Part Datasheet Review
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Part Datasheet Cross-Check: MCP1702T-5002E/MB
Date: 2026-07-16 | Field | Project value | Datasheet cross-check |
Created the detailed review in Part Datasheet Cross-Check: MCP1702T-5002E/MB. The Datasheet URL was already set, so I left it unchanged; pin numbering/electrical mapping matches the MCP1702 datasheet.
Open items:
- Footprint/value text references
MCP1703T5002EMBinstead ofMCP1702T-5002E/MB. - Pin types/descriptions are missing or
Unspecified. - Package naming is nonstandard (
89-SOTvs datasheetMB/SOT-89-3). - Tab pad size should be reviewed against the Microchip land pattern.
Suggested next steps:
- Update the pin descriptions and electrical pin types.
- Rename/clean the footprint value text from MCP1703 to MCP1702.
- Review or adjust the tab pad dimensions before publishing/manufacturing.
Fix metadata and verify
Fix pin metadata
Rename footprint text
Review tab pad
Run final checks
Refine this doc
Ask about this doc
Part Datasheet Cross-Check: MCP1702T-5002E/MB
Date: 2026-07-16
Reviewed part information
Table
| Field | Project value | Datasheet cross-check |
|---|---|---|
| Project / part name | MCP1702T-5002E_MB | Matches MPN intent for Microchip MCP1702T-5002E/MB |
| Manufacturer Part Number | MCP1702T-5002E/MB | Matches ordering information |
| Manufacturer | Microchip | Matches datasheet |
| Part Type | Linear Regulator | Matches: low-dropout positive voltage regulator |
| Description | Microchip MCP1702T-5002E/MB, LDO Regulator, 250mA, 5 V, +/-2%, 2.7 13.2 Vin, 3-Pin, SOT-89 | Matches key ratings; note package has 3 leads plus VIN tab/heat slug, so EDA footprint correctly has 4 pads |
| Package or Case Code | 89-SOT | Functionally SOT-89 / Microchip MB package, but naming is nonstandard versus datasheet package code MB / SOT-89-3 |
| Pin count / pads | 4 pads in project | Correct for EDA land pattern: pins 1,2,3 plus tab/slug pad electrically tied to VIN |
| Datasheet URL | Already set to uploaded Microchip MCP1702 datasheet PDF | No Datasheet URL update was required by the request condition |
Datasheet key specs
Source: Microchip MCP1702 datasheet DS22008E for 250 mA Low Quiescent Current LDO Regulator.
- Device: MCP1702, fixed positive LDO regulator.
- Ordering code:
T= tape and reel;50= 5.0 V output;0= fixed;2= 2.0% tolerance;E= -40°C to +125°C;/MB= 3-lead SOT-89 package. - Output voltage: 5.0 V nominal.
- Output current: 250 mA max for output voltage options >= 2.5 V.
- Input operating range: 2.7 V to 13.2 V.
- Dropout voltage at 250 mA, 5.0 V option: 330 mV typ, 650 mV max.
- Quiescent current: 2.0 uA typ, 5 uA max at no load.
- Output accuracy option: +/-2% standard for this order code.
- Capacitors: typical 1 uF ceramic input and 1 uF ceramic output; output capacitor minimum 1.0 uF for stability, ESR 0 to 2 ohm, ceramic range 1 uF to 22 uF.
- Thermal: operating junction -40°C to +125°C; thermal shutdown typ 150°C; 3L SOT-89 thetaJA typ 153.3°C/W, thetaJC typ 100°C/W.
Pin and symbol cross-check
Table
| Datasheet terminal | Datasheet function | Project terminal / symbol | Status |
|---|---|---|---|
| Pin 1 | GND, ground terminal | GND, Pin Number 1 | Matches |
| Pin 2 | VIN, unregulated supply voltage | VIN_1, Pin Number 2 | Matches |
| Pin 3 | VOUT, regulated output voltage | VOUT, Pin Number 3 | Matches |
| Tab / heat slug | VIN, same electrical node as pin 2 | VIN_2, Pin Number 4 | Matches EDA convention for separate tab pad |
Symbol notes:
- The four exposed terminals correctly represent the 3-lead SOT-89 plus tab implementation.
- Terminal pin types are all
Unspecified; recommended types would be GND = Ground, VIN_1/VIN_2 = Power In, and VOUT = Power Out. - Pin descriptions are not populated; recommended descriptions should mirror the datasheet functions above.
Footprint cross-check
Datasheet land pattern for MB / SOT-89:
- Contact pitch: 1.50 mm BSC.
- Pads 1 and 3 width: 0.48 mm max; length: 1.40 mm.
- Pad 2 width: 0.56 mm max.
- Heat slug pad width: 1.20 mm max.
- Contact 2 total pad length dimension Y2: 4.25 mm max.
- K dimension: 2.60 mm min to 2.85 mm max.
Project footprint observations from KiCad asset:
- Pad 1: 0.480 mm x 1.400 mm at x=-1.500 mm, mapped to GND.
- Pad 2: 0.560 mm x 1.525 mm at x=0, mapped to VIN_1.
- Pad 3: 0.480 mm x 1.400 mm at x=+1.500 mm, mapped to VOUT.
- Pad 4/tab: 2.000 mm x 2.725 mm, mapped to VIN_2.
- The lead pitch and the small lead pad dimensions match the datasheet nominal/max values.
- The large tab pad is electrically mapped correctly to VIN, but its 2.000 mm width is larger than the datasheet heat slug pad width value X3 = 1.20 mm max. This may be intentional for copper area/thermal soldering, but it is a footprint dimensional mismatch versus the extracted Microchip recommended land-pattern value and should be reviewed before publishing/manufacturing.
Flagged mismatches / cleanup items
- Footprint asset/value text references
MCP1703T5002EMB, but the project MPN and datasheet areMCP1702T-5002E/MB. This is a naming/value-text mismatch, not a pinout mismatch. - Package property
89-SOTis nonstandard compared with datasheet package codeMB/SOT-89-3; consider changing it for searchability and consistency. - Symbol pin types are
Unspecified; recommended electrical types are Ground / Power In / Power Out. - Pin descriptions are missing; recommended descriptions are: GND = Ground Terminal, VIN = Unregulated Supply Voltage, VOUT = Regulated Voltage Output, Tab = VIN tab/heat slug.
- Footprint tab pad dimensions should be reviewed: the project tab pad is larger than the datasheet extracted X3 value, while electrical mapping remains correct.
Overall conclusion
The core identity, MPN, package family, symbol pin numbering, and electrical pad mapping match the Microchip MCP1702T-5002E/MB datasheet. The main issues are metadata polish and footprint naming/dimensional review: wrong MCP1703 text in the footprint asset, unspecified/missing pin metadata, nonstandard package naming, and a larger-than-extracted tab pad.
Reviewed part information
Datasheet key specs
Pin and symbol cross-check
Footprint cross-check
Flagged mismatches / cleanup items
Overall conclusion
