Part Audit Review

C

cherepanyadima

Review all available part information (MPN, package, pin count, description, properties). If no datasheet URL is already set, search the web for the official datasheet and update the part's Datasheet property with the URL. Then cross-check the schematic symbol, footprint, and pin descriptions against the datasheet. Summarize key specs and flag any mismatches.

flux

I’ll audit the part metadata and assets, verify the existing datasheet source, then cross-check symbol pins, footprint geometry, and descriptions against manufacturer documentation.
Created a project doc

Part Audit Report

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Part Audit Report Scope
Audit of EBYTE E07-M1101D-SMA project metadata, 10-pin schematic symbol, through-hole PCB footprint, pin descriptions, and attached assets.
Sources and verification status
The existing Datasheet property was not changed because it was already populated, as requested. The official EBYTE page confirms the current product identity and key specifications, but its direct manual download URL was not exposed by the web page extractor. Mechani...

flux

Audit complete. The 10-pin electrical pinout and footprint geometry are substantially correct, but I flagged collapsed GND symbol pins, ~CS vs CSN naming, missing Package/Description properties, disabled silkscreen, and a 15×28 mm vs 15×30 mm mechanical-source discrepancy.
The Datasheet property was already populated, so it was not changed. Full findings are in Part Audit Report.
Fix metadata and symbol
Verify physical dimensions
Restore module silkscreen
Improve pin descriptions
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Files

Pins

Symbol

Layout

Preview

GND
Pin Number
10
MISO/GDO1
Pin Number
7
MOSI
Pin Number
6
VCC
Pin Number
2
GND
Pin Number
1
GND
Pin Number
9
GDO0
Pin Number
3
GDO2
Pin Number
8
SCK
Pin Number
5
~CS
Pin Number
4
Part Audit Report
Scope
Audit of EBYTE E07-M1101D-SMA project metadata, 10-pin schematic symbol, through-hole PCB footprint, pin descriptions, and attached assets.
Sources and verification status
The existing Datasheet property was not changed because it was already populated, as requested. The official EBYTE page confirms the current product identity and key specifications, but its direct manual download URL was not exposed by the web page extractor. Mechanical values below were cross-checked against the manual PDF and the imported KiCad footprint.
Current part information

Table

FieldCurrent valueAudit result
MPNE07-M1101D-SMACorrect
ManufacturerEBYTECorrect
Part typeModuleCorrect
Designator prefixUAppropriate
Pin/pad count10Correct
Symbol styleparametric-v1Present
Datasheet URLSnapEDA datasheet pagePopulated; not an official EBYTE URL
Package propertyMissingAdd DIP / through-hole module, 2.54 mm interface
Description propertyMissingAdd a concise product description
Attached footprintXCVR_E07-M1101D-SMA.kicad_modPresent
Attached 3D modelE07-M1101D-SMA.stepPresent
Attached symbolE07-M1101D-SMA Symbol.svgPresent
Key specifications

Table

ParameterValue
RF ICTexas Instruments CC1101
FunctionSub-GHz SPI transceiver module
Frequency range387–464 MHz; nominal/default 433 MHz
Maximum transmit power10 dBm nominal
InterfaceSPI, up to 10 Mbps in the reviewed manual
Supply1.8–3.6 V; 3.3 V typical
Logic level3.3 V nominal; 5 V TTL is unsafe
Air data rate0.6–500 kbps
Receive sensitivityApproximately −108 to −110 dBm depending on manual revision/test rate
Operating temperature−40 to +85 °C
Module body15 × 30 mm in the detailed mechanical manual
Current official page size listing15 × 28 mm excluding SMA
MountingThrough-hole/DIP
AntennaSMA-K on the audited variant
Weight3.4 ± 0.1 g
Symbol and pin audit

Table

PinSymbol nameDatasheet nameTypeResult
1GNDGNDPower InMatch
2VCCVCCPower InMatch
3GDO0GDO0OutputMatch
4~CSCSNInputFunctionally correct, naming mismatch
5SCKSCKInputMatch
6MOSIMOSIInputMatch
7MISO/GDO1MISO/GDO1OutputMatch
8GDO2GDO2OutputMatch
9GNDGNDPower InMatch
10GNDGNDPower InMatch
Symbol findings
  • Pin numbers, signal assignment, and electrical directions agree with the manual.
  • Pin 4 should preferably be named CSN or ~CSN to match EBYTE documentation. Current ~CS is electrically understandable but not an exact name match.
  • The three GND pins share the same symbol position. This is electrically valid but visually collapses pins 1, 9, and 10, making individual connection and pin-number inspection difficult. Separate or explicitly stack them with visible pin numbers.
  • Pin descriptions are only generic names/types in the project. More useful descriptions should mention SPI clock/data roles, active-low chip select, and programmable GDO functions.
Footprint audit
Verified geometry
The imported footprint agrees closely with the detailed manual drawing:
  • Eight signal pins use 1.50 × 1.50 mm through-hole pads with 0.90 mm drills.
  • Signal-pin pitch is 2.54 mm in both axes.
  • Two large grounded support/SMA holes use 4.20 mm pads with 3.00 mm drills.
  • Body outline is 30.0 × 15.0 mm.
  • SMA projection is 9.6 mm beyond the body, producing a 39.6 mm total outline length.
  • Large-hole spacing and signal header coordinates match the drawing after accounting for footprint origin and axis orientation.
  • Pad 1 is rectangular and has a pin-1 marker.
Footprint concerns
  • The official current product page says 15 × 28 mm excluding SMA, while the detailed manual and footprint use 15 × 30 mm. This is a real revision/source discrepancy. Confirm the physical module revision before relying on enclosure clearance or tight board-edge placement.
  • The footprint silk geometry is disabled by an override, leaving only fabrication geometry and the reference text active. This may be intentional, but it removes the visible module/SMA outline from assembled-board silkscreen.
  • The Package metadata property is absent even though the footprint is clearly a custom through-hole module.
High priority
  1. Mechanical revision discrepancy: official page lists 15 × 28 mm; detailed manual/footprint use 15 × 30 mm. Verify a physical sample or obtain the exact official manual revision for the purchased module.
  2. Collapsed GND symbol pins: pins 1, 9, and 10 occupy the same location. Separate them for unambiguous schematic connections and review.
Medium priority
  1. Pin 4 naming: rename ~CS to CSN or ~CSN.
  2. Missing Package property: set to DIP / through-hole RF module, 2.54 mm pitch, SMA-K.
  3. Missing Description property: suggested text: CC1101-based 387–464 MHz 10 dBm SPI transceiver module, through-hole, SMA-K antenna connector.
  4. Datasheet provenance: the existing URL is a SnapEDA page rather than a direct official EBYTE manual. It satisfies the non-empty property requirement, but an official direct PDF URL would be preferable when available.
Low priority
  1. Add detailed pin descriptions for SPI and GDO behavior.
  2. Decide whether to re-enable or recreate a clean top-silkscreen module outline.
Overall assessment
The electrical pinout and footprint pad geometry are substantially correct for the reviewed 10-pin E07-M1101D-SMA manual. The main risks are metadata completeness, the stacked GND symbol pins, pin-4 naming, and the unresolved 28 mm versus 30 mm module-body revision discrepancy.

  • Scope

  • Sources and verification status

  • Current part information

  • Key specifications

  • Symbol and pin audit

  • Symbol findings

  • Footprint audit

  • Verified geometry

  • Footprint concerns

  • Mismatches and recommended corrections

  • High priority

  • Medium priority

  • Low priority

  • Overall assessment