Part Audit Mismatches

Created a project doc

CC1354P106T0RGZR Part Audit

View Document
Texas Instruments CC1354P10 datasheet, Rev. B: https://www.ti.com/lit/ds/symlink/cc1354p10.pdf Exact ordering code reviewed: CC1354P106T0RGZ...

flux

Audit complete. MPN, manufacturer, 49-terminal count, and pin mappings 1–48 are correct; the existing Datasheet property was already populated, so it was not changed.
Critical mismatches:
  • Footprint is rendered 1000× too small and is unusable for manufacturing.
  • Pin 49 is GND instead of TI’s EGP.
  • All pin types are Unspecified; descriptions and functional grouping are missing.
  • Package metadata is missing.
Full findings: CC1354P106T0RGZR Part Audit. I also filed an internal part-quality report for the footprint defect.
A

adrian95

can you group together pins by their functions? for example for Power, 3v3, gnd_1 gnd_2 etc NOTE: If you group them, can you not add the same pin if you already added them in a group? You should know which pin function is common for its function.

flux

I’ll organize every terminal into one broad functional group with no duplicates, using the TI pin functions as the source of truth, then verify all 49 pins are assigned exactly once.

flux

Grouped and verified all 49 pins, with each pin assigned exactly once:
  • Power: 8 pins
  • Ground: 1 pin
  • RF: 7 pins
  • Clock: 4 pins
  • GPIO: 26 pins
  • Debug / Reset: 3 pins
Each pin’s Section matches its Pin Group, with consistent orientation and unique ordering. Pin names, numbers, footprint mappings, and electrical types were preserved.
Fix metadata and footprint
Fix footprint scale
Populate pin details
Rename exposed pad
Run part review
Sign up to send

Files

Pins

Symbol

Layout

Preview

CC1354P106T0RGZR Part Audit
Authoritative source
Metadata review

Table

FieldCurrent stateResult
MPNCC1354P106T0RGZRCorrect
ManufacturerTexas InstrumentsCorrect
DescriptionRF Microcontrollers - MCU THOR 1M CC1354P 7X7Identifies the device, but is terse and does not use TI's formal SimpleLink high-performance multi-band wireless MCU description
Part TypeIntegrated CircuitsPresent but generic
Package propertyMissingMismatch: should identify RGZ VQFN-48, 7 x 7 mm, 0.5 mm pitch
Terminal count49Correct: 48 perimeter leads plus exposed ground pad
Datasheet URLAlready populated with a Google-hosted uploaded PDFNot changed because the requested condition was to update only if absent. Preferred canonical URL is the TI link above.
Verified key specifications
  • SimpleLink multi-band wireless MCU with integrated power amplifier
  • Package: TI RGZ0048A, VQFN-48 with exposed pad
  • Body: 7.00 x 7.00 mm nominal
  • Lead pitch: 0.5 mm
  • Maximum package height: 1.0 mm
  • Operating temperature for the exact orderable: -40 C to +105 C
  • Main supply pins: 1.8 V to 3.8 V
  • 26 GPIOs in the RGZ package
  • 1 MB flash device variant
Symbol and terminal audit
All physical pin numbers 1 through 49 are present exactly once. Pins 1 through 48 have the correct TI signal names and number assignments.
Mismatches
  • Pin 49 is named GND; TI names the exposed ground pad EGP.
  • All 49 terminals have Pin Type set to Unspecified.
  • All 49 pin descriptions are absent.
  • Pin Group, Section, orientation, and terminal-order metadata are absent.
Missing electrical classification
  • DIO pins and JTAG_TMSC: bidirectional digital
  • JTAG_TCKC and RESET_N: digital inputs
  • RF pins 1-7: RF/passive signals
  • VDDS, VDDS2, VDDS3, VDDS_DCDC: power inputs
  • DCDC_SW, DCOUPL, VDDR, VDDR_RF: internal regulator/power nodes
  • Crystal pins 8, 9, 46, 47: analog
  • Pin 49 EGP: ground
Important missing pin notes
  • RESET_N is active-low and has no internal pull-up.
  • EGP is the device's only ground connection.
  • High-drive capability applies to pins 10, 11, 12, 24, 26, and 27.
  • Analog capability applies to DIO_23 through DIO_30.
Footprint audit
The intended footprint asset corresponds to a 7 mm, 0.5 mm-pitch QFN, but the computed footprint is exactly 1000x too small and is not manufacturable.

Table

FeatureFootprint source intentComputed layoutTI example land pattern
Perimeter center offset+/-3.45 mm+/-0.00345 mmapproximately +/-3.4 mm
Perimeter pad0.30 x 0.85 mm0.00030 x 0.00085 mm0.24 x 0.60 mm
Exposed pad5.25 x 5.25 mm0.00525 x 0.00525 mm5.15 x 5.15 mm
Body/fabrication outline7 x 7 mmapproximately 0.007 x 0.007 mm7 x 7 mm
Additional differences independent of the scale failure:
  • Source perimeter pads are 0.06 mm wider and 0.25 mm longer than TI's example board land.
  • Source exposed pad is 0.10 mm larger per axis than TI's example.
  • The exposed-pad paste is one solid aperture rather than TI's segmented stencil example at approximately 67% paste coverage.
Conclusion
The MPN, manufacturer, terminal count, and pins 1-48 mapping are correct. The part should not be used for PCB manufacturing until the 1000x footprint scaling defect is corrected. Symbol terminal metadata should also be populated, and exposed pad 49 should be renamed from GND to EGP while retaining a Ground electrical type.

  • Authoritative source

  • Metadata review

  • Verified key specifications

  • Symbol and terminal audit

  • Mismatches

  • Missing electrical classification

  • Important missing pin notes

  • Footprint audit

  • Conclusion