Part Datasheet Review


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Part Information Review — SN74LVC2G241DCUR

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Date: 2026-07-09 Project / part name: SN74LVC2G241DCUR
Completed the part review and captured the detailed findings in Part Information Review — SN74LVC2G241DCUR.
Summary: the symbol pin mapping and VSSOP-8/DCU footprint match the TI datasheet. The main issues are metadata-only: pin types are all Unspecified, pin descriptions are missing, and the Datasheet URL is populated with an uploaded PDF rather than the canonical TI URL, so I did not change it under your “if no datasheet URL is already set” instruction.
Fix the pin types/descriptions, switch to the canonical TI datasheet URL, then run a final part review.
I’ll update the terminal pin metadata and the project Datasheet URL to TI’s canonical PDF, then re-inspect the part for a final consistency check.
I confirmed the current pin metadata is still unset and the Datasheet URL still points to the uploaded PDF; I’m applying the metadata corrections now.
Pin metadata is updated and the Datasheet URL now points at TI’s canonical PDF; I’m running the final inspection pass now.
Completed the fixes and final review. Pin types/descriptions are now populated for all 8 terminals, the Datasheet URL now points to TI’s canonical link, and the final review found no remaining symbol pinout, pin-number, pin-type, pin-description, or footprint mismatches.
Full results are recorded in Part Information Review — SN74LVC2G241DCUR.
Review and export
Run ERC/DRC
Check BOM data
Export validation report
Add package metadata

2OE
Pin Number
7
1Y
Pin Number
6
VCC
Pin Number
8
2A
Pin Number
5
GND
Pin Number
4
2Y
Pin Number
3
1~OE
Pin Number
1
1A
Pin Number
2
Part Information Review — SN74LVC2G241DCUR
Date: 2026-07-09
Final status
Final review completed after metadata cleanup.
  • Datasheet URL property is now set to TI's stable canonical datasheet link: https://www.ti.com/lit/gpn/sn74lvc2g241
  • All 8 terminal pin numbers match the TI SN74LVC2G241 DCU/VSSOP top-view pinout.
  • Pin types and pin descriptions are populated from the TI pin-functions table.
  • Footprint geometry matches the TI DCU0008A VSSOP-8 example land pattern.
  • Component review check query returned no component-review issues.
Reviewed project information
  • Project / part name: SN74LVC2G241DCUR
  • Description: Buffer, Non-Inverting 2 Element 1 Bit per Element 3-State Output 8-VSSOP
  • Manufacturer Part Number: SN74LVC2G241DCUR
  • Manufacturer Name: Texas Instruments
  • Datasheet URL property: https://www.ti.com/lit/gpn/sn74lvc2g241
  • Official TI datasheet PDF equivalent: https://www.ti.com/lit/ds/symlink/sn74lvc2g241.pdf
  • Part Type: Integrated Circuit
  • Designator Prefix: IC
  • Schematic terminals / pads: 8
  • Footprint asset: SOP50P310X90-8N.kicad_mod
  • 3D model asset: SN74LVC2G241DCUR.stp
Datasheet key specifications
Source: Texas Instruments SN74LVC2G241 datasheet Rev. P, SCES210P.
  • Function: dual buffer/line driver with 3-state outputs, two independent 1-bit channels.
  • Supply voltage range: 1.65 V to 5.5 V operation; 1.5 V data-retention only.
  • Inputs tolerate up to 5.5 V independent of VCC, enabling down-translation to VCC-level outputs.
  • Output drive: up to ±24 mA at 3.3 V; up to ±32 mA at 4.5 V in recommended operating conditions.
  • Propagation delay A to Y: max 4.3 ns at 3.3 V over -40°C to 85°C; max 4.0 ns at 5 V over -40°C to 85°C.
  • ICC: 10 µA max, static.
  • Ioff: supports live insertion / partial-power-down back-drive protection.
  • Operating temperature: datasheet recommended table includes -40°C to 85°C; orderable SN74LVC2G241DCUR is listed as -40°C to 125°C in ordering information.
  • ESD: 2000 V HBM, 200 V MM, 1000 V CDM.
  • Latch-up: >100 mA per JESD 78 Class II.
  • Package/orderable: SN74LVC2G241DCUR, VSSOP package drawing DCU, 8 pins, large tape-and-reel quantity 3000, active production.
  • Package outline: DCU0008A VSSOP, 0.9 mm max height, 0.5 mm pitch, body approximately 2.0 mm × 2.3 mm, package length 3.0 mm to 3.2 mm, JEDEC MO-187 variation CA.
Pin cross-check after fix

Table


PinDatasheet nameDatasheet functionProject terminalProject pin numberProject pin typeProject description statusResult
11OEInput, output enable active low1~OE1InputPopulatedMatch; active-low notation differs only by style
21AInput1A2InputPopulatedMatch
32YOutput2Y3OutputPopulatedMatch
4GNDGroundGND4GroundPopulatedMatch
52AInput2A5InputPopulatedMatch
61YOutput1Y6OutputPopulatedMatch
72OEInput, output enable active high2OE7InputPopulatedMatch
8VCCPower pinVCC8Power InPopulatedMatch
Functional behavior confirmed:
  • Channel 1: 1OE low enables 1A -> 1Y; 1OE high makes 1Y high impedance.
  • Channel 2: 2OE high enables 2A -> 2Y; 2OE low makes 2Y high impedance.
Symbol review
  • The schematic symbol exposes all 8 pins and the pin-number mapping matches the DCU/VSSOP top-view pinout.
  • Symbol left/right placement is logically acceptable: left side carries pins 1-4, right side carries pins 5-8.
  • The active-low enable is represented as 1~OE; this is acceptable and maps to datasheet 1OE active low.
  • Terminal Pin Type properties are now populated.
  • Terminal Pin Description properties are now populated.
  • Terminal Pin Group properties use one primary group per physical pin: Control Bus, DATA, Power, or Ground.
Footprint cross-check
Footprint asset: SOP50P310X90-8N.kicad_mod, described as DCU (R-PDSO-G8).
Observed footprint geometry:
  • 8 SMD pads.
  • Pad pitch: 0.5 mm.
  • Pad size: 0.30 mm × 0.85 mm.
  • Pad row center span: approximately 3.15 mm.
  • Body/fab outline: approximately 2.3 mm × 2.0 mm.
  • Courtyard: approximately 4.5 mm × 2.6 mm.
  • Pin 1 marker/fab chamfer present.
Datasheet land-pattern reference:
  • DCU0008A VSSOP-8.
  • Example board layout: 8 pads of 0.85 mm × 0.30 mm, 0.5 mm pitch, approximately 3.1 mm pad-row span.
  • Package body dimensions: about 2.1-1.9 mm by 2.4-2.2 mm, 0.9 mm max height.
Footprint result: matches the datasheet example land pattern and package outline for DCU/VSSOP-8. No footprint pad-count or pad-number mismatch found.
Final mismatches / issues
No symbol pinout, pin-number, pin-type, pin-description, datasheet URL, or footprint mismatches remain from this review.
Minor note: the current project properties do not include a dedicated top-level package field, although the package is accurately represented by the description, footprint asset, and datasheet reference as VSSOP/DCU-8.
Overall verdict
The part is now consistent with the Texas Instruments SN74LVC2G241DCUR datasheet for metadata, symbol pin mapping, pin descriptions, and the DCU VSSOP-8 footprint. The final review found no remaining blocking mismatches.
  • Final status

  • Reviewed project information

  • Datasheet key specifications

  • Pin cross-check after fix

  • Symbol review

  • Footprint cross-check

  • Final mismatches / issues

  • Overall verdict