Part Audit Review

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Part Audit Report

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Part Audit Report Part identity
The existing Datasheet URL is already an official onsemi URL, so no Datasheet property update was required.
Key electrical specifications
Current ratings are strongly dependent on thermal design and are not standalone PCB current recommendations.

flux

Audit complete. The official onsemi datasheet was already set, so no URL update was needed; the symbol’s source/gate/drain grouping is plausible, but pin metadata is incomplete and the footprint is critically invalid—all nine near-zero-size pads overlap at the origin. An internal part-quality report was filed.
Full specifications and mismatch details: Part Audit Report
A

adrian95

add pin descriptions and pin types for all the terminal based on the datasheet

flux

I’ll assign datasheet-backed descriptions and electrical types to all nine terminals, then read them back to verify the updates.

flux

Updated and verified all nine terminals:
  • Pins 1–3: Source terminal — Passive
  • Pin 4: Gate control input — Input
  • Pins 5–8: Drain terminal — Passive
  • Pin 9: Drain exposed pad — Passive
Repair footprint and metadata
Review footprint geometry
Set MOSFET properties
Verify symbol appearance
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Pins

Symbol

Layout

Preview

S_3
Pin Number
3
S_2
Pin Number
2
S_1
Pin Number
1
G
Pin Number
4
D_2
Pin Number
6
D_5
Pin Number
9
D_4
Pin Number
8
D_3
Pin Number
7
D_1
Pin Number
5
Part Audit Report
Part identity
The existing Datasheet URL is already an official onsemi URL, so no Datasheet property update was required.
Key electrical specifications

Table

ParameterDatasheet value
Drain-source voltage, VDSS80 V
Gate-source voltage, VGS±20 V
Continuous drain current, case-limited at 25 °C224 A
Continuous drain current, PCB/ambient condition at 25 °C30 A
Pulsed drain current900 A
RDS(on), VGS = 10 V, ID = 50 A1.5 mΩ typical, 1.9 mΩ maximum
RDS(on), VGS = 4.5 V, ID = 50 A1.9 mΩ typical, 2.4 mΩ maximum
Gate threshold voltage1.2–2.0 V
Total gate charge, 10 V drive112 nC typical
Input capacitance6900 pF typical
Junction/storage temperature−55 °C to +175 °C
Junction-to-case thermal resistance0.7 °C/W maximum
Junction-to-ambient thermal resistance39 °C/W maximum under the datasheet test board condition
Automotive qualificationAEC-Q101 / PPAP capable per product description
Current ratings are strongly dependent on thermal design and are not standalone PCB current recommendations.
Pin and symbol cross-check
The project contains nine terminal objects:

Table

Project pinProject labelExpected electrical functionAssessment
1S_1SourceFunction grouping is correct
2S_2SourceFunction grouping is correct
3S_3SourceFunction grouping is correct
4GGateCorrect
5D_1DrainCorrect drain grouping
6D_2DrainCorrect drain grouping
7D_3DrainConsistent with the package’s multiple drain-side contacts
8D_4DrainConsistent with the package’s multiple drain-side contacts
9D_5Drain / exposed copper regionConsistent with a separate drain-connected footprint region, but the exact pad implementation must be verified from the package drawing
The high-level source/gate/drain grouping is electrically plausible and consistent with the datasheet package illustration. However, every terminal has Pin Type = Unspecified and no stored Pin Description. Recommended metadata is Source = passive/power terminal, Gate = input, Drain = passive/power terminal, with descriptions explicitly identifying the duplicated package contacts.
Footprint cross-check
Critical mismatch
The current footprint is not a valid DFNW5 footprint:
  • All nine pads are located at (0, 0).
  • Every pad is a 0.0016 mm circular pad, effectively zero-sized for manufacturing.
  • There is no 4.90 × 5.90 mm package geometry, 1.27 mm lead pitch, drain copper region, solder-mask definition, courtyard, assembly outline, or pin-1 indication.
  • The footprint therefore cannot be fabricated or assembled as-is.
A safe footprint repair was not applied because the indexed datasheet text did not expose the complete dimensioned land-pattern geometry needed to reconstruct all pads without guessing. The official Case 507BA mechanical drawing should be used as the source of truth.
Metadata mismatches and omissions

Table

FieldCurrent stateDatasheet-backed expectationSeverity
Manufacturer Part NumberCorrectNVMFS6H800NLWFT1GOK
ManufacturerON Semiconductoronsemi / ON SemiconductorOK
DescriptionBroadly correct80 V single N-channel power MOSFET, DFNW5 wettable flank, AEC-Q101Minor omission of core ratings
Datasheet URLOfficial onsemi URL existsOfficial onsemi NVMFS6H800NL datasheetOK; no update needed
Terminal count9Package representation may use eight perimeter leads plus a separate drain-connected copper regionNeeds exact package-drawing confirmation
Part TypeBlankMOSFET / TransistorMismatch
Package / CaseMissingDFNW5, Case 507BA, 4.90 × 5.90 × 1.00 mm, 1.27 mm pitchMismatch
Pin descriptionsMissingSource, Gate, Drain descriptionsMismatch
Pin typesUnspecifiedGate input; source/drain passive or powerMismatch
Footprint geometryCollapsed/defaultDimensioned Case 507BA land patternCritical mismatch
Disposition
The stored identity and official datasheet are valid, and the symbol’s electrical grouping is directionally correct. The part is not ready for PCB use because its footprint is collapsed and its package/pin metadata is incomplete. An internal part-quality report has been filed for review.

  • Part identity

  • Key electrical specifications

  • Pin and symbol cross-check

  • Footprint cross-check

  • Critical mismatch

  • Metadata mismatches and omissions

  • Disposition