Part Datasheet Audit
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Make the functional group more general.
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Add a Section property to all pins, and apply the same value used in the Pin Group property to each pin's Section property.
Assign a Terminal Order from 1 to 10, starting with Power. Power should be Terminal Order 1, and Ground should be last, Terminal Order 10. For Orientation, set Power to "Top" and Ground to "Bottom." For the remaining sections/groups, you may decide the Terminal Order and Orientation yourself. For Orientation, distribute them between "Left" and "Right" — don't put everything on one side. Each group/section should have a different orientation.
Thought for 19 sec
I’ll generalize the remaining signal groups, keep Section identical to Pin Group on every pin, and redistribute the non-power groups across left and right while preserving Power=1/Top and Ground=10/Bottom.
Worked for 1 min 14 sec
Updated and verified all pins:
- Power — Order 1, Top
- Control — Order 3, Right
- Digital I/O — Order 5, Left
- Clock — Order 7, Left
- Analog / RF — Order 8, Right
- Ground — Order 10, Bottom
Every pin now has a Section matching its Pin Group, with non-power groups distributed across both left and right sides. Pin assignments remain exclusive.
Fix metadata and verify
Use known group values
Add pin descriptions
Review symbol layout
Check footprint details
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EFR32BG27C320F768GJ39-B Part Datasheet Audit
Sources
- Official manufacturer datasheet: https://www.silabs.com/documents/public/data-sheets/efr32bg27-datasheet.pdf
- Datasheet revision checked: Silicon Labs Rev. 1.3, April 2026
- Official product page: https://www.silabs.com/wireless/bluetooth/efr32bg27-series-2-socs/device.efr32bg27c320f768gj39
- Existing part Datasheet URL: a user-uploaded PDF hosted on
storage.googleapis.com.
The Datasheet URL property was already populated, so it was not changed. The existing PDF content resolves as the official Silicon Labs datasheet and the current official manufacturer URL above is preferred for traceability.
Existing Part Information Review
Table
| Item | Existing value | Datasheet result | Status |
|---|---|---|---|
| MPN | EFR32BG27C320F768GJ39-B | Exact ordering code listed | Match |
| Manufacturer | Silicon Labs | Silicon Laboratories | Match |
| Package | WLCSP | WLCSP39 | Functionally correct but insufficiently specific |
| Pin/pad count | 39 | 39-ball WLCSP | Match |
| Designator prefix | IC | Integrated circuit | Match |
| Part type | Integrated Circuits | Wireless MCU / Bluetooth LE SoC | Broad but acceptable |
| Description | Includes 802.15.4 and Zigbee | Ordering table lists Bluetooth 5.x, Direction Finding (AoA transmitter), and proprietary protocols | Mismatch |
| Temperature | -40 to +85 °C in description | G-grade is -40 to +85 °C | Match |
| Supply ranges | 0.8–1.7 V and 1.8–3.8 V in description | Boost input 0.8–1.7 V; buck/supply operation depends on mode, generally up to 3.8 V | Broadly correct |
Key Specifications
- 32-bit Arm Cortex-M33, up to 76.8 MHz product-rated core frequency.
- 768 kB flash, 64 kB RAM.
- Bluetooth 5.x, Bluetooth LE 2M and Long Range; Direction Finding AoA transmitter; proprietary 2.4 GHz support.
- Maximum TX power for this ordering code: +4 dBm.
- 19 GPIO.
- Secure Vault Mid.
- Buck or boost DC-DC configuration.
- G temperature grade: -40 to +85 °C.
- WLCSP39 nominal body: 2.291 × 2.624 × 0.495 mm; 0.35 mm minimum ball pitch.
Schematic Symbol and Pin Map
All 39 symbol terminals have the correct package coordinates and names compared with datasheet Table 6.3. No swapped, missing, or extra terminals were found.
The symbol terminals do not include datasheet-derived
Pin Description properties, and every terminal currently has Pin Type: Unspecified. This reduces symbol clarity and weakens ERC behavior. Recommended pin types include power for supply pins, ground/power for ground pins, input for RESETn/HFXTAL_I/BOOST_EN as appropriate, output for HFXTAL_O, bidirectional for GPIO, passive/power for regulator nodes, and bidirectional/passive for RF2G4_IO depending on the library convention.The three ground balls are represented as
VSS_1, VSS_2, and VSS_3 rather than all being displayed as VSS. Their ball assignments E4, E5, and F2 are correct; the suffixes are a naming convention rather than an electrical mismatch.Footprint Review
- 39 pad nodes are present, matching the package.
- The rendered body outline is approximately 2.292 × 2.624 mm, matching the nominal package body dimensions.
- Pin-1 marking is present.
- Datasheet land pattern requires 0.20 mm circular NSMD lands, 0.35 mm pitch, and at least 0.06 mm solder-mask clearance around each land. The available layout inspection did not expose computed per-pad size, pitch, mask, or paste rules, so these details could not be conclusively verified from the structured output.
- The footprint includes oversized outer outline/courtyard-like geometry around the package; this is not inherently incorrect, but its layer assignment and intended clearance function should be checked in the footprint editor.
Mismatches and Risks
- Incorrect protocol description: The part description claims IEEE 802.15.4 and Zigbee support. The EFR32BG27 ordering information specifies Bluetooth 5.x, Direction Finding, and proprietary operation; BG27 is not the Zigbee/802.15.4 member of the family.
- Package property too generic:
WLCSPshould ideally beWLCSP39to prevent package ambiguity. - Missing pin descriptions: All terminals should carry the descriptions from datasheet Table 6.3.
- Unspecified pin electrical types: All terminals are
Unspecified, reducing ERC usefulness. - Noncanonical datasheet host: A datasheet is set, but it is a user-uploaded copy rather than the stable official Silicon Labs URL.
- Footprint manufacturing details not fully provable: Pad diameter, 0.35 mm pitch, NSMD mask clearance, and 1:1 paste aperture should be explicitly verified before relying on the footprint for production.
Overall Assessment
The MPN, manufacturer, ball count, body outline, and complete ball-to-signal mapping are correct. The principal problems are metadata quality: the description incorrectly adds Zigbee/802.15.4, the package label is underspecified, and pin descriptions/electrical types are absent. The footprint appears dimensionally aligned at the package-outline level, but its detailed land and mask geometry needs a final rule-level check.
Sources
Existing Part Information Review
Key Specifications
Schematic Symbol and Pin Map
Footprint Review
Mismatches and Risks
Overall Assessment
