monolithic synchronous step-down regulator, Adjustable Output Voltage, 2.5-18V Input Voltage, 900kHz, DFN-8 DC/DC Buck Conwerter 3A Low Voltage Input DFN*EP*4x4mm*P0.8mm*

8-bit Small Package Microcontroller, S08 core, 4kB Flash, 256B RAM, DFN-8 NXP S08 Microcontroller DFN*4x4mm*P0.8mm*

1/1 Transceiver Half CANbus DFN-8 #CommonPartsLibrary #IntegratedCircuits #Interface #Drivers #Recievers #Transceivers #TJA1049

DFN-8-1EP is a small surface-mount package commonly used for integrated circuits. It has a body size of approximately 3 mm x 3 mm (L x W) with 8 pins. The lead pitch between the pins is typically 0.65 mm. The package features an exposed pad (EP) with dimensions of approximately 1.7 mm x 2.05 mm (L x W). The EP is used for thermal management and should be connected to a heat sink or PCB pad for optimal heat dissipation. The package is also known as Dual Flat No-leads 8-1EP or DFN-8EP. #part #template