Part Review Mismatch
10151114-001TLF Part Review
10151114.pdf.10151114-001TLF against official Amphenol sources. Checked available metadata, schematic terminal set, PCB footprint pad set, and pin/terminal descriptions.Table
| Field | Project value / observation |
|---|---|
| Project name | 10151114-001TLF po9t |
| MPN | 10151114-001TLF |
| Manufacturer | Not explicitly set in project-level properties; footprint asset name indicates Amphenol |
| Designator prefix | J from indexed project metadata; terminal components individually use P |
| Description | Project context mentions B Manufacturer Recommendations 7.8 mm Amphenol ICC (FCI) |
| Datasheet URL | Was missing; updated to official Amphenol MXM 3.0 datasheet URL |
| Footprint asset | AMPHENOL_10151114-001TLF.kicad_mod |
| 3D model asset | 10151114-001TLF.step |
| BOM | No BOM parts reported by BOM inspection |
Table
| Spec | Official value |
|---|---|
| Manufacturer / series | Amphenol CS / Amphenol ICC MXM 3.0 connector |
| MPN | 10151114-001TLF |
| Lifecycle | Active |
| Type | PCIe MXM 3.0 storage/server connector, right-angle, surface-mount/card-edge socket |
| Contact count | 314 contacts / 314 pin per datasheet and product page |
| Pitch | 0.50 mm |
| Stack height | 5.0 mm |
| Profile/mechanical height note | Drawing includes 7.80 mm profile/side-view dimension; this is not the stated stack height |
| Plating | 30 µin gold contact area for 001 option; gold over nickel contact finish; solder area tin/gold-flash per source context |
| PCB thickness | 1.20 mm per product page |
| Current rating | Product page: 0.5 A; datasheet excerpt: 1.1 A min per pin for 8 power pins and 8 nearest ground pins |
| Data rate | Product page: 16 Gb/s; datasheet family supports PCIe high-speed requirements through Gen 5 except noted variants |
| Contact resistance | 30 mΩ max initially, 10 mΩ max change after environmental exposure |
| Durability | Product page: 60 mating cycles; datasheet excerpt: 50 cycles min |
| Materials | Copper alloy contacts/board locks; high-temperature thermoplastic UL94V-0 housing |
| Reflow note | Drawing notes housing withstands 260 °C peak for 10 s |
| Compliance | Product page indicates RoHS/REACH/low-halogen compliance |
278 schematic components, all generic Terminal components.P-numbered terminals plus E1–E4.P numbering spans P1 through P281, but skips P126 through P132.274 P-terminals + 4 E-terminals = 278 terminals.Pin Number, Pin Type: Passive, Part Type: Terminal, and Symbol Pin Position.Pin Description values were found on terminals.J designator.282 PCB pad nodes total.274 P pads, 4 E pads, plus SH1, SH2, and two unnamed mounting/hold-down pads.AMPHENOL_10151114-001TLF.kicad_mod.0.00035 x 0.002 with 0.0005 pitch increments. Interpreted as meter-scaled values, that corresponds to 0.35 mm x 2.00 mm pads and 0.50 mm pitch, matching the drawing's 0.35 mm pad width and 0.50 mm pitch.314 tails and gives detailed recommended PCB layout dimensions including 82.00 mm/85.00 mm spans, 0.50 mm pitch, 0.35 ±0.03 mm pad width, E pads, locating features, and keepout/mounting features.None; these should be intentionally named or documented if they are non-electrical/mechanical pads.7.8 mm, while the official Amphenol product page and datasheet identify this MPN as 5.0 mm stack height. The drawing does show a 7.80 mm mechanical/profile dimension, so this should be clarified: do not describe the part as a 7.8 mm stack-height connector unless a different variant/source proves that.10151114.pdf and the relevant MXM 3.0 mechanical/electrical specification.None mechanical pads and confirm whether SH1/SH2 should be shield/hold-down pads or non-electrical pads.5.0 mm stack height from the 7.80 mm mechanical height/profile dimension.Scope
Sources Used
Metadata Found in Project
Key Official Specs
Schematic Symbol Review
Schematic Mismatches / Risks
Footprint Review
Footprint Mismatches / Risks
Description / Package Mismatch
Overall Assessment
Recommended Fixes