TE Part Review
Part Review: TE Connectivity 2438987-1
2438987-1.Datasheet URL: https://www.mouser.com/datasheet/2/418/9/ENG_DS_evdw_2311-3368545.pdfDatasheet URL: https://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocFormat=pdf&DocLang=English&DocNm=2438987&DocType=Customer+Drawing&PartCntxt=2438987-12438987, Rev A4, "VERT USB 3.2, TYP A (Shield leg solder)".Table
| Field | Current value | Review |
|---|---|---|
| Project / part name | 2438987-1 | Matches TE MPN. |
| Manufacturer Part Number | 2438987-1 | Matches datasheet. |
| Manufacturer Name | TE Connectivity | Matches datasheet. |
| Description | USB Connectors Vertical USB 3.2 A (Shield leg solder) / GF | Matches TE description intent. |
| Part Type | Connector | Correct. |
| Designator Prefix | J | Correct for connector. |
| Mount | Solder | Part is through-hole solder; value is directionally correct but not very specific. |
| Terminal / pad count | 13 | Correct: 9 signal contacts + 4 shield/shell solder legs. |
| Package / case | Not explicitly set | Recommended to add a more specific package/termination descriptor if supported, e.g. USB Type-A vertical through-hole receptacle. |
Table
| Specification | Datasheet value |
|---|---|
| Connector family | USB Type-A receptacle, standard USB |
| USB generation | USB 3.1 Gen 2 / USB 3.2 Type-A Gen 2 |
| Orientation | Vertical, top mount |
| Ports | 1 |
| Signal positions | 9 |
| Shield/shell legs | 4 |
| Total PCB holes/pads | 13 |
| Termination | Through-hole solder |
| Shield type | Straight leg solder, shielded |
| Contact current rating | 1.8 A max for VBUS/GND contacts; 0.25 A for other signal contacts |
| Voltage rating | 100 VAC/DC |
| Dielectric withstand | 100 VAC RMS for 1 minute, leakage current 0.5 mA max |
| Contact resistance | Initial 30 mΩ max for power/GND; initial 50 mΩ max for other contacts; 10 mΩ max change after testing |
| Operating temperature | -55°C to +105°C |
| Contact plating | GF variant; gold contact area, matte tin solder tails, nickel underplate |
| Shell plating/material | Stainless steel shell with nickel plating |
| Packaging | Tape & reel; drawing indicates 150 pcs/reel |
| PCB thickness | Product page range 1.0–1.6 mm; drawing recommends 1.2 mm |
| Lifecycle/status | Active, though TE page may show not currently available for ordering/inventory |
Table
| Pin | Datasheet signal | Flux terminal/designator | Flux pin number | Result |
|---|---|---|---|---|
| 1 | VBUS | VBUS | 1 | Match |
| 2 | D- | D- | 2 | Match |
| 3 | D+ | D+ | 3 | Match |
| 4 | GND | GND_1 | 4 | Match |
| 5 | STDA_SSRX- | STDA_SSRX- | 5 | Match |
| 6 | STDA_SSRX+ | STDA_SSRX+ | 6 | Match |
| 7 | GND | GND_2 | 7 | Match |
| 8 | STDA_SSTX- | STDA_SSTX- | 8 | Match |
| 9 | STDA_SSTX+ | STDA_SSTX+ | 9 | Match |
| Shell legs | Shield/shell solder legs | MH1, MH2, MH3, MH4 | MH1-MH4 | Functionally present; datasheet treats these as shell/shield legs, not signal contacts. |
Pin Type: Unspecified and lack explicit Pin Description fields.(0, 0), USB 3.x contact row is Y = 0, and USB 2.0 contact row is Y = +3.00 mm:Table
| Pin | Datasheet X (mm) | Datasheet Y (mm) | Hole / land |
|---|---|---|---|
| 1 | -3.50 | +3.00 | Ø0.70 ±0.05 hole, Ø1.30 land |
| 2 | -1.00 | +3.00 | Ø0.70 ±0.05 hole, Ø1.30 land |
| 3 | +1.00 | +3.00 | Ø0.70 ±0.05 hole, Ø1.30 land |
| 4 | +3.50 | +3.00 | Ø0.70 ±0.05 hole, Ø1.30 land |
| 5 | +4.00 | 0.00 | Ø0.70 ±0.05 hole, Ø1.30 land |
| 6 | +2.00 | 0.00 | Ø0.70 ±0.05 hole, Ø1.30 land |
| 7 | 0.00 | 0.00 | Ø0.70 ±0.05 hole, Ø1.30 land |
| 8 | -2.00 | 0.00 | Ø0.70 ±0.05 hole, Ø1.30 land |
| 9 | -4.00 | 0.00 | Ø0.70 ±0.05 hole, Ø1.30 land |
Table
| Feature | Datasheet value |
|---|---|
| Shell leg X centers | ±6.40 mm |
| Upper shell leg Y centers | 0.00 mm |
| Lower shell leg Y centers | +4.00 mm |
| Upper shell slots | 0.80 × 2.10 mm hole/slot, 1.40 × 2.70 mm land |
| Lower shell slots | 0.80 × 2.70 mm hole/slot, 1.40 × 3.30 mm land |
Table
| Pad | Current coordinate (mm) | Size / drill |
|---|---|---|
| 1 | (0.0, 0.0) | 1.30 × 1.30 rect, Ø0.70 drill |
| 2 | (2.5, 0.0) | Ø1.30, Ø0.70 drill |
| 3 | (4.5, 0.0) | Ø1.30, Ø0.70 drill |
| 4 | (7.0, 0.0) | Ø1.30, Ø0.70 drill |
| 5 | (7.5, -2.5) | Ø1.30, Ø0.70 drill |
| 6 | (5.5, -2.5) | Ø1.30, Ø0.70 drill |
| 7 | (3.5, -2.5) | Ø1.30, Ø0.70 drill |
| 8 | (1.5, -2.5) | Ø1.30, Ø0.70 drill |
| 9 | (-0.5, -2.5) | Ø1.30, Ø0.70 drill |
| MH1 | (-2.9, +1.0) | Ø4.23 pad, Ø2.82 drill, round |
| MH2 | (+9.9, +1.0) | Ø4.23 pad, Ø2.82 drill, round |
| MH3 | (+9.9, -3.0) | Ø3.375 pad, Ø2.25 drill, round |
| MH4 | (-2.9, -3.0) | Ø3.375 pad, Ø2.25 drill, round |
x' = x - 3.5, y' = y + 2.5:Table
| Area | Result |
|---|---|
| Pins 5–9 X/Y | Match datasheet. |
| Pins 1–4 X | Match datasheet. |
| Pins 1–4 Y | Current footprint gives +2.50 mm; datasheet requires +3.00 mm. USB2 row is 0.50 mm too close to USB3 row. |
| Row spacing | Current footprint uses 2.50 mm; datasheet requires 3.00 mm. |
| Shell leg X | Matches datasheet after translation. |
| Shell leg Y | Current footprint gives -0.50 mm and +3.50 mm; datasheet requires 0.00 mm and +4.00 mm. Shell pattern is shifted 0.50 mm relative to signal datum. |
| Shell geometry | Current footprint uses round holes/pads; datasheet specifies obround plated slots with much smaller 0.80 mm slot width and rectangular/obround lands. |
| Signal hole/pad sizes | Signal Ø0.70 drill and Ø1.30 land match datasheet, except pad 1 is rectangular instead of the circular land shown in the drawing. |
| Fab/body outline | Footprint fab outline dimensions approximately match 13.10 mm × 6.06 mm body callouts. |
| Courtyard | Datasheet does not specify an explicit courtyard; current courtyard cannot be directly validated against the datasheet. |
Unspecified.MH1–MH4; acceptable as mechanical hole identifiers, but they should be described as shield/shell solder legs.Solder; more specific through-hole solder termination metadata would be clearer if supported.Scope
Datasheet URL
Available Flux part metadata
Key datasheet specifications
Datasheet pin assignment vs Flux symbol
Symbol/pin-description findings
Footprint cross-check
Datasheet reference PCB layout
Current Flux/KiCad footprint
Mismatch summary
Major footprint mismatches
Symbol/property mismatches or omissions
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