Chat
Welcome to Flux
Treat Flux like your intern. Tell it what you'd like to build and it'll get to work. You can also ask it questions, brainstorm ideas, and teach it your preferences. Learn More
Explain this part
Write a part description
Describe each pin
Operating conditions
Electrical max ratings
Part Specifications
Application circuits
Verify Part Details
Recommend similar parts
Check availability & lifecycle
Refine this doc
Ask about this doc
TMAG5231C1DQDBZR Part Datasheet Audit
Result
The part was checked against the official Texas Instruments TMAG5231 Low-Power, Hall Effect Switch, Rev. D (SLYS042D) datasheet. The live project initially had no usable
datasheet_url; the official URL was set to:Flux ingested the PDF and may display an internally hosted copy as the effective property. Live datasheet queries now work.
Part metadata
Table
| Field | Project value | Datasheet cross-check |
|---|---|---|
| MPN | TMAG5231C1DQDBZR | Correct |
| Manufacturer | Texas Instruments | Correct |
| Part type | Sensor | Correct, more specifically a low-power Hall-effect switch |
| Pin count | 3 | Correct for DBZ SOT-23 |
| Designator prefix | U | Appropriate |
| Mount | Surface mount | Correct |
| Package library field | SOT-23-5 | Mismatch: this orderable part is DBZ, 3-pin SOT-23 |
| Datasheet | Official TI URL added | Correct |
Variant key specifications
- Variant: TMAG5231C1D
- Function: omnipolar Hall-effect switch, active-low, push-pull output
- Supply voltage: 1.65 V to 5.5 V
- Average supply current for D version at 3 V: 2 µA typical, 3 µA maximum
- Sampling rate: 20 Hz typical (13–29 Hz)
- Typical operate threshold: ±3 mT
- Typical release point: ±2.2 mT at 25°C
- Typical magnetic hysteresis: ±0.8 mT
- Operating temperature: −40°C to +125°C
- Package: DBZ, 3-pin SOT-23, 1.12 mm maximum height
- Nominal body: 2.92 mm × 1.30 mm
- Tape-and-reel quantity: 3000
Symbol and pin audit
Table
| Pin | Symbol name | Symbol type | Datasheet function | Result |
|---|---|---|---|---|
| 1 | VCC | Power In | 1.65–5.5 V supply; connect at least 0.1 µF ceramic to GND | Number/name correct; description missing |
| 2 | OUT | Output | Omnipolar output responding to north and south poles | Correct; description missing |
| 3 | GND | Power In | Ground reference | Number/name correct; description missing; Ground type would be clearer |
The schematic symbol contains exactly three terminals and the pin mapping matches the DBZ top-view pinout.
Footprint audit
Footprint source:
SOT95P237X112-3N.kicad_modTable
| Feature | Effective footprint | TI recommended land pattern | Result |
|---|---|---|---|
| Pad count | 3 | 3 | Correct |
| Pad size | 1.24 × 0.59 mm | 1.30 × 0.60 mm | Slightly undersized by 0.06 × 0.01 mm |
| Two-pin-side pitch | 0.95 mm | 0.95 mm | Correct |
| Two-pin center separation | 1.90 mm | 1.90 mm | Correct |
| Opposing-side center span | 2.11 mm | 2.10 mm | +0.01 mm, negligible |
| Fab body | 2.92 × 1.30 mm | Nominal 2.92 × 1.30 mm | Correct |
| Solder paste | Present, nominally 1:1 | Stencil example matches pad geometry | Acceptable |
| Solder mask | +0.102 mm expansion | TI example shows 0.07 mm clearance | Larger than TI example; verify against fab capability |
Pad mapping is correct: pad 1 VCC, pad 2 OUT, pad 3 GND. The footprint is broadly compatible with DBZ0003A but does not exactly reproduce TI’s recommended pad and mask dimensions.
Description/property mismatches
- Package case code is
SOT-23-5, but this device is a 3-pin SOT-23, TI DBZ package. - The description says “±0.8 mT typical release point.” This is incorrect: ±0.8 mT is the typical hysteresis; the typical release point is ±2.2 mT at 25°C.
- Pin descriptions are absent for all three terminals.
- GND is electrically typed
Power Inrather thanGround. - Footprint pads are slightly smaller than TI’s example land pattern, and mask expansion is larger.
Overall assessment
The pinout, pin count, nominal package body, pitch, and functional identity are correct. The part is usable with caution, but the package metadata and description should be corrected, and the footprint dimensions should be reviewed against the intended assembly process before production.
Result
Part metadata
Variant key specifications
Symbol and pin audit
Footprint audit
Description/property mismatches
Overall assessment
