# HFD2_003-S-L2 (Component) ## Description SUBMINIATURE DIP RELAY ## Component Details - **Owner:** silicon-yard - **Created:** 8/18/2026 - **Last Updated:** 8/18/2026 - **Visibility:** Public - **Package or Case Code:** DIP - **Manufacturer Part Number:** HFD2/003-S-L2 - **Part Type:** Electromechanical Components - **Datasheet URL:** https://www.hongfa.com/Product/Item/323 - **Manufacturer Name:** Hongfa - **Symbol Style:** parametric-v1 ## Distributor Pricing (qty 1) *Pricing shown for quantity 1. For price breaks and other quantities, open in Flux.* | Distributor | Unit Price (qty 1) | Stock | |------------|--------------------|-------| | [LCSC](https://www.lcsc.com/product-detail/C910882.html) | $2.5222 | 339 | - **Part Type:** Integrated Circuits - **Sub-Type:** Logic - **MPN:** HFD2/003-S-L2 - **Package / Case Code:** DIP - **Pin Count:** 10 - **Logic Function:** AND ## Pins | Pin | Name | Type | |-----|------|------| | 1 | COIL+_1 | | | 2 | COIL+_2 | | | 4 | COM_1 | | | 6 | NC_1 | | | 8 | NO_1 | | | 9 | NO_2 | | | 11 | NC_2 | | | 13 | COM_2 | | | 15 | COIL-_1 | | | 16 | COIL-_2 | | --- *Generated from [https://www.flux.ai/silicon-yard/hfd2003-s-l2](https://www.flux.ai/silicon-yard/hfd2003-s-l2)*