The audit executor is complete. I’m reconciling its findings now and will independently verify the stored Datasheet URL, symbol pins, and footprint before closing.
I found the executor’s report and am checking the flagged mount classification, malformed symbol, and drill geometry directly against the live project.
Pass: Exact Samtec MPN; 50 symbol pins and 50 footprint pads; continuous numbering; correct 2×25 arrangement and 2.54 mm pitch/row spacing.
Key specs: Vertical through-hole header, 0.64 mm square terminals, 1.02 ±0.03 mm recommended PCB holes, 10 µin gold posts, −55°C to +125°C.
Mismatches:Mount = Wire is incorrect; Part Type/package/pitch/row metadata are missing; all pins lack descriptions and use Unspecified type; symbol rendering is malformed.
Critical: Pads expose no explicit plated-through-hole/drill rules and appear to inherit SMD/0.7 mm defaults. The part is not production-cleared.
The Datasheet URL was already populated with an official Samtec document, so it was not changed.
I filed an internal part-quality report covering the footprint, symbol, and metadata issues.
Completed: project metadata review; all 50 schematic terminals; all 50 PCB pad numbers and coordinates; pitch/row arrangement; official-source specification extraction; symbol/footprint cross-check; component review checks.
Completed, no mutation required: Datasheet URL was already populated when inspected.
Uncertainty: the layout API did not expose per-pad inline drill declarations, so drill implementation cannot be conclusively distinguished from inherited/default rules. This is a critical footprint uncertainty noted below.
The exact Samtec product page identifies the part as: “.100in/2.54mm Through Hole High Temp Header, 50 Pin, 2 Row, 10µin Gold/Flash, .230in Post, .430in OAL.”
Ordering-code interpretation and key specifications
Table
Code / characteristic
Authoritative interpretation
HTSW
High-temperature terminal/header strip
-1
0.100 in (2.54 mm) centers, all positions filled
25
25 positions per row
-07
Straight lead style: dimension A / overall length 0.430 in (10.92 mm), dimension B / post 0.230 in (5.84 mm). Catalog notes -07 is best mate with IDXX IDC cable series
-G
10 µin (0.25 µm) gold on post; gold flash on balance, over 50 µin (1.27 µm) nickel
-D
Double row, 0.100 in (2.54 mm) row spacing
Total contacts
50 (2 × 25)
Termination
Vertical straight through-hole
Terminal section
0.025 in (0.64 mm) square post/tail
Recommended PCB hole
0.040 in ±0.001 in (1.02 mm ±0.03 mm)
Insulator
Natural liquid crystal polymer (HTSW)
Terminal material
Phosphor bronze
Operating temperature
-55 °C to +125 °C with gold plating
Voltage rating
Mating-dependent: 550 VAC with SSW; 500 VAC with BCS or ESQ; other lower values apply to specified right-angle/mating combinations
Current rating
Mating-dependent and measured with one position powered per row: 4.3–6.3 A per pin across listed mating series; 5.7 A with SSW
Compliance/process
RoHS compliant; HTSW lead-free solderable
Ratings must not be treated as unconditional connector ratings: Samtec states them with particular mating series and test configurations.
Schematic symbol audit — exhaustive 50-terminal comparison
Exactly 50 terminals exist, numbered continuously 1 through 50, with no duplicates or omissions.
Every pin name equals its pin number (1…50), which is acceptable for a non-keyed passive header with no defined signal functions.
Every terminal has Pin Number matching its designator and is based on the Terminal part.
Symbol organization alternates odd pins on the left and even pins on the right in 25 vertical pairs: (1,2), (3,4), …, (49,50). This correctly represents a 2×25 connector and corresponds to the footprint numbering pattern.
All 50 terminals have Pin Type = Unspecified and no pin description. For a passive connector, Passive would normally be more semantically accurate, but the user prohibited pin-data edits; this is flagged only.
Section, pin group, orientation metadata, and terminal order are blank for all terminals. The two-column position geometry still organizes the symbol, but explicit organization metadata is absent.
The rendered symbol appears visually malformed: pin-number text is shown as separated outlined glyph boxes and overlaps/misaligns in several places. The underlying 50-pin data is complete, but the rendered presentation is not clean/readable.
Per-pin result: pins 1–50 all pass number/name continuity and odd/even pair organization; all 50 share the same uncertainty/mismatch of missing descriptions and Unspecified type.
Exactly 50 pad nodes exist, numbered continuously 1 through 50, with no duplicates or omissions.
Coordinates form 25 columns and 2 rows.
Along-row center spacing is 2.54 mm.
Row center spacing is 2.54 mm.
Numbering is paired by column: odd pad on one row, next even pad on the other row: 1/2 at x=0, 3/4 at x=2.54 mm, continuing through 49/50 at x=60.96 mm.
Overall center-to-center span from first to last column is 60.96 mm = 24 × 2.54 mm, correct for 25 positions per row.
Pad 1 is rectangular; pads 2–50 are circular. This is a conventional and clear pin-1 indication.
Silkscreen outline reported by the spatial view spans approximately x=-1.27 to 62.23 mm and y=-1.24 to 3.78 mm, consistent with a 63.50 mm × 5.02 mm body envelope suggested by the footprint asset name.
Pad geometry and drill concern
The layout inspection reports every copper pad at approximately 1.65 mm diameter (pad 1 rectangular, others circular), which is plausible for a 2.54 mm-pitch header.
The detailed node output did not expose an explicit padHoleType or per-pad holeSize rule. The computed system fallback shown during inspection was padHoleType: SMD and holeSize: 0.7 mm, while pads also reported forceAnnularLayers: Top, Bottom.
The spatial PCB SVG rendered the silkscreen but did not render the 50 copper pads or drill holes.
Therefore the footprint's actual plated-through-hole drill implementation cannot be confirmed from exposed data. If it truly uses the SMD/default 0.7 mm state, it is unusable: the physical part requires through holes and Samtec recommends 1.02 mm ±0.03 mm finished holes. A 0.7 mm hole is also smaller than the diagonal of a 0.64 mm square terminal (~0.91 mm), so it cannot accept the lead.
The footprint asset is named HDRV50W64P254_2X25_6350X502X838P.kicad_mod and a 3D model HTSW-125-07-G-D.stp is present, but asset names do not prove the drill declaration.
Per-pad result: pads 1–50 all pass presence, unique numbering, 2×25 placement, 2.54 mm pitch, and schematic-number correspondence. All 50 remain blocked on conclusive drill verification; pad 1 uniquely provides the orientation marker.
Cross-check summary
Passes
Exact MPN and manufacturer match official Samtec product page.
Symbol has all 50 terminals, numbered 1–50 without gaps or duplicates.
Footprint has all 50 pads, numbered 1–50 without gaps or duplicates.
Symbol pairing and footprint pairing both use odd/even contacts per 2-pin column.
Footprint is 2×25 with 2.54 mm pitch and 2.54 mm row spacing.
Pin 1 is distinguished by a rectangular copper pad.
Existing datasheet content is an official Samtec TSW/HTSW catalog document and supports ordering-code and family specifications.
Mismatches / uncertainties
Mount metadata is wrong:Wire versus official through-hole PCB mount.
Part Type missing: confirmed by Flux Component Review warning.
Package/case, pitch, rows, positions, and ratings are absent from metadata.
All terminal descriptions are blank and all terminal types are Unspecified, rather than passive connector contacts.
Symbol rendering is visually malformed/unreadable despite complete underlying numbering.
Critical footprint uncertainty: explicit plated-through-hole drill data is not exposed; observed fallback state is SMD/0.7 mm and pads do not render in spatial SVG. This warrants direct library-part inspection or a quality ticket before production use.
Datasheet URL is present but is not a stable official Samtec-hosted URL. The user authorized replacement only if absent, so it was not changed.
Official product-page scrape inconsistently listed “vertical, right-angle” as series capability. Exact MPN -07 without -RA/-RE is the straight vertical through-hole version.
Property mutation performed
None.Datasheet URL was already present at the initial inspection, so the conditional update was not triggered. No symbol, footprint, terminal, or other property data was altered.
Recommended escalation
Treat this library part as not production-cleared until the raw footprint confirms all 50 pads are plated through-holes with a finished hole matching Samtec's 1.02 mm ±0.03 mm recommendation. If the raw declaration is SMD or 0.7 mm drill, file a part-quality ticket citing all 50 pads and the official recommended hole specification.
Scope status
Current project metadata
Official authoritative sources
Ordering-code interpretation and key specifications
Schematic symbol audit — exhaustive 50-terminal comparison