Part Audit Review

A

adrian95

Review all available part information (MPN, package, pin count, description, properties). If no datasheet URL is already set, search the web for the official datasheet and update the part's Datasheet property with the URL. Then cross-check the schematic symbol, footprint, and pin descriptions against the datasheet. Summarize key specs and flag any mismatches.

flux

I’ll audit the part metadata, source the official TI documentation if needed, then verify the symbol, footprint, and pin descriptions and report any mismatches.
Created a project doc

TPS259830LNRGER Part Audit Report

View Document
Existing project datasheet property: uploaded PDF asset Official TI datasheet: https://www.ti.com/lit/ds/symlink/tps25983.pdf

flux

Audit complete. The MPN, 26 terminals/pads, pin mapping, and RGE0024M footprint geometry match TI documentation; the major mismatch is the description stating 24 V / 5 A instead of 26 V / 20 A limit / 18 A continuous. All pins also lack descriptions and have unspecified electrical types.
The Datasheet URL was already populated, so it was not changed. Full findings: TPS259830LNRGER Part Audit Report.
Fix metadata and pins
Update description only
Add pin metadata
Normalize package naming
Clean symbol footprint
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Files

Pins

Symbol

Layout

Preview

OUT_4
Pin Number
20
GND_2
Pin Number
5
PG
Pin Number
13
OUT_3
Pin Number
19
DVDT/_BGATE
Pin Number
15
OUT_1
Pin Number
17
IN_4
Pin Number
16
OUT_2
Pin Number
18
GND_4
Pin Number
26
ITIMER
Pin Number
7
NRETRY
Pin Number
11
ILIM
Pin Number
8
IN_1
Pin Number
1
IN_2
Pin Number
2
GND_1
Pin Number
4
OUT_5
Pin Number
21
IN_5
Pin Number
25
EN/UVLO
Pin Number
6
IN_3
Pin Number
3
OUT_8
Pin Number
24
GND_3
Pin Number
14
IMON
Pin Number
9
OUT_6
Pin Number
22
OVLO
Pin Number
12
RETRY_DLY
Pin Number
10
OUT_7
Pin Number
23
TPS259830LNRGER Part Audit Report
Sources reviewed
Metadata review

Table

FieldCurrent projectOfficial TI informationResult
MPNTPS259830LNRGERTPS259830LNRGERMatch
ManufacturerTexas InstrumentsTexas InstrumentsMatch
StatusNot explicitly storedActiveMissing property/information
Package24-VQFNRGE, 24-pin VQFN, 4 mm × 4 mm, 1 mm max heightBroadly correct, but not exact package code
Project pad/terminal count2624 perimeter pins plus two exposed thermal/power pads (25 and 26)Match
Designator prefixICIC is acceptableMatch
Part typeIntegrated CircuitIntegrated hot-swap eFuse / power-management ICCorrect but generic
Datasheet URLExisting uploaded PDF URLOfficial TI PDF availableExisting URL was already set, so it was not replaced
Project description2.7 V to 24 V, up to 5 A2.7 V to 26 V; 20 A adjustable limit range; 18 A recommended continuous switch currentMismatch
Key specifications
  • Function: integrated hot-swap eFuse with current monitor and external blocking-FET gate drive.
  • Variant: TPS259830L current-limiter response variant.
  • Input operating range: 2.7 V to 26 V.
  • Absolute maximum input voltage: 30 V.
  • Typical on-resistance: 2.7 mΩ at 25°C; 3.2 mΩ maximum at 25°C and 4.5 mΩ maximum over temperature under specified conditions.
  • Adjustable current-limit range: 2 A to 20 A.
  • Recommended maximum continuous switch current: 18 A.
  • Current-monitor accuracy: ±1.5% typical and ±3% maximum for IOUT > 3 A.
  • Short-circuit fast-trip response: 400 ns typical.
  • Operating temperature listed for the orderable part: –40°C to 125°C.
  • Package: RGE0024M, 4 mm × 4 mm VQFN, 1 mm maximum height, 24 perimeter pins plus two exposed pads.
  • Qualification/certification noted by TI: UL 2367 recognition (subject to RILIM condition) and IEC 62368 CB certification.
Pin cross-check
The pin numbers and names in the project match the datasheet:

Table

Pin(s)Project nameDatasheet functionResult
1, 2, 3, 16, 25IN_1…IN_5Power input; pad 25 is exposed input power/thermal padMatch
4, 5, 14, 26GND_1…GND_4Ground; pad 26 is exposed ground/thermal padMatch
6EN/UVLOEnable and adjustable undervoltage lockout inputMatch
7ITIMEROvercurrent blanking timer capacitorMatch
8ILIMCurrent-limit programming resistorMatch
9IMONAnalog load-current monitor outputMatch
10RETRY_DLYFault retry-delay capacitor / latch-off controlMatch
11NRETRYNumber-of-retries capacitor / indefinite retry controlMatch
12OVLOAdjustable overvoltage lockout inputMatch
13PGOpen-drain power-good outputMatch
15DVDT/_BGATEOutput slew-rate capacitor or external blocking-FET gate driveFunctional match; spelling differs from TI's dVdt/BGATE
17–24OUT_1…OUT_8Power outputMatch
Pin metadata mismatches
  • Every terminal currently has Pin Type = Unspecified. The datasheet defines power, ground, analog input, analog output, and digital open-drain output roles.
  • Pin Description is missing on all 26 terminals. Therefore, the project pin descriptions do not yet capture the datasheet functions, required external components, or “do not leave floating” warnings.
  • Pin 13 PG should be represented as an open-drain digital output (or the closest supported electrical type), not Unspecified.
  • The repeated IN, OUT, and GND pins are uniquely named with suffixes in the project; this is acceptable and preserves one-to-one pad mapping.
Symbol review
  • The symbol contains all 26 electrical terminals and the numbering is correct.
  • Pin placement is split across the left and right sides rather than grouped by electrical function. This is electrically valid, though grouping IN, OUT, GND, control inputs, timing/programming pins, and status output would make the symbol easier to use.
  • No missing or duplicate pin numbers were found.
Footprint review
  • The footprint implements the TI RGE0024M land pattern:
    • 24 perimeter pads at 0.5 mm pitch.
    • Perimeter copper lands: 0.24 mm × 0.575 mm.
    • 4 mm × 4 mm body outline.
    • Exposed pad 25: 1.45 mm × 2.70 mm, offset by the specified 0.625 mm datum.
    • Exposed pad 26: 0.85 mm × 2.70 mm, offset by the specified 0.925 mm datum.
  • Pad numbering and terminal association match the datasheet.
  • The footprint includes paste on exposed pads as single solid apertures. TI's example board layout shows paste guidance separately; for production, the exposed-pad stencil pattern should be reviewed with the assembler to control solder voiding and float.
  • The courtyard is 6.4 mm × 6.4 mm, substantially larger than the 4 mm body. This is conservative rather than a datasheet mismatch.
  • The imported footprint contains overlapping reference/value text at the package center. This is a presentation/silkscreen cleanup issue, not a copper or pin-mapping error.
Critical
  1. Project description is wrong: it states 2.7 V to 24 V and load currents up to 5 A. The official rating is 2.7 V to 26 V, adjustable current limit up to 20 A, with 18 A recommended maximum continuous current.
Important
  1. Add datasheet-derived Pin Description values for every terminal.
  2. Replace Pin Type = Unspecified with accurate electrical types.
  3. Refine Package or Case Code from 24-VQFN to RGE0024M (VQFN-24, 4 mm × 4 mm) if the property format permits.
  4. Refine the part category/description to identify it as a power-management eFuse/hot-swap IC rather than only “Integrated Circuit.”
Minor / manufacturing review
  1. Normalize DVDT/_BGATE to TI's dVdt/BGATE naming.
  2. Review exposed-pad paste segmentation with the intended stencil process.
  3. Clean up overlapping footprint text and consider a clearer functional grouping of symbol pins.
Overall verdict
The MPN, manufacturer, terminal count, pin numbering, pin names, and copper land geometry are fundamentally correct. The main correctness issue is the inaccurate project description. The main completeness issue is that every terminal lacks a datasheet-derived description and electrical pin type.

  • Sources reviewed

  • Metadata review

  • Key specifications

  • Pin cross-check

  • Pin metadata mismatches

  • Symbol review

  • Footprint review

  • Mismatches and recommended corrections

  • Critical

  • Important

  • Minor / manufacturing review

  • Overall verdict