Part Datasheet Review and Validation


Review all available part information (MPN, package, pin count, description, properties). If no datasheet URL is already set, search the web for the official datasheet and update the part's Datasheet property with the URL. Then cross-check the schematic symbol, footprint, and pin descriptions against the datasheet. Summarize key specs and flag any mismatches.
I’ll review the part metadata, find/update the official datasheet URL if needed, then cross-check symbol, footprint, and pin descriptions against the datasheet.
The part already has an ST datasheet URL set, so I’m using that as the source of truth and moving into pin/footprint verification.
Completed the STM32F107RCT6 part review. The official ST datasheet was already set, and the 64-pin symbol plus LQFP64 footprint check out against the datasheet.
Open items:
  • Metadata mismatches flagged: library package metadata says 32-LQFP, subtype/logic says Logic/AND, and Mount: Base should be SMD/surface-mount.
  • Suggested refinement: add limited-drive notes for PC13/PC14/PC15.
Fix metadata and review
Fix metadata mismatches
Refine backup pins
Run ERC DRC
Check BOM classification

Part Review and Datasheet Validation: STM32F107RCT6
Source reviewed
  • Project part: STM32F107RCT6
  • Manufacturer: STMicroelectronics
  • Existing datasheet URL: https://www.st.com/resource/en/datasheet/stm32f105r8.pdf
  • Datasheet status: already present; no update needed. This ST datasheet covers STM32F105xx/STM32F107xx connectivity-line devices, including STM32F107RC and STM32F107RCT6 ordering code.
Key datasheet specs
  • Core: ARM Cortex-M3, up to 72 MHz
  • Flash / SRAM for RC code: 256 KB Flash, 64 KB SRAM
  • Supply: 2.0 V to 3.6 V application supply and I/Os
  • Temperature code 6: -40 °C to +85 °C
  • Package code T: LQFP; pin-count code R: 64 pins
  • Package mechanical: LQFP64, 10 mm x 10 mm body, 12 mm x 12 mm lead span, 0.5 mm pitch, max height 1.6 mm
  • Connectivity/peripherals: USB 2.0 OTG FS, Ethernet MAC 10/100 for STM32F107xx, 2x CAN, up to 5 USART, 3 SPI with 2 I2S, 2 I2C, 2x 12-bit ADC, 2x DAC, timers, SWD/JTAG.
Metadata cross-check

Table


ItemProject/library valueDatasheet checkResult
MPNSTM32F107RCT6Matches ordering scheme: STM32 + F + 107 + R + C + T + 6OK
ManufacturerSTMicroelectronicsDatasheet is from STMicroelectronicsOK
Pin count64 terminalsR = 64 pins; LQFP64 table has pins 1-64OK
Package propertyLQFP64 10x10mmT = LQFP; device summary includes LQFP64 10 x 10 mmOK
DescriptionCortex-M3, 72 MHz, 256 KB Flash, 64 KB SRAM, Ethernet/USB/CAN/etc.Matches datasheet feature summaryOK
Datasheet URLst.com/resource/en/datasheet/stm32f105r8.pdfOfficial ST datasheet for STM32F105xx/STM32F107xxOK
Part TypeIntegrated CircuitsMCU; more specific type would be MicrocontrollerMinor metadata improvement recommended
Library subtype / logicFunctionLogic / ANDDevice is a microcontroller, not logic ANDMismatch
MountBasePhysical mount is SMD surface-mount LQFPMismatch
Library package_case_code32-LQFPDatasheet/package is 64-pin LQFPMismatch in search metadata
Symbol/pin cross-check
The schematic symbol exposes 64 terminal components, one per package pin. The pin numbers and names match the STM32F107xC LQFP64 pin definition table, including power pins, oscillator pins, boot/debug pins, GPIO names, and major alternate functions. Pin descriptions are generally consistent with the datasheet.
Notes:
  • PC13/PC14/PC15 correctly exist, but the datasheet footnote says these backup-domain pins have limited output capability; the symbol description only flags PC13 as low-drive.
  • PB2 is named PB2-BOOT1, which is consistent with datasheet main function PB2/BOOT1.
  • Pins marked 5 V tolerant in the project match the datasheet FT markings for PB2, PB10-PB15, PC6-PC12, PA8-PA15, PD2, PB3/PB4, PB6-PB9. PB5 is correctly not described as 5 V tolerant.
  • OSC_IN/OSC_OUT descriptions include PD0/PD1 remap availability, matching the LQFP64 footnote.
Footprint cross-check
The footprint asset is QFP50P1200X1200X160-64N.kicad_mod with description LQF64.
Observed footprint characteristics:
  • 64 SMD pads, numbered 1-64
  • 0.5 mm pad pitch from pad coordinates
  • 12 mm x 12 mm nominal lead-span code in footprint name and pad location around +/-5.738 mm
  • 10 mm x 10 mm fab/body outline
  • 1.6 mm package height encoded in footprint name
  • Pin-1 marker present near pad 1 corner
This matches the datasheet LQFP64 10 x 10 mm package mechanical data and recommended footprint family closely enough for the available review.
  1. Library search metadata reports package_case_code: 32-LQFP; this conflicts with the actual 64-pin LQFP footprint and datasheet.
  2. Part subtype / logic function appears incorrect: Logic / AND should be a microcontroller classification.
  3. Mount: Base is not meaningful for this package; SMD / Surface Mount is more accurate.
  4. Part Type: Integrated Circuits is broadly correct, but Microcontroller would be more specific and useful for BOM/search classification.
  5. Consider adding/clarifying PC13-PC15 backup-domain limited drive capability in pin descriptions for all three related pins.
Overall conclusion
The core part identity, datasheet URL, package, footprint geometry, and 64-pin symbol mapping are consistent with the official ST datasheet. The main issues are metadata/classification mismatches, not electrical pinout or footprint mismatches.
  • Source reviewed

  • Key datasheet specs

  • Metadata cross-check

  • Symbol/pin cross-check

  • Footprint cross-check

  • Flagged mismatches / recommended fixes

  • Overall conclusion