Part Review Check
Worked for 7 mins 42 sec
Created a project doc
Completed the part review and saved the detailed findings in NXVF6532M3TG01 Part Review. The 13-pin symbol pinout and footprint geometry match the official onsemi datasheet; main flags are missing explicit pin-description properties, missing/unclear manufacturer/lifecycle metadata, and the existing Datasheet URL is an uploaded PDF rather than the direct onsemi URL.
Open items:
- Decide whether to replace the existing Datasheet URL with
https://www.onsemi.com/download/data-sheet/pdf/nxvf6532m3tg01-d.pdf. - Optionally add pin descriptions and manufacturer/status metadata for library completeness.
Suggested next steps:
- Add datasheet-backed pin descriptions to all terminals.
- Update manufacturer/status metadata.
- Export/check drill files to confirm mounting holes 14/15 remain NPTH.
Fix metadata and verify
Add pin descriptions
Update part metadata
Verify NPTH holes
Run part checks
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NXVF6532M3TG01 Part Review
Review date: 2026-07-17
Project: NXVF6532M3TG01
Official manufacturer page: https://www.onsemi.com/products/discrete-power-modules/power-modules/silicon-carbide-sic-modules/nxvf6532m3tg01
Official datasheet found: https://www.onsemi.com/download/data-sheet/pdf/nxvf6532m3tg01-d.pdf
Existing Datasheet URL property: ab8a2b7cc4fcaa5628246ad5bb7f8f7abf1cd8a8ca9b1ed74b11602379c2c428.pdf
Project: NXVF6532M3TG01
Official manufacturer page: https://www.onsemi.com/products/discrete-power-modules/power-modules/silicon-carbide-sic-modules/nxvf6532m3tg01
Official datasheet found: https://www.onsemi.com/download/data-sheet/pdf/nxvf6532m3tg01-d.pdf
Existing Datasheet URL property: ab8a2b7cc4fcaa5628246ad5bb7f8f7abf1cd8a8ca9b1ed74b11602379c2c428.pdf
Metadata reviewed
Table
| Field | Project / part information | Datasheet / official source | Result |
|---|---|---|---|
| MPN | NXVF6532M3TG01 | NXVF6532M3TG01 | Match |
| Manufacturer | Not exposed in inspected schematic/BOM metadata; official source is onsemi | onsemi | Missing/unclear in project metadata |
| Description | EliteSiC Power MOSFET Module 650 V, 32 mΩ H-Bridge, 31 A | EliteSiC Power MOSFET Module 650 V, 32 mΩ H-Bridge | Match |
| Lifecycle | Not exposed in inspected schematic/BOM metadata | Active | Missing/unclear in project metadata |
| Package | Footprint asset description: AUTOMOTIVE POWER MODULE16 40.10x21.90x4.50, 1.90P CASE 829AA | APM16 / AUTOMOTIVE POWER MODULE16, 40.10x21.90x4.50, 1.90P, CASE 829AA | Match |
| Pin count | 13 electrical schematic terminals; footprint also includes 2 mechanical mounting holes numbered 14 and 15 | 13 electrical pins; case outline includes two ØA mounting holes | Match |
| Datasheet URL | Already set to an uploaded PDF asset | Official onsemi PDF URL found | Not overwritten because a Datasheet URL was already set |
Key datasheet specs
Table
| Parameter | Value |
|---|---|
| MOSFET topology | H-Bridge SiC MOSFET module with NTC |
| Drain-to-source voltage, VDSS | 650 V |
| Typical RDS(on) | 32 mΩ at VGS = 18 V, ID = 15 A, TJ = 25 °C |
| Max RDS(on) | 44 mΩ at VGS = 18 V, ID = 15 A, TJ = 25 °C |
| Continuous drain current | 31 A at TC = 25 °C |
| Pulsed drain current | 165 A, tp = 100 µs |
| Gate-source absolute max | -8 V / +22 V |
| Recommended gate operation | -3 V / +18 V |
| Junction temperature | -55 °C to +175 °C |
| Storage temperature | -40 °C to +125 °C |
| Power dissipation | 65.2 W |
| RθJC | 1.74 °C/W typ, 2.3 °C/W max |
| Isolation voltage | 3300 Vrms, 60 Hz AC for 1 minute, pins to heatsink plate |
| NTC | 10 kΩ ±3%, 0603; B25/50 3590, B25/85 3635, B25/100 3650 |
| Package | APM16 / CASE 829AA, 40.10 x 21.90 x 4.50 mm nominal body |
Pinout cross-check
Table
| Pin | Datasheet name | Datasheet description | Project terminal | Project pin number | Result |
|---|---|---|---|---|---|
| 1 | PH1 | Phase 1 out | PH1 | 1 | Match |
| 2 | S1 | SiC MOSFET Source 1 | S1 | 2 | Match |
| 3 | G1 | SiC MOSFET Gate 1 | G1 | 3 | Match |
| 4 | P | DC Bus + | P | 4 | Match |
| 5 | S2 | SiC MOSFET Source 2 | S2 | 5 | Match |
| 6 | G2 | SiC MOSFET Gate 2 | G2 | 6 | Match |
| 7 | GND&NTC2 | GND and Negative Temperature Coefficient Thermistor 2 | GND&NTC2 | 7 | Match |
| 8 | NTC1 | Negative Temperature Coefficient Thermistor 1 | NTC1 | 8 | Match |
| 9 | S4 | SiC MOSFET Source 4 | S4 | 9 | Match |
| 10 | G4 | SiC MOSFET Gate 4 | G4 | 10 | Match |
| 11 | S3 | SiC MOSFET Source 3 | S3 | 11 | Match |
| 12 | G3 | SiC MOSFET Gate 3 | G3 | 12 | Match |
| 13 | PH2 | Phase 2 out | PH2 | 13 | Match |
Footprint cross-check
Electrical pads
The KiCad footprint asset embedded in the Flux footprint defines the electrical pads at the expected APM16 staggered lead positions:
Table
| Pad | Expected / observed position pattern | Size / drill in footprint | Result |
|---|---|---|---|
| 1 PH1 | x=0.0 mm, y=0.0 mm | 1.710 mm pad, 1.14 mm drill, rectangular pin-1 marker | Match |
| 2 S1 | x=1.9 mm, y=-2.5 mm | 1.416 mm pad, 0.91 mm drill | Match |
| 3 G1 | x=3.8 mm, y=0.0 mm | 1.416 mm pad, 0.91 mm drill | Match |
| 4 P | x=9.5 mm, y=0.0 mm | 1.710 mm pad, 1.14 mm drill | Match |
| 5 S2 | x=15.2 mm, y=0.0 mm | 1.416 mm pad, 0.91 mm drill | Match |
| 6 G2 | x=17.1 mm, y=-2.5 mm | 1.416 mm pad, 0.91 mm drill | Match |
| 7 GND&NTC2 | x=19.0 mm, y=0.0 mm | 1.710 mm pad, 1.14 mm drill | Match |
| 8 NTC1 | x=20.9 mm, y=-2.5 mm | 1.416 mm pad, 0.91 mm drill | Match |
| 9 S4 | x=22.8 mm, y=0.0 mm | 1.416 mm pad, 0.91 mm drill | Match |
| 10 G4 | x=24.7 mm, y=-2.5 mm | 1.416 mm pad, 0.91 mm drill | Match |
| 11 S3 | x=30.4 mm, y=0.0 mm | 1.416 mm pad, 0.91 mm drill | Match |
| 12 G3 | x=32.3 mm, y=-2.5 mm | 1.416 mm pad, 0.91 mm drill | Match |
| 13 PH2 | x=34.2 mm, y=0.0 mm | 1.710 mm pad, 1.14 mm drill | Match |
Mechanical outline and mounting holes
Table
| Feature | Datasheet / case outline | Footprint | Result |
|---|---|---|---|
| Body D | 40.10 mm nominal | Fab outline width 40.10 mm | Match |
| Body E1 | 21.90 mm nominal | Fab outline height 21.90 mm | Match |
| Mounting hole diameter ØA | 3.20 mm nominal, 3.40 mm max | Two 3.4 mm non-plated through holes in KiCad asset | Match to max hole diameter |
| Mounting hole spacing q | 37.10 mm nominal | Hole centers at -1.45 mm and 35.65 mm, spacing 37.10 mm | Match |
| Pin pitch e | 1.90 mm nominal | Repeating 1.90 mm positions where adjacent pins are present | Match |
| Stagger offset e1 | 2.50 mm nominal | Alternating row offset 2.50 mm | Match |
Mismatches / issues flagged
- Pin descriptions are not populated as project properties. The terminal names and pin numbers match the datasheet, but each terminal only shows
Pin Type: Unspecified; no explicitPin Descriptionproperties were found. Add pin descriptions if this part is intended for publication or reuse. - Manufacturer and lifecycle are not exposed in the inspected metadata. The official source identifies manufacturer as onsemi and status as Active. Consider adding
Manufacturer Name = onsemiand lifecycle/status metadata if available in the part editor. - Datasheet URL already exists but is an uploaded PDF asset, not the direct onsemi URL. I did not overwrite it because the request only asked to update when no Datasheet URL was set. If preferred, update it to the official URL: https://www.onsemi.com/download/data-sheet/pdf/nxvf6532m3tg01-d.pdf
- Footprint mounting holes should be verified in exported fabrication data. The embedded KiCad asset correctly uses
np_thru_holefor holes 14 and 15, but Flux's computed pad summary displays them generically as pads. This is likely a display abstraction, not necessarily an error; verify NPTH classification in Gerber/drill export before manufacturing. - Schematic terminal placement is not ordered sequentially top-to-bottom. Electrically this is not a pinout mismatch because the pin numbers and names are correct, but the visual symbol could be improved by grouping gate/source/phase/NTC terminals for readability.
Overall assessment
The core pinout and footprint geometry match the official NXVF6532M3TG01 datasheet/case outline. No blocking electrical pin-number or footprint-coordinate mismatch was found. The main cleanup items are metadata completeness: add manufacturer/lifecycle and explicit pin descriptions, and decide whether to replace the uploaded Datasheet URL with the direct onsemi datasheet URL.
Metadata reviewed
Key datasheet specs
Pinout cross-check
Footprint cross-check
Electrical pads
Mechanical outline and mounting holes
Mismatches / issues flagged
Overall assessment
