ES9822QPRO Review
RT1) and pin 41 (EPAD) in a separate pass.https://www.esstech.com/wp-content/uploads/2022/09/ES9822PRO_DS_v0.3.pdf
https://www.esstech.com/wp-content/uploads/2025/04/ES9822PRO_DS_v0.5.2.pdf
https://www.mouser.com/datasheet/2/1082/ES9822PRO_DS_v0_5_2-3623520.pdfTable
| Field | Current value | Datasheet check |
|---|---|---|
| Manufacturer Part Number | ES9822QPRO | Matches ordering information |
| Manufacturer | ESS Technology | Matches datasheet publisher |
| Description | Analog to Digital Converters - ADC Sabre stereo reference PRO ADC5 mm x 5mm, 40 pin QFN | Function/package broadly match; wording has missing space before “5 mm” |
| Package or Case Code | 40-QFN | Matches 5 mm x 5 mm 40 QFN ordering information |
| Designator Prefix | IC | Appropriate |
| Pads | 41 | Matches 40 perimeter pins + Pin 41 exposed/package pad |
Table
| Spec | Value |
|---|---|
| Part | ES9822QPRO / ES9822 PRO |
| Function | SABRE 32-bit, high-performance 2-channel ADC with programmable filters, ASP, and multiple output formats |
| Package | 5 mm x 5 mm 40 QFN, exposed/package pad numbered Pin 41 |
| Version reviewed | Datasheet v0.5.2, April 2025 |
| Dynamic range | +125 dB DNR in 2-channel mode; +128 dB DNR in mono mode |
| THD+N | -117 dB in 2-channel mode; -118 dB in mono mode |
| Sample rates / formats | PCM up to 768 kHz; DSD up to DSD1024 in v0.5.2 text; TDM/I2S/DSD/S/PDIF/RAW formats |
| Typical power | Less than 170 mW stated in overview |
| Supplies | AVCC/AVCC_L/AVCC_R = 4.5 V; AVDD = 3.3 V; DVDD internally supplied |
| Operating temperature | -20 °C to +85 °C |
| Minimum MCLK | 22 MHz |
| Exposed pad | Pin 41, not electrically connected internally, used for heat dissipation; connect to DGND/GND |
NC_1...NC_4 and DGND_1 for duplicate names.Table
| Pin | Schematic terminal | Datasheet name | Result | Notes |
|---|---|---|---|---|
| 1 | GPIO10 | GPIO10 | OK | General I/O |
| 2 | GPIO11 | GPIO11 | OK | General I/O |
| 3 | MODE | MODE | OK | I2C/SPI control selection |
| 4 | ACLK | ACLK | OK | Auxiliary clock input |
| 5 | AVCC | AVCC | OK | 4.5 V supply |
| 6 | AGND | AGND | OK | Analog ground |
| 7 | XOUT | XOUT | OK | Crystal output |
| 8 | XIN | XIN | OK | Crystal/oscillator input; datasheet footnote says MCLK can connect to XIN or ACLK |
| 9 | VREF_L | VREF_L | OK | Low-noise reference |
| 10 | AVCC_L | AVCC_L | OK | ADC reference 4.5 V supply |
| 11 | AGND_L | AGND_L | OK | Analog ground |
| 12 | IN_P1 | IN_P1 | OK | Ch1 positive input |
| 13 | IN_M1 | IN_M1 | OK | Ch1 negative input |
| 14 | NC_1 | NC | OK with naming suffix | No connect |
| 15 | NC_2 | NC | OK with naming suffix | No connect |
| 16 | NC_3 | NC | OK with naming suffix | No connect |
| 17 | NC_4 | NC | OK with naming suffix | No connect |
| 18 | IN_M2 | IN_M2 | OK | Ch2 negative input |
| 19 | IN_P2 | IN_P2 | OK | Ch2 positive input |
| 20 | AGND_R | AGND_R | OK | Analog ground |
| 21 | AVCC_R | AVCC_R | OK | ADC reference 4.5 V supply |
| 22 | VREF_R | VREF_R | OK | Low-noise reference |
| 23 | CHIP_EN | CHIP_EN | OK | Active-high chip enable |
| 24 | GPIO9 | GPIO9 | OK | GPIO / interrupt capable |
| 25 | MOSI/SDA | MOSI/SDA | OK | SPI MOSI or I2C SDA |
| 26 | SCLK/SCL | SCLK/SCL | OK | SPI/I2C serial clock |
| 27 | SS/ADDR1 | SS/ADDR1 | OK | SPI SS or I2C ADDR1 |
| 28 | MISO/ADDR2 | MISO/ADDR2 | OK | SPI MISO or I2C ADDR2; v0.5.2 specifically corrected this pin |
| 29 | DVDD | DVDD | OK | Digital core supply, internally supplied |
| 30 | AVDD | AVDD | OK | 3.3 V I/O supply |
| 31 | DGND_1 | DGND | OK with naming suffix | Digital core ground |
| 32 | GPIO8 | GPIO8 | OK | Serial data 8 |
| 33 | GPIO7 | GPIO7 | OK | Serial data 7 |
| 34 | GPIO6 | GPIO6 | OK | Serial data 6 |
| 35 | GPIO5 | GPIO5 | OK | Serial data 5 |
| 36 | GPIO4 | GPIO4 | OK | Serial data 4 |
| 37 | GPIO3 | GPIO3 | OK | Serial data 3 |
| 38 | GPIO2 | GPIO2 | OK | Serial data 2 |
| 39 | GPIO1 | GPIO1 | OK | Serial data 1 |
| 40 | DGND_2 | RT1 | MISMATCH | Datasheet v0.5.2: RT1, input, HiZ, reserved; must be connected to DGND for normal operation. The schematic currently labels this pin as DGND_2, which hides the required reserved-pin function. |
| 41 | DGND_3 | Package Pad / EPAD | MISMATCH | Datasheet: exposed/package pad, not electrically connected internally; connect to DGND/GND. Current label DGND_3 makes it look like a normal digital ground pin. |
Pin Type properties are currently Unspecified; the datasheet defines analog inputs, analog output, I/O pins, power pins, ground pins, no-connect pins, reserved input, and package pad.Pin Description properties are populated. Adding datasheet descriptions would improve ERC, searchability, and part quality.NC_1...NC_4 and DGND_1 are acceptable Flux disambiguation, but pin 40 and pin 41 should not use ground-like names.Table
| Footprint item | Current footprint | Datasheet check | Result |
|---|---|---|---|
| Body/silkscreen outline | 5 mm x 5 mm outline visible | D/E = 5.00 mm BSC | OK |
| Perimeter pad count | 40 perimeter pads | 40 QFN perimeter pins | OK |
| Exposed pad | 1 center pad | Pin 41 package pad / EPAD | OK count/location |
| Pitch | Pads spaced on 0.40 mm grid | e = 0.40 mm BSC | OK |
| Perimeter pad width | 0.20 mm nominal from footprint data | b = 0.15/0.20/0.25 mm | OK nominal |
| Exposed pad size | 3.84 mm x 3.84 mm from footprint data | D2/E2 = 3.74 min / 3.79 nom / 3.84 max mm | OK at datasheet max |
| Pin-1 marker | Marker at pin-1 corner present | Pin-1 indicator required for QFN orientation | OK |
DGND_2 to RT1, set pin type to Input, and add pin description: “Reserved. Must be connected to DGND for normal operation.”DGND_3 to EPAD or Package Pad, set pin type to Passive or Unspecified, and add description: “Not electrically connected internally, used for heat dissipation. Connect to DGND/GND.”Scope
Datasheet Source
Current Part Metadata
Key Datasheet Specs
Pinout Cross-Check
Symbol and Pin Property Findings
Footprint Cross-Check
Mismatches / Recommended Fixes
Overall Assessment