ME310G1-W1 Part Audit
Source documents
Concise part description
LTE Cat M1/NB2 cellular IoT module with integrated GNSS, global band support, USB/UART/SPI/SIM interfaces, and compact 94-pad LGA package.
Current part metadata reviewed
- MPN: ME310G1-W1
- Manufacturer: Telit Wireless Solutions
- Designator prefix: IC
- Published as Flux part: yes
- Part UID: e24ed41c-a572-4d45-a5cc-91ffdfb5df48
- Existing description was replaced with the concise datasheet-based description above.
- Datasheet URL was missing and has been added using the official Telit-hosted product brief URL.
Key datasheet specs
- Technology: LTE UE Cat M1 / NB2, 3GPP Release 14
- Variant market: Worldwide
- LTE bands: B1, B2, B3, B4, B5, B8, B8_US, B12, B13, B18, B19, B20, B25, B26, B27, B28, B66, B71, B85
- Output power: LTE 21 dBm, Power Class 5, for ME310G1-W1
- GNSS: embedded GPS, GLONASS, BeiDou, Galileo
- Data rates: LTE-M uplink up to 1 Mbps, downlink up to 588 kbps; NB2 uplink up to 160 kbps, downlink up to 120 kbps
- Interfaces: 6 GPIO, 1.8 V SIM, USB 2.0 HS, UART, SPI, I2C, digital audio, ADC, DAC/PWM
- Supply: nominal 3.8 Vdc; operating 3.2–4.2 V; extended 2.6–4.5 V
- Temperature: -40 °C to +85 °C
- Package/body: 13.1 mm × 14.3 mm × 2.6 mm, 94-pad LGA
Symbol / pinout cross-check
The symbol contains 94 terminal pads, matching the datasheet 94-pad LGA count. Pad-coordinate mapping is mostly consistent with the hardware design guide.
Mismatches / items to fix
- Pin descriptions/types are mostly missing: all inspected terminals have
Pin Type: Unspecified and no useful pin descriptions. These should be populated from the hardware design guide, especially for power, RF, SIM, USB, UART, SPI, GPIO, reserved, and ground pads.
- Reserved/alternate-function labels need cleanup:
- G1 is labeled
RES_4, but datasheet lists ATC1 / MIPI_CLK for HW 1.0, reserved only on HW 0.0.
- H2 is labeled
RES_6, but datasheet lists ATV, reserved only on HW 0.0.
- J1 is labeled
RES_7, but datasheet lists ATC2 / MIPI_DATA for HW 1.0, reserved only on HW 0.0.
- RF antenna naming should be clearer:
- A5 is
CELLMAIN; datasheet uses CELL_MAIN_ANTENNA.
- E19 is
GNSS; datasheet uses GNSS_ANTENNA.
- Minor naming normalization recommended:
FORCED_USB__BOOT has a double underscore; datasheet uses FORCED_USB_BOOT.C105/RTS0_ includes a trailing underscore; datasheet uses RTS0 / C105.- UART names are acceptable but inconsistent in order: datasheet uses
TXD0/C103, RXD0/C104, RTS0/C105, CTS0/C106.
- Reserved pads are present and connected as terminals, but should have explicit
Reserved / DNC descriptions and pin type metadata to prevent accidental use.
Footprint cross-check
- Current PCB footprint contains 94 pad nodes, matching the datasheet pin count.
- The layout data exposed to the audit lists pad nodes but does not expose enough pad geometry details in the returned view to fully verify copper pad size, solder-mask openings, pitch, or body outline against the Telit land pattern.
- Datasheet/hardware guide requirements to verify or implement: NSMD pads, PCB pads 1:1 with module pads, 1.2 mm pitch, 0.8 mm solder-resist openings per W1 figure, no through-holes in pad, no exposed vias/microvias within 0.3 mm around pads unless same signal, ENIG finish recommended.
Overall result
- Part identity, manufacturer, pin count, and general package class are consistent with ME310G1-W1.
- Main risk is metadata quality: symbol pin descriptions/types are incomplete and several alternate-function/reserved pins are mislabeled or over-simplified.
- Footprint pad count is correct, but geometry still needs a detailed mechanical land-pattern verification pass before release/manufacturing use.