ASP-230333-03 Part Review
Date: 2026-07-13
Scope
Reviewed available Flux part information for the published part project ASP-230333-03, found and set the official Samtec datasheet/drawing URL, and cross-checked the schematic terminals, footprint geometry, and pin metadata against the official source.
Source documents
Current Flux part information
- Project / part name:
ASP-230333-03
- Manufacturer Part Number:
ASP-230333-03
- Manufacturer Name:
Samtec
- Designator Prefix:
J
- Datasheet URL:
https://suddendocs.samtec.com/prints/asp-230333-03-mkt.pdf
- Published part UID:
2695e5cd-cc63-4520-9639-249c09c5512d
- Library terminal count: 400
- Schematic components: 400
Terminal components
- PCB layout nodes: 414 total; 404 pads
- Nets: 0
Key datasheet / product specs
- Title / description: Custom COM-HPC male assembly; Samtec product page describes it as a 0.635 mm AcceleRate HP high-performance array terminal.
- Connector family: AcceleRate HP / APM6-style high-performance array terminal.
- Connector role: COM-HPC carrier plug / male assembly.
- Mating family: APF6 high-performance array socket.
- Pitch: 0.635 mm.
- Contact arrangement: rows A, B, C, D with positions 01 through 100; 4 rows x 100 columns = 400 positions.
- Relevant corner labels: A01, D01, A100, D100.
- Product page ratings: 1.2 A max current; 150 VAC / 212 VDC max voltage.
- Product page speed claims: up to 56 Gbit/s NRZ / 112 Gbit/s PAM4; PCIe 6.0 / CXL 3.2 / 100 GbE compatible.
- Stack height context: product page advertises 5 mm to 10 mm stack heights; COM-HPC table lists ASP-230333-03 as 5 mm stack height.
- Drawing revision/date: Rev D, 2023-10-26.
- Materials: LCP natural insulator; copper alloy contacts and weld tabs.
- Plating: terminal contact area 0.000010 in ref gold; terminal remainder 0.000200 in ref tin; weld tab entire pin 0.000200 in ref tin.
- Recommended PCB terminal pads: circular 0.356 mm typical on 0.635 mm pitch.
- Recommended stencil: 0.125 mm thick; 0.330 mm x 0.838 mm rectangular apertures typical.
- Drawing notes: -0 column termination connectors use optimized solder paste volume over round PCB pads; paste coalesces during reflow to form columnar solder joints.
Schematic symbol / terminal check
- Row A: 100 schematic terminals present.
- Row B: 100 schematic terminals present.
- Row C: 100 schematic terminals present.
- Row D: 100 schematic terminals present.
- The schematic designators cover the expected alphanumeric pattern A01-A100, B01-B100, C01-C100, and D01-D100.
- Each terminal uses Part Type
Terminal, Pin Type Passive, and Pin Number equal to its alphanumeric terminal name.
- No nets are present, which is expected for a standalone connector part definition.
Symbol findings
- PASS: pin count matches the datasheet arrangement: 400 positions.
- PASS: terminal naming convention matches Samtec row/column labels.
- PASS: electrical pin type
Passive is appropriate for connector contacts.
- FLAG: the symbol is implemented as 400 individual
Terminal components rather than one grouped connector symbol. This is usable for a published connector part in Flux, but it is not a conventional single-symbol connector presentation.
- FLAG: per-pin descriptions are effectively absent beyond Pin Number / Pin Type. The official drawing does not provide signal-level COM-HPC functional names, so no signal descriptions can be verified from this drawing alone.
Footprint check
- Terminal pad count: 400 connector contact pads corresponding to rows A-D and positions 01-100.
- Additional mechanical/alignment pads: 4 extra pad nodes are present, producing 404 pads total.
- Terminal pad shape: circular.
- Terminal pad size: approximately 0.356 mm diameter, matching the recommended PCB layout.
- Column pitch: positions step by approximately 0.635 mm, matching the drawing.
- Row spacing from inspected coordinates: A-B approximately 2.2 mm, B-C approximately 2.4 mm, C-D approximately 2.2 mm, matching the drawing callouts.
- Connector length outline: silk/outline spans about 68.62 mm, matching the Samtec drawing length callout.
- Connector width outline: silk/outline spans about 8.75 mm, matching the Samtec drawing width callout.
- Pin-1 / A01 area marking is present near the A01 side.
Footprint findings
- PASS: 400 main contact pads match the expected 4 x 100 contact array.
- PASS: main contact pad diameter matches Samtec's 0.356 mm recommendation.
- PASS: pitch and row spacing match the official drawing.
- PASS: outline dimensions align with key Samtec drawing dimensions.
- FLAG: the four non-signal mechanical/alignment pads need exact verification against Samtec's PTH/NPTH requirements. The footprint shows two
SH1/SH2 circular pads and two unnamed 0.975 mm circular pads; the drawing calls out PTH/NPTH features near 0.95/0.975 mm. The inspected data did not expose drill/plating attributes, so hole plating and drill diameters could not be confirmed.
- FLAG: the recommended stencil apertures are documented by Samtec but are not represented as separate stencil aperture geometry in the inspected footprint data.
Metadata / property gaps
- PASS: MPN and manufacturer are correct.
- PASS: Datasheet URL is now set to the official Samtec PDF drawing.
- FLAG: Part Type appears blank in the library metadata. Recommended value:
Connector.
- FLAG: Connector-specific metadata is not populated: connector type, gender, pitch, positions, rows, current rating, voltage rating, mating connector, and stack height are not currently represented as structured properties.
- FLAG: Package / case code is not set. For this connector, a descriptive package value such as
APM6 / AcceleRate HP 4x100 COM-HPC male array would be clearer than leaving it blank.
Recommended follow-up fixes
- Populate structured part metadata: Part Type = Connector; Connector Pitch = 0.635 mm; Connector Positions = 400; Connector Rows = 4; Connector Gender = Male; Connector Type = COM-HPC / board-to-board array; Current Rating = 1.2 A; Voltage Rating = 150 VAC / 212 VDC; Mating Connector = APF6 family.
- Verify the four mechanical/alignment holes with an authoritative Samtec footprint file or drawing view that exposes drill/plating details, then update pad/hole rules if needed.
- Consider adding Pin Description values like
COM-HPC terminal A01 through D100, or importing official COM-HPC signal names if the target pinout standard and module type are available.
- If manufacturing from this footprint, check stencil generation against Samtec's 0.330 mm x 0.838 mm rectangular aperture recommendation for 0.125 mm stencil thickness.
Overall result
The core 400-position connector definition substantially matches the official Samtec ASP-230333-03 geometry and terminal naming. The main issues are metadata completeness, missing/limited pin descriptions, and unverified mechanical hole drill/plating details for the four non-signal pads.